Patriot’s Memory for Ultrabook™ SODIMM modules are the perfect, no hassle upgrade for any Ultrabook™ class notebook. Compatible with with Intel’s® 3rd generation mobile processors and running at just 1.35 volts, these SODIMM modules are optimized for ultra low power consumption providing extremely efficient performance.
Low Voltage, High PerformanceRequired only 1.35V, the G.SKILL low voltage SO-DIMM memory kit consumes less power and generates less heat. It is the perfect memory solution to extend your laptop's battery life and enhance the stability due to lower temperature.DDR3 1.5V SupportDoes your system only support DDR3 1.5V SO-DIMM? No problem! G.SKILL 1.35V SO-DIMM kit is also compatible with systems that support DDR3 1.5V!Boost The Performance Of Your Laptop MachinesWant to speed up your laptop? G.SKILL SO-DIMM memory is here to help! You will feel the speed upgrade instantly no matter if you are gaming, programming, multimedia editing or just surfing around the web! It is one of the smartest and most cost-effective ways to enhance your productivity and computing experience on your laptop!The Best In Class QualityEvery G.SKILL SO-DIMM memory kit is 100% validated with G.SKILL rigorous burn-in tests. It ensures every kit delivers perfect stability, performance and quality for your laptop machine.Model name F3-1600C11D-16GSLCapacity 16 GB (2 x 8192 MB)Module amount 2 piecesplacement two-sidedDesign SO-DIMMType DDR3Connection 204-PinVoltage by 1.35 Voltage until 1.5 VoltageStandard DDR3-1600 (PC3-12800)TimingsCAS latency (CL) 11RAS-to-CAS delay (tRCD) 11RAS-Precharge time (tRP) 11Row-Active time (tRAS) 28
T-Force Vulcan Z's cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity - thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering a smooth gaming experience and an extreme performance without any lag.
