The high-performance thermal pads in the Thermal Grizzly Minus Pad series feature a highly elastic and flexible surface with excellent thermal conductivity, effectively compensating for even the smallest gaps between components. Available in various sizes and thicknesses. High thermal conductivity High compressibility Electrical insulation The easy-to-handle and flexible Minus Pads are composed of different materials, including a ceramic silicon compound and nano aluminum oxide. As a result, the pads ensure consistent, optimal heat transfer. They can be optimally attached with only the lightest touch. All pads are eco-friendly and RoHS compliant. Technical Data Temperature range: -100°C / +250°C Dimensions: 120 x 20 x 1.5 mm
The high performance thermal pads of the Thermal Grizzly Minus Pad series feature a highly elastic and flexible surface with excellent thermal conductivity, bridging even the smallest gaps between components. They are available in a range of different sizes and thicknesses. High thermal conductivity High compressibility Electrical insulation The easy-to-handle and flexible Minus Pads are composed of various constituents, based on a ceramic silicon compound and nano aluminum oxide. As a result, the pads provide consistent, optimal heat transfer. They are easy to apply with just a light touch. All pads are eco-friendly and RoHS-compliant. Technical Data Temperature range: -100°C / +250°C Dimensions: 120 x 20 x 2 mm
The high performance thermal pads of the Thermal Grizzly Minus Pad series feature a highly elastic and flexible surface with very high thermal conductivity, perfectly compensating even the smallest gaps between components. They are available in various sizes and thicknesses. High thermal conductivity High compressibility Electrical insulation The easy-to-process and flexible Minus Pads are made from different compounds, based on a complex ceramic silicone formula and nano aluminum oxide. This ensures a constant, optimal heat transfer. They can be attached optimally with the lightest touch. All pads are eco-friendly and RoHS-compliant. Technical Data Dimensions: 120 x 20 x 3mm Temperature Range: -100°C / +250°C
The Thermal Grizzly Minus Pad Advance is a high-performance thermal pad designed for optimal heat dissipation. Measuring 100 x 100 x 1.5 mm, this pad is perfect for a variety of cooling applications. Each package contains two pieces, ensuring you have the necessary components for effective thermal management. With a net weight of 0.108 kg, these pads are lightweight and easy to apply.
With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the previous Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use with memory chips or voltage regulators. It is based on a silicone-containing carrier complex and uses aluminum oxide as a heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, you should choose the thickness based only on the distance that needs to be bridged.
High-performance alternative to thermal paste With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use on memory chips or voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, the choice of thickness should only be based on the distance to be bridged.
With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Building on its predecessor, the Minus Pad 8, it has been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for situations where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. This makes it particularly suitable for use on memory chips or voltage regulators. It is based on a silicone-containing carrier complex and aluminum oxide as the thermal transfer medium, achieving a similar thermal conductivity to thermal paste. The Minus Pad is available in various sizes and thicknesses ranging from 0.5 to 3 millimeters. Since it performs optimally with minimal pressure and its thermal conductivity is barely affected by thickness, the selection of thickness should simply match the gap to be bridged.
