T-Force Vulcan Z's cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity - thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering a smooth gaming experience and an extreme performance without any lag.
HP 13L77AA. Komponent: Sülearvuti, Sisemälu: 8 GB, Mälu paigutus (moodulid x suurus): 1 x 8 GB, Sisemälu tüüp: DDR4, Mälu taktsagedus: 3200 MHz, Mälu kujutegur: 260-pin SO-DIMM
ThinkSystem TruDDR5 memory delivers trusted, tested, quality, performance, and reliability throughout the ThinkSystem portfolio. Lenovo uses high-quality industry-standard memory components sourced from Tier 1 DRAM suppliers. Only memory that meets these strict requirements are selected for memory in Lenovo servers. It is then compatibility tested and tuned on every ThinkSystem server to maximize reliability.In addition, Lenovo memory DIMMs for servers have a unique signature programmed into them so your system can verify that TruDDR5 memory is installed in your system. Together with lower power consumption, these DIMMs can provide a low TCO for data centers.
Vengeance Low Profile heat spreaders have a reduced height of 1.03". They're designed for high-performance systems with extra-large CPU coolers, small form factor system builds, or any other space-constrained application where you need high-performance memory but standard Vengeance modules might not fit.