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DeepCool LQ 360 AIO Liquid Cooler: High-Performance Cooling with Innovative Display The DeepCool LQ 360 AIO Liquid Cooler offers a compelling blend of robust cooling and innovative aesthetics, designed for users who demand both performance and visual flair from their PC components. Featuring a 360mm radiator, advanced pump technology, and a unique segment LCD screen, the LQ 360 aims to elevate the AIO cooling experience. Key Features: Powerful 360mm Radiator: The large 360mm radiator provides substantial surface area for heat dissipation, ensuring efficient cooling even for power-hungry CPUs under heavy load or during overclocking. 5th Generation Pump: DeepCool's 5th generation pump is engineered for enhanced performance and reliable coolant circulation, facilitating effective heat transfer. Anti-Leak Technology: DeepCool incorporates its patented Anti-Leak Technology to improve the overall durability and safety of the AIO, reducing the risk of leaks and system damage. Segment LCD Screen: A prominent feature of the LQ 360 is its unique segment LCD screen integrated into the pump housing, offering real-time monitoring of crucial system information. ARGB Lighting: Both the fans and the pump unit are equipped with addressable RGB lighting, allowing for customizable and synchronized lighting effects within your PC build. FD12 ARGB Fans: The included FD12 ARGB fans are designed to deliver a balance of static pressure for radiator fin penetration and airflow for efficient heat removal, while maintaining relatively quiet operation. Efficient Connectivity: A streamlined 8-pin one-to-three cable is used for fan and lighting connections, simplifying cable management within the case. Wide Socket Compatibility: The LQ 360 supports a range of current CPU sockets from both Intel and AMD, ensuring broad compatibility with modern processor platforms. Technical Specifications (Example): Radiator Size: 360mm Fan Type: 3x 120mm FD12 ARGB Fan Speed: 500~2150 RPM ±10% Fan Connector: 4-Pin PWM Pump Connector: 3-Pin Socket Compatibility: Intel: LGA 1700 / 1200 / 115x / 1851 AMD: AM5 / AM4 Noise Level (Fan): ≤32.9 dB(A) LCD Screen: Segment LCD Package Contents: DeepCool LQ 360 AIO Liquid Cooler Mounting Kit for Intel and AMD platforms Thermal Paste Necessary cables

Polartherm introduces the X-10, a new thermal paste with an excellent price-performance ratio, specifically developed for the experienced mainstream PC user. With a higher viscosity compared to the X-8, the X-10 is easy to apply, although it is recommended to use the included application aids. The advantage of this increased viscosity is that the thermal paste is less affected by the pump-out effect. The thermal conductivity of the X-10 is higher than that of the X-8, and it is recommended for processors with a TDP of over 70 watts. This covers Intel's Core i7/i9 and Core Ultra 7/9 processor series, as well as AMD's Ryzen 7 and 9 series.

EK-Pro CPU WB 4189 Rack – Nickel + Acetal Enterprise-Grade CPU Water Block for Intel® LGA 4189 – Rack-Optimized and 1U-Compatible The EK-Pro CPU WB 4189 Rack – Nickel + Acetal is a high-performance CPU water block designed specifically for Intel® LGA 4189 processors, optimized for 1U rack chassis. It’s built to deliver outstanding thermal performance, serviceability, and reliability, making it an ideal choice for enterprise-grade applications in dense server environments. To meet the increasing heat dissipation needs of modern CPUs, the water block features a nickel-plated pure copper cold plate, CNC-machined for maximum contact and efficiency. The top is crafted from durable black POM Acetal, while the hold-down bracket is made from laser-cut stainless steel, ensuring long-term mechanical integrity in continuous operation. The block includes four G1/8” side ports, allowing flexible and low-profile tubing arrangements — ideal for use in compact 1U server environments. Its refined internal design is engineered for high flow efficiency and stability, even in demanding rack-mounted systems. With no compromises on performance or build quality, the EK-Pro CPU WB 4189 Rack offers exceptional cooling, robust mounting, and enterprise-ready design. Technical Specifications: Dimensions (L × H × W): 113 × 78 × 22.2 mm Materials: Nickel-plated copper, stainless steel, POM Weight: 0.481 kg Ports: 4 × G1/8” Mounting method: T30 Torx Working pressure: 2,500 Pa Maximum working pressure: 30,000 Pa (with EK-Pro Pump Reservoir Manifold), otherwise 75,000 Pa Operating temperature range: 5 – 60 °C Compatibility: Intel® Xeon LGA 4189 Origin: Made in Slovenia – EU Enclosed: EK-Pro CPU WB 4189 Rack – Nickel + Acetal 2 × EK G1/8” plugs EK-Loop Multi Allen Key (6 mm, 8 mm, 9 mm) 1 × Torx T30 Key 1 × 5 mm Allen Key Thermal grease (1 g)

All new: Phobya's improved thermal pads with 7W/mK are able to match even high-end thermal compounds! These "XT" thermal pads are perfectly suited to equalize height differences and uneven spots on coolers and cooled elements. The very flexible structure and low hardness allow great adaptivity to the cooling surface even at low contact pressures. The thermal pad equalizes the effect of irregularities from microscopic scale to visible scratches etc. The surface of the pad is equipped with a protective foil which needs to be removed before use. The pads can be used on VRAM modules on graphics cards as well as on the VRM modules on a Mainboard or almost any other application where a high-performance thermal interface is desired. Even elements with large surfaces such as North- or Southbridge on a Mainboard are no problem for this thermal pad as it has great thermal conductivity. As basic equipment and spare parts these thermal pads should be a part of any cooling enthusiast's equipment! Technical specifications: Colour: White Dimensions: 120x20x0,5mm Thermal conductivity: 7 W/mk maximum bridgeable gap: 0,5 mm electrically non-conductive Extent of delivery: 1x Phobya thermal pad XT 7W/mK 0.5mm (120x20mm) for ramplex, innovatek, Mips, Koolance Data sheet to the thermal pads This product has been reviewed for you (by):Script-BaseFreeocen

All new: Phobya's improved thermal pads with 7W/mK are able to match even high-end thermal compounds! These "XT" thermal pads are perfectly suited to equalize height differences and uneven spots on coolers and cooled elements. The very flexible structure and low hardness allow great adaptivity to the cooling surface even at low contact pressures. The thermal pad equalizes the effect of irregularities from microscopic scale to visible scratches etc. The surface of the pad is equipped with a protective foil which needs to be removed before use. The pads can be used on VRAM modules on graphics cards as well as on the VRM modules on a Mainboard or almost any other application where a high-performance thermal interface is desired. Even elements with large surfaces such as North- or Southbridge on a Mainboard are no problem for this thermal pad as it has great thermal conductivity. As basic equipment and spare parts these thermal pads should be a part of any cooling enthusiast's equipment! Technical specifications: Colour: White Dimensions: 120x20x0,5mm Thermal conductivity: 7 W/mk maximum bridgeable gap: 1 mm electrically non-conductive Extent of delivery: 1x Phobya thermal pad XT 7W/mK 1mm (120x20mm) for ramplex, innovatek, Mips, Koolance Data sheet to the thermal pads This product has been reviewed for you (by): Script-Base Freeocen

All new: Phobya's improved thermal pads with 7W/mK are able to match even high-end thermal compounds! These "XT" thermal pads are perfectly suited to equalize height differences and uneven spots on coolers and cooled elements. The very flexible structure and low hardness allow great adaptivity to the cooling surface even at low contact pressures. The thermal pad equalizes the effect of irregularities from microscopic scale to visible scratches etc. The surface of the pad is equipped with a protective foil which needs to be removed before use. The pads can be used on VRAM modules on graphics cards as well as on the VRM modules on a Mainboard or almost any other application where a high-performance thermal interface is desired. Even elements with large surfaces such as North- or Southbridge on a Mainboard are no problem for this thermal pad as it has great thermal conductivity. As basic equipment and spare parts these thermal pads should be a part of any cooling enthusiast's equipment! Technical specifications: Colour: White Dimensions: 120x20x0,5mm Thermal conductivity: 7 W/mk maximum bridgeable gap: 1,5 mm electrically non-conductive Extent of delivery: 1x Phobya thermal pad XT 7W/mK 1.5mm (120x20mm) for ramplex, innovatek, Mips, Koolance Data sheet to the thermal pads This product has been reviewed for you (by): Script-Base Freeocen

The Eisschicht from Alphacool can, like other thermal pads, compensate for the irregularities of heat sinks and the elements to be cooled. But it has a great feature: The Eisschicht consists of thermal paste with an embedded mesh! This ensures that the performance of these pads is much more efficient than normal thermal pads, regardless of the low W/mK value. In addition, a better distribution and filling between the surfaces is achieved. This also results in better air displacement. Due to their soft consistency, there is also no pressure on components or solder joints. Nvidia also uses this kind of pads for the Founders Edition. The Eisschicht can be easily cut to the desired size and attached to heat sinks without slipping.As a basic component or spare part, thermal pads belong in every well-organized computer tinkering corner! Technical dataDimensions (L x W x H)100 x 100 x 0,5mmThermal conductivity3 W/mKElectrical ConductiveNoColorwhite

The Rise Ultra Soft are Alphacool's performance oriented solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Rise Ultra Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance.Better than standard thermal pads?The material of the Rise Ultra Soft heat thermal pads acts similar to thermal paste. The consistency of the pads prevents the highest components, such as voltage converters or VRMs, from being subjected to increased contact pressure from the cooler. In extreme cases, this pressure can cause PCBs to bend. The Rise Ultra Soft Pads fill unevenness much better, nestle better against the components and thus significantly increase the heat transfer between the cooler and the component.But that is not the only advantage!The special material also cannot dry out. Usually, the silicone of heat-conducting pads bleeds out over time. This makes them go hard and the performance of the pads drops rapidly after a certain point. This is not the case with the Rise Ultra Soft thermal pads. They can be used for a much longer period of time without significantly losing performance.Cutting to size? No problem!When cutting the heat-conducting pads to size, it is essential to leave the foil on the pads. This makes it easy to cut the pads to size with scissors. This is just as easy as cutting paper. The cut edges remain perfectly clean and do not fray.The Alphacool Rise Ultra Soft thermal pads offer better performance than standard thermal pads in many respects and are a perfect replacement for old or underperforming pads. Technical dataDimensions (L x W x H)100 x 100 x 0,5mmSpecific Gravitiy ASTM D7923,3 g/ccThermal Conductivity ASTM D54707.0 W/mKHardness ASTM 224025 Shore OOUseful Temperature-40 to +160 °CVolume Resistivity ASTM D2575,2x1013 Ohm-mDielectric Constant ASTM D1504,5 MHzDielectric Breakdown Voltage ASTM D1495,5 kV/mmFlame Rating UL E331100UL94 V0Weight18 gColorGrey

The Rise Ultra Soft are Alphacool's performance oriented solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Rise Ultra Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance.Better than standard thermal pads?The material of the Rise Ultra Soft heat thermal pads acts similar to thermal paste. The consistency of the pads prevents the highest components, such as voltage converters or VRMs, from being subjected to increased contact pressure from the cooler. In extreme cases, this pressure can cause PCBs to bend. The Rise Ultra Soft Pads fill unevenness much better, nestle better against the components and thus significantly increase the heat transfer between the cooler and the component.But that is not the only advantage!The special material also cannot dry out. Usually, the silicone of heat-conducting pads bleeds out over time. This makes them go hard and the performance of the pads drops rapidly after a certain point. This is not the case with the Rise Ultra Soft thermal pads. They can be used for a much longer period of time without significantly losing performance.Cutting to size? No problem!When cutting the heat-conducting pads to size, it is essential to leave the foil on the pads. This makes it easy to cut the pads to size with scissors. This is just as easy as cutting paper. The cut edges remain perfectly clean and do not fray.The Alphacool Rise Ultra Soft thermal pads offer better performance than standard thermal pads in many respects and are a perfect replacement for old or underperforming pads. Technical dataDimensions (L x W x H)100 x 100 x 1mmSpecific Gravitiy ASTM D7923,3 g/ccThermal Conductivity ASTM D54707.0 W/mKHardness ASTM 224025 Shore OOUseful Temperature-40 to +160 °CVolume Resistivity ASTM D2575,2x1013 Ohm-mDielectric Constant ASTM D1504,5 MHzDielectric Breakdown Voltage ASTM D1495,5 kV/mmFlame Rating UL E331100UL94 V0Weight40 gColorGrey

The Rise Ultra Soft are Alphacool's performance oriented solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Rise Ultra Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance.Better than standard thermal pads?The material of the Rise Ultra Soft heat thermal pads acts similar to thermal paste. The consistency of the pads prevents the highest components, such as voltage converters or VRMs, from being subjected to increased contact pressure from the cooler. In extreme cases, this pressure can cause PCBs to bend. The Rise Ultra Soft Pads fill unevenness much better, nestle better against the components and thus significantly increase the heat transfer between the cooler and the component.But that is not the only advantage!The special material also cannot dry out. Usually, the silicone of heat-conducting pads bleeds out over time. This makes them go hard and the performance of the pads drops rapidly after a certain point. This is not the case with the Rise Ultra Soft thermal pads. They can be used for a much longer period of time without significantly losing performance.Cutting to size? No problem!When cutting the heat-conducting pads to size, it is essential to leave the foil on the pads. This makes it easy to cut the pads to size with scissors. This is just as easy as cutting paper. The cut edges remain perfectly clean and do not fray.The Alphacool Rise Ultra Soft thermal pads offer better performance than standard thermal pads in many respects and are a perfect replacement for old or underperforming pads. Technical dataDimensions (L x W x H)50 x 50 x 3mmSpecific Gravitiy ASTM D7923,3 g/ccThermal Conductivity ASTM D54707.0 W/mKHardness ASTM 224025 Shore OOUseful Temperature-40 to +160 °CVolume Resistivity ASTM D2575,2x1013 Ohm-mDielectric Constant ASTM D1504,5 MHzDielectric Breakdown Voltage ASTM D1495,5 kV/mmFlame Rating UL E331100UL94 V0Weight28 gColorGrey

The Rise Ultra Soft are Alphacool's performance oriented solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Rise Ultra Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance.Better than standard thermal pads?The material of the Rise Ultra Soft heat thermal pads acts similar to thermal paste. The consistency of the pads prevents the highest components, such as voltage converters or VRMs, from being subjected to increased contact pressure from the cooler. In extreme cases, this pressure can cause PCBs to bend. The Rise Ultra Soft Pads fill unevenness much better, nestle better against the components and thus significantly increase the heat transfer between the cooler and the component.But that is not the only advantage!The special material also cannot dry out. Usually, the silicone of heat-conducting pads bleeds out over time. This makes them go hard and the performance of the pads drops rapidly after a certain point. This is not the case with the Rise Ultra Soft thermal pads. They can be used for a much longer period of time without significantly losing performance.Cutting to size? No problem!When cutting the heat-conducting pads to size, it is essential to leave the foil on the pads. This makes it easy to cut the pads to size with scissors. This is just as easy as cutting paper. The cut edges remain perfectly clean and do not fray.The Alphacool Rise Ultra Soft thermal pads offer better performance than standard thermal pads in many respects and are a perfect replacement for old or underperforming pads. Technical dataDimensions (L x W x H)50 x 50 x 2mmSpecific Gravitiy ASTM D7923,3 g/ccThermal Conductivity ASTM D54707.0 W/mKHardness ASTM 224025 Shore OOUseful Temperature-40 to +160 °CVolume Resistivity ASTM D2575,2x1013 Ohm-mDielectric Constant ASTM D1504,5 MHzDielectric Breakdown Voltage ASTM D1495,5 kV/mmFlame Rating UL E331100UL94 V0Weight19 gColorGrey

The Apex Soft are Alphacool's high-end solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Apex Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance. Better than standard thermal pads? The material of the Apex Soft heat thermal pads acts similar to thermal paste. The consistency of the pads prevents the highest components, such as voltage converters or VRMs, from being subjected to increased contact pressure from the cooler. In extreme cases, this pressure can cause PCBs to bend. The Apex Soft Pads fill unevenness much better, nestle better against the components and thus significantly increase the heat transfer between the cooler and the component. But that is not the only advantage! The special material also cannot dry out. Usually, the silicone of heat-conducting pads bleeds out over time. This makes them go hard and the performance of the pads drops rapidly after a certain point. This is not the case with the Apex Soft thermal pads. They can be used for a much longer period of time without significantly losing performance. Cutting to size? No problem! When cutting the heat-conducting pads to size, it is essential to leave the foil on the pads. This makes it easy to cut the pads to size with scissors. This is just as easy as cutting paper. The cut edges remain perfectly clean and do not fray. The Alphacool Apex Soft thermal pads offer better performance than standard thermal pads in many respects and are a perfect replacement for old or underperforming pads. Technical data L x W x H 100 x 100 x 1 mm Colour grey Specific Gravitiy ASTM D792 3,4 g/cc Thermal Conductivity ASTM D5470 11.0 W/mK Hardness ASTM 2240 72 Shore OO Useful Temperature -40 to +150 °C Volume Resistivity ASTM D257 1.0x1011 Ohm-m Dielectric Constant ASTM D150 7,2 MHz Dielectric Breakdown Voltage ASTM D149 14 kV/mm Flame Rating UL 94 V-0 Weight 40 g Download Datasheet PDF: Alphacool Apex Soft Thermal Pad 11W/mk 100x100x1mm

The Apex Soft thermal pads are Alphacool’s high-end solution in the field of thermal interface materials. Thanks to their outstanding properties, they can almost be compared to thermal paste. Apex Soft thermal pads conform much better to components, resulting in a significant improvement in cooling performance.The material used in Apex Soft pads behaves similarly to thermal paste. Its consistency prevents higher-standing components, such as voltage regulators or VRAMs, from being subjected to excessive mounting pressure from the cooler — which, in the worst case, could lead to PCB bending. Apex Soft pads fill surface irregularities more effectively and conform more closely to component shapes, which significantly enhances thermal transfer between the cooler and the hardware.The special material also does not dry out over time. Standard thermal pads often begin to bleed silicone over time, making them hard and drastically reducing their performance. This is not the case with Apex Soft pads. They can be used for much longer periods without a noticeable drop in performance.When cutting the pads to size, it’s important to leave the protective film on. This allows the pads to be easily cut with scissors — just like cutting paper. The cut edges remain clean and do not fray.Alphacool’s Apex Soft thermal pads offer significantly better performance than conventional thermal pads in many aspects and are the perfect replacement for old or underperforming pads. Technical data thermal padDimensions (L x W x H)100 x 100 x 1,0mmSpecific gravity (ASTM D792)3.2 g/ccThermal Conductivity14.0 W/mKHardness (ASTM D2240)80 Shore OOWorking temperature-40 to +150 °CVolume Resistance (ASTM D257)1.0x10^11 Ohm-mDielectric Breakdown Voltage (ASTM D150)6.8 MHzDensity (ASTM D792)3.6 g/cm³ (±10%)Dielectric breakdown (ASTM D149)13 kV/mmFlame Rating (UL 94)V-0Colorgrey

The Apex Soft are Alphacool's high-end solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Apex Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance. Better than standard thermal pads? The material of the Apex Soft heat thermal pads acts similar to thermal paste. The consistency of the pads prevents the highest components, such as voltage converters or VRMs, from being subjected to increased contact pressure from the cooler. In extreme cases, this pressure can cause PCBs to bend. The Apex Soft Pads fill unevenness much better, nestle better against the components and thus significantly increase the heat transfer between the cooler and the component. But that is not the only advantage! The special material also cannot dry out. Usually, the silicone of heat-conducting pads bleeds out over time. This makes them go hard and the performance of the pads drops rapidly after a certain point. This is not the case with the Apex Soft thermal pads. They can be used for a much longer period of time without significantly losing performance. Cutting to size? No problem! When cutting the heat-conducting pads to size, it is essential to leave the foil on the pads. This makes it easy to cut the pads to size with scissors. This is just as easy as cutting paper. The cut edges remain perfectly clean and do not fray. The Alphacool Apex Soft thermal pads offer better performance than standard thermal pads in many respects and are a perfect replacement for old or underperforming pads. Technical data L x W x H 120 x 20 x 1 mm Colour Grey Specific Gravitiy ASTM D792 3,4 g/cc Thermal Conductivity ASTM D5470 11.0 W/mK Hardness ASTM 2240 72 Shore OO Useful Temperature -40 to +150 °C Volume Resistivity ASTM D257 1.0x1011 Ohm-m Dielectric Constant ASTM D150 7,2 MHz Dielectric Breakdown Voltage ASTM D149 14 kV/mm Flame Rating UL 94 V-0 Weight 20 g Download Datasheet PDF: Alphacool Apex Soft Thermal Pad 11W/mk 2x 120x20x1mm

The Apex Soft are Alphacool's high-end solution in the range of thermal pads. Due to their outstanding properties, they can almost be compared to a thermal paste. The Apex Soft thermal pads nestle much better to components, which contributes to a significant improvement in cooling performance. Better than standard thermal pads? The material of the Apex Soft heat thermal pads acts similar to thermal paste. The consistency of the pads prevents the highest components, such as voltage converters or VRMs, from being subjected to increased contact pressure from the cooler. In extreme cases, this pressure can cause PCBs to bend. The Apex Soft Pads fill unevenness much better, nestle better against the components and thus significantly increase the heat transfer between the cooler and the component. But that is not the only advantage! The special material also cannot dry out. Usually, the silicone of heat-conducting pads bleeds out over time. This makes them go hard and the performance of the pads drops rapidly after a certain point. This is not the case with the Apex Soft thermal pads. They can be used for a much longer period of time without significantly losing performance. Cutting to size? No problem! When cutting the heat-conducting pads to size, it is essential to leave the foil on the pads. This makes it easy to cut the pads to size with scissors. This is just as easy as cutting paper. The cut edges remain perfectly clean and do not fray. The Alphacool Apex Soft thermal pads offer better performance than standard thermal pads in many respects and are a perfect replacement for old or underperforming pads. Technical data L x W x H 120 x 20 x 1 mm Colour Grey Specific Gravitiy ASTM D792 3,2 g/cc Thermal Conductivity ASTM D5470 14.0 W/mK Hardness ASTM 2240 80 Shore OO Useful Temperature -40 to +150 °C Volume Resistivity ASTM D257 1.0x1011 Ohm-m Dielectric Constant ASTM D150 6,8 MHz Dielectric Breakdown Voltage ASTM D149 13 kV/mm Flame Rating UL 94 V-0 Weight 20 g Download Datasheet PDF: Alphacool Apex Soft Thermal Pad 14W/mk 2x 120x20x1mm

Wärmeleitpaste auf Aluminiumoxid-Basis, Anwendungsbereich zwischen -150 °C und 350 °C, 1,5 g Füllmenge, elektrisch nichtleitend

Wärmeleitpaste auf Aluminiumoxid-Basis, Anwendungsbereich zwischen -150 °C und 350 °C, 5,5 g Füllmenge, elektrisch nichtleitend

Alphacool's entry into the thermal compound market: Alphacool Silver Grease! Everyone needs thermal compound when assembling or working on a system. Of course only the best should be used for the finished system, but the cost of the thermal compound also needs to be considered. Especially when using expensive thermal compounds, things can get rather expensive when just testing a few different set-ups. This is where the new Alphacool Silver Grease is the ideal alternative: For some this is an affordable stock of thermal compound, for others this is the source for new ideas where expensive thermal compound is no longer an obstacle. Shipped in a 0.5g syringe and at this price this is the perfect item to always have a few of at home! The silicone-based thermal compound also contains silver particles, ensuring good thermal transfer whilst not being electrically conductive. Technical specifications: Content: 0.5g Material: Silver particles, silicone Colour: Grey electrically non-conductive no separation of the contents Suitable for high contact pressures Conforms with RoHS regulations Extent of delivery: 1x Syringe This product has been reviewed for you: Powerbase

AGHP technology: 4 x 6 mm heatpipes use AGHP technology, solve the inverse gravitational effect caused by vertical/horizontal alignment, CPU cooler TDP up to 95 W, the cooling effect of the CPU cooler is also doubled by the process of secondary welding of heat pipes and fins 36 mm height: the AXP90 X36 black low-profile cooler, combined with a 92 mm PWM fan for automatic temperature control and ultra-quiet operation, and a total height of only 36 mm, makes it ideal for HTPC, ITX and small models with a small CPU cooler without memory limit. 【Wide Compatibility】The heatsink supports CPU slots: Intel: LGA1700/1150/1151/1155/1156/1200; AMD/AM4/AM5, for different platforms, the heatsink is equipped with the corresponding metal fasteners, which can be installed in conjunction with the manual or installation video. CPU cooler specifications: CPU cooling size: 94.5 x 95 x 36 mm, matched fan: TL-9015B, air volume: 42.58CFM (MAX), air pressure: 1.33 mm H2O (max), speed: 2700RPM ± 10%, noise: 22.4 dB (A), fan pin: 4 pin PWM, cooler material: Aluminium The included thermal paste can achieve a good cooling effect and improve the heat transfer of the CPU.

with 120 mm PWM fan, three copper heatpipes, good cooling performance with 125 W TDP, for AMD and Intel sockets Three 6 mm heatpipes dissipate heat efficiently A 120 mm PWM fan delivers up to 94,5 m³/h High speed of up to 2.000 at max. 26,7 dB(A) For many common sockets from Intel and AMD The Aerocool Verkho 3 Plus: Efficient CPU cooling with a colorful touch The three 6 mm copper heatpipes are pressed directly onto the CPU, allowing them to absorb heat directly from the processor and then transfer it without detours to the countless aluminum fins. This process ensures very good cooling with conventional thermal paste. The pre-installed 120 mm PWM fan, with a strong airflow of up to 94,5 m³/h through the fine aluminum fins, ensures fast and efficient heat dissipation. Despite its good cooling performance of 125 Watt TDP, the fan is quiet and operates at max. 26,7 dB(A) when rotating at a maximum of 2.000 rpm. In addition to its performance, the Aerocool Verkho 3 Plus also shines with its now even further expanded compatibility. With its mounting system, it offers simple and secure installation on sockets 1200, 1150, 1151, 1155, 1156, 775, AM4, AM3(+), AM2(+) as well as FM1 and FM2 from AMD and Intel. Technical details: Dimensions: 125 x 78 x 134 mm (W x H x D) Material: Copper (cooler base, heatpipes), aluminum (fins, cover plate) Color: Black, Silver, Blue Heatpipes: 3x Ø 6 mm TDP: 125 W Fan: Bearing: Hydraulic Type: 1x 120 mm PWM Dimensions: 120 x 25 x 120 mm (W x H x D) Noise level: 18,2 - 26,7 dB(A) Speed: 1.000 - 2.000 rpm Airflow: 49,4 - 94,5 m³/h Static pressure: 0,78 - 1,24 mmH2O Fan connector: 4-pin PWM MTBF: 60.000 hours Compatibility: Intel: LGA 1700 1200, 115x, 755 AMD: AM5 AM4, AM3+, AM3, AM2+, AM2, FM2, FM1

Compact CPU cooler with 120 mm PWM fan, two copper heatpipes, good cooling performance with 115 W TDP, for AMD and Intel sockets A compact CPU cooler for complete systems or small cases Two 6 mm heatpipes dissipate heat efficiently A 120 mm PWM fan delivers up to 94.5 m³/h High speed of up to 2,000 at a maximum of 26.7 dB(A) For many common sockets from Intel and AMD The Aerocool Verkho 2 Plus: Efficient CPU cooling with a colorful touch The two 6 mm copper heatpipes are pressed directly onto the CPU, allowing them to absorb heat directly from the processor and then transfer it without detours to the countless aluminum fins. This process ensures very good cooling with conventional thermal paste. The pre-installed 120 mm PWM fan provides a strong airflow of up to 94.5 m³/h through the fine aluminum fins for fast and efficient heat dissipation. Despite its good cooling performance of 115 Watt TDP, the fan is quiet and operates at a maximum of 26.7 dB(A) when rotating at up to 2,000 rpm. In addition to its performance, the Aerocool Verkho 2 Plus also impresses with its now further expanded compatibility. With its mounting system, it offers simple and secure installation on sockets 1200, 1150, 1151, 1155, 1156, 775, AM4, AM3(+), AM2(+) as well as FM1 and FM2 from AMD and Intel. Technical details: Dimensions: 125 x 72 x 140 mm (W x H x D) Material: Copper (cooler base, heatpipes), aluminum (fins, cover plate) Color: Black, silver, blue Heatpipes: 2x Ø 6 mm TDP: 115 W Fan: Bearing: Hydraulic Type: 1x 120 mm PWM Dimensions: 120 x 25 x 120 mm (W x H x D) Noise level: 18.2 - 26.7 dB(A) Speed: 1,000 - 2,000 rpm Airflow: 49.4 - 94.5 m³/h Static pressure: 0.78 - 1.24 mmH2O Fan connector: 4-pin PWM MTBF: 60,000 hours Compatibility: Intel: LGA 1700 1200, 115x, 755 AMD: AM5 AM4, AM3+, AM3, AM2+, AM2, FM2, FM1

• Resealable storage bag for convenient usage and storage • Highly durable for long-lasting use of up to 8 years • High viscosity allows for easy application • Nanotechnology improves heat conduction • Non-electric conductive materials ensure safe usage • Low evaporation point and high temperature tolerance • Spreader allows for quick and easy application • Comes with 2 grams of thermal paste

• Thermal paste 8.5 W/m·K • 3.25 g/cm³ • Constitutive ingredients: Carbon, Metal oxide, Silicone • 1 pc(s)

Tool for heat spreader removal and reinstallation for Intel Kaby Lake-S, Skylake-S und Coffee Lake-S processors. Dr. Delid can be used for delidding of Skylake and Kaby Lake processors as well as precise reinstallation of the heat spreader after exchange of the thermal interface material (thermally conductive paste). During heat spreader removal, the heat spreader is rotated against the CPU base. This prevents damage of the thin PCB of the processor as the force is distributed to all four sides of the CPU - opposed to only one side when using tools with a sliding mechanism. The heat spreader is removed without jolt or excessive force.The black base part of the PROFESSIONAL version is made from anodized aluminum with great surface hardness instead of acetal used for the standard version. Heat spreader removal processAqua Computer's no. 1 priority: Prevention of CPU damage 1. The processor is inserted into an exact, CNC machined recess in the aluminum base. The base of the PROFESSIONAL version is made from a high strength aluminum alloy and anodized in black color for maximum durability. 2. Before the actual removal process, the CPU is locked in place. The tool can be handled without risk of the CPU dropping from the tool. 3. The removal process is facilitated by rotating the hexagon socket screw by hand using the supplied wrench. A mechanical stop limits the rotation of the heat spreader in the tool. 4. During the removal process, the heat spreader is secured in the tool. It can not hit the CPU die by accident. 5. After removal of the heat spreader, an aperture in the tool allows to lift the CPU from the tool without touching the gold contacts. Reinstallation of the heat spreaderAfter cleaning the CPU and application of new thermal grease, insert the CPU into the tool again. Dr. Delid can be used for precise installation of the heat spreader: 1. A stainless steel frame for heat spreader alignment is inserted into a recess in the tool. The heat spreader can now be inserted into the frame, resulting in perfect alignment to the CPU. The heat spreader can be installed with glue (for instance silicone or polyurethane). 2. A stainless steel bracket supplied with the tool can be used to apply slight pressure to the center of the heat spreader, until the glue is cured. A knurled screw made from polyamide prevents damage to the heat spreader. Scope of delivery Tool with stainless steel inserts Hexagon socket wrench Please note: CPU is not included in delivery!Tool is not compatible to CPUs of the Kaby Lake-X, Skylake-X, Skylake-W und Skylake-SP series.

The cuplex kryos NEXT marks a new milestone in CPU water block development. Every detail has been analyzed, optimized and tested to achieve perfection in cooling performance, installation procedure and product features. The result is not just a CPU water block with outstanding performance - it is a product series with various models differing in color and functionality. The VARIO models are the first CPU water blocks globally to incorporate a real-time adjustable base - never before has it been possible to adjust the geometry of a CPU block to perfectly fit the CPU while the PC is in operation. Models with VISION module are equipped with modern electronics: High resolution OLED display, integrated water temperature sensor and USB interface are just three of the features. Base part with micro structureThe base part of the cuplex kryos NEXT is equipped with an extremely fine micro structure, the structural width is lower than 200 µm. The coolant is injected centrally through a slot-shaped nozzle and then runs to both sides of the structure. The base itself is manufactured from copper, nickel plated copper or .925 sterling silver depending on model. Retention systemThe cuplex kryos NEXT retention system consists of 2.5 mm thick stainless steel plates equipped with nickel plated spring cups. Springs and knurled screws secure the water block on the motherboard, the retention system has a very clean look when installed. All retention system versions feature a mechanical stop for optimum clamping force and even force distribution. The knurled screws can be installed by hand, additionally a hexagon socket wrench can be used for easy installation. Water blocks for socket 115x or AM3 include a steel back plate with silicone insulation to stabilize the CPU region of the motherboard. Socket 2011 or AM4 motherboards already include a back plate as part of the CPU socket, therefore no additional back plate is required.For optimum performance, every cuplex kryos NEXT ships with outstanding thermal compound. A syringe with 0.5 grams of Thermal Grizzly Kryonaut is included, complete with plastic spatula. This compound has a high thermal conductivity and spreads out thin and evenly between CPU and water block due to its low viscosity. The amount is sufficient for approximately five applications. Color variantsThe top part of the water block is available in various materials and coatings:Acetal black: Shiny black high-tech plasticAcrylic glass: Transparent body suitable for illuminationCopper: Reddish glossNickel plated brass: Bright metallic glossPVD plated brass: High quality multi layer coating, dark metallic gloss Material combinationAcetal/copper: Top part black acetal, base copper Technical details Dimensions: Socket AM4: 111 x 75 x 22 mm (not including screws) Connection threads: G1/4 Distance between threads: 28 mm Scope of delivery Water block Mounting material (screws, springs, etc.) Thermal compound Thermal Grizzly Kryonaut, approx. 0.5 grams in syringe Plastic spatula Instruction manual Reviews TechPowerUp ComputerBase Cooling Technique Thermalbench Overclockers.com Review Studio Hardwareoverclock.com

EK Water Blocks EK-Quantum Velocity2 D-RGB - AM5 Nickel + Satin Titanium – CPU water block for custom loops EK Water Blocks EK-Quantum Velocity2 D-RGB - AM5 Nickel + Satin Titanium is a CPU water block for custom loops. Coolant is guided through a fine micro-fin structure directly above the processor, so waste heat is transferred quickly into the loop. The cold plate is CNC-machined from nickel-plated electrolytic copper. The dimensions are - 89x113,5x34 mm. Key Features EK-Matrix7 standard: Port positions and dimensions follow the EK-Matrix7 grid, so tubing can be routed straight and in alignment. Addressable D-RGB lighting: Connects to a 3-pin 5V D-RGB header and works with the common motherboard sync technologies. Nickel-plated surface: The nickel plating protects the base material and provides an even, long-lasting appearance. iF Design Award: The product series has been honoured with the iF Design Award. Fine cooling structure: The dense fin structure increases the transfer area above the processor heat spreader. Copper cold plate: The CNC-machined copper base ensures rapid heat transfer. Low-effort installation: The supplied mounting mechanism is designed for straightforward installation. Technical Specifications TypeEK Water Blocks EK-Quantum Velocity2 D-RGB - AM5 Nickel + Satin Titanium ManufacturerEK Water Blocks Manufacturer P/N3831109861684 SeriesEK-Quantum Velocity² FinishSatin Titanium Cable Length50 cm Dimensions- 89x113,5x34 mm ThreadG1/4" ManufacturingMade in Slovenia – Europe Scope of Delivery EK-Quantum Velocity² CPU EK-Loop Thermal Paste NGP Important notes Do not run together with aluminium components in the same loop – mixing different metals causes corrosion. Use coolants containing corrosion, scale and biological inhibitors to avoid damaging the nickel-plated surfaces. With EK Water Blocks EK-Quantum Velocity2 D-RGB - AM5 Nickel + Satin Titanium you integrate your processor into the loop with strong performance.

The Akasa AK-CC1113BP01 CPU cooler is designed for users of compact PC systems who need a quiet and efficient cooler for AMD AM4 and AM5 sockets. It combines a low-profile design with solid cooling performance and simple installation. 95 mm PWM fan with ball bearing – ensures quiet operation and long lifespan. Copper core in heatsink – enhances heat transfer for stable temperatures. Screw mounting with springs – provides secure hold and even pressure. Only 55 mm in height – ideal for Mini-ITX and small-form-factor cases. Pre-applied thermal paste – saves time and makes installation easier. Efficient cooling performance in a compact format Thanks to the copper core and aluminum fins, heat is reliably dissipated from the processor. The PWM-controlled 95 mm fan automatically adjusts its speed and offers a good balance of performance and low noise. Space-saving design for small systems With a height of just 55 mm, the cooler is perfect for slim cases and systems with limited space. The sleek design allows flexible integration without blocking other components. Easy and secure installation The installation uses a screw mounting bracket with springs for stable attachment. The pre-applied thermal paste shortens the installation process and ensures optimal contact between CPU and cooler.