GeForce RTX™ 5070 Infinity 3 OverviewSpecificationsDownloadGalleryYouTube A New Era of SFF Power: The Infinity 3 Series SFF builds are gaining popularity for good reasons. They save space, reduce clutter, and offer more portability. The Palit GeForce RTX™ 5070 Infinity 3 Series is designed with this goal in mind – to deliver the power of a high-end GPU within a form factor that fits into compact PC cases.
GeForce RTX 5060 WINDFORCE MAX OC 8G Powered by the NVIDIA Blackwell architecture and DLSS 4 Powered by GeForce RTX 5060 Integrated with 8GB GDDR7 128bit memory interface WINDFORCE cooling system: Hawk fan; Server-grade Thermal conductive gel Reinforced structure The WINDFORCE cooling system delivers exceptional thermal performance through a combination of cutting-edge technologies. It features server-grade thermal conductive gel, innovative Hawk fans with alternate spinning, composite copper heat pipes, a copper plate, 3D active fans, and screen cooling. HAWK FANThe Hawk Fan features a unique blade design inspired by the aerodynamics of an eagle's wing. This design reduces air resistance and noise levels, resulting in up to a 53.6% increase in air pressure and a 12.5% increase in air volume without compromising acoustics. ALTERNATE SPINNINGReduce the turbulence of adjacent fans and increase airflow pressure. 3D ACTIVE FANThe 3D Active Fan provides semi-passive cooling, and the fans will remain off when the GPU is in a low load or low power game. SERVER-GRADE THERMAL CONDUCTIVE GELTo enhance product quality and reliability, we have introduced server-grade thermal conductive gel for cooling critical components such as VRAM and MOSFETs. This highly deformable, non-fluid gel provides optimal contact for uneven surface and effectively resists deformation from transport or long-term use, unlike traditional thermal pads. COPPER PLATE & COMPOSITE COPPER HEAT PIPEThe copper plate directly contacts the GPU, coupled with the composite copper heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink. SCREEN COOLINGExtended heatsink allows air to pass through, providing better heat dissipation. ULTRA DURABLE ULTRA COOLING - Lower RDS(on) MOSFETs are specially designed to produce lower switching resistance for faster electric current charging and discharging at extremely low temperature. LOW POWER LOSS - Metal Choke hold energy much longer than common iron-core chokes at high frequency, thus effectively reduce core energy loss and EMI interference. LONGER LIFE - Lower ESR Solid Capacitors ensure better electronic conductivity for excellent system performance and longer lifespan. FRIENDLY PCB DESIGNFully automated production process ensures top quality of the circuit boards and eliminates sharp protrusions of the solder connectors seen on the conventional PCB surface. This friendly design prevents your hands from getting cut or inadvertently damaging components when making your build.
