The Thermal Grizzly Minus Pad Pro is a highly efficient thermal pad designed for superior heat conductivity. Each pad measures 120 x 20 mm with a thickness of 0.5 mm, making it ideal for various cooling applications. The package includes two pieces, ensuring you have a spare for future use. With a net weight of 0.018 kg, it is lightweight and easy to handle, and it comes with a G24 warranty for added peace of mind.
The phase change material used in the PhaseSheet PTM is solid at room temperature. The material only starts to liquefy at temperatures above 45 degrees Celsius. For optimal distribution of the liquid PhaseSheet PTM and thus the thinnest possible layer, a high contact force of around 300-400N is required. PhaseSheet PTM has very low viscosity in its liquid state and contracts again when reverting to a solid, mitigating the pump-out effect. The pump-out effect is especially noticeable when a copper cooler is paired with a graphics chip, as silicon and copper expand to different extents when heated. Under load, the heat spreader and base plate may deform (concave or convex) and return to their original shape when cooled. This causes thermal paste to be slowly squeezed out, for example between the heat spreader and the CPU cooler’s base plate. PhaseSheet PTM is more durable than conventional thermal pastes, though not as long-lasting as, for example, KryoSheet, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM is achieved and stabilized after approximately ten thermal cycles at 60 degrees Celsius each. Brief information Outstanding thermal conductivity Consistently high performance Very high durability Versatile in application Not electrically conductive Easy to use Scope of delivery 1x PhaseSheet PTM
Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for modifying graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible replacement for thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to critical components Advance version with high thermal conductivity for more powerful components Safe to use thanks to its electrically insulating property The flexible alternative to thermal pads: The Thermal Grizzly Putty Advance Thermal Grizzly Putty is a non-electrically-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads with varying heights are used from the factory, so when replacing the pads or converting the cooler to a GPU water cooler, several different pads are needed. This problem is solved by the flexible applicability of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about a 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, usually a 30-gram jar is sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back, between the PCB and the backplate, larger graphics cards often have a consistent, larger gap between the two surfaces. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this gap. Three variants for different applications The manufacturer offers three different variants for every performance class. The Basic variant is suitable for efficient components that generate low heat. The Advance variant, on the other hand, is aimed at the midrange segment with more powerful components thanks to its higher thermal conductivity. For the high-end segment, Thermal Grizzly offers Putty Pro, which ensures optimal cooling for your high-end components thanks to its particularly high thermal conductivity. Flexible and safe use Before application, the target surface should be thoroughly cleaned and degreased, for example with cleaning wipes from Thermal Grizzly or common isopropanol. Thanks to its electrically insulating property, it can be applied over large areas with the supplied spatula. Alternatively, the Thermal Putty can be formed by hand into small pellets that can be adapted in size to the surface to be applied (e.g., VRAM, SMD).
Product Details: Thermal Grizzly - Advance TG Putty Advance is a non-electrically conductive gap filler designed as an alternative to traditional thermal pads. Its flexible and easy-to-apply formula compensates for height differences and is ideal for replacing pads on graphics cards, especially where varied pad thicknesses are needed. The putty can be applied using the included spatulas for smooth, even coverage, or shaped by hand (gloves recommended) into custom-sized beads for components like VRAM and SMDs, accommodating gaps from 0.2 mm to 3.0 mm. TG Putty Advance features good thermal conductivity and comes in a 30g jar, typically sufficient for upgrading a smaller graphics card or covering VRAM and VRM on one side of a larger card. Note: TG Putty is not suitable for direct application on processors or GPU chips, and surfaces should be clean and grease-free before use. 1x TG Putty Advance 3x Spatulas
Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for the modification of graphics cards and the replacement of thermal pads between PCBs and heatsinks. However, Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with versatile areas of application Especially suitable for heatsinks with varying distances to critical components Basic version with medium thermal conductivity for efficient components Safe to use due to electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Basic Thermal Grizzly Putty is a non-conductive alternative to traditional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is thus ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads of different heights are installed at the factory. When replacing these pads or modifying the cooler to a GPU water cooler, several different pads are needed. The flexible usability of Thermal Grizzly Putty solves this problem. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g. GeForce GTX 1060), approximately one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card like a GeForce RTX 4090, usually one 30-gram jar is sufficient for the memory (VRAM) and voltage converters (VRM) on the front. On the back, between the PCB and the backplate of larger graphics cards, there is often a uniformly larger gap between the two surfaces. To completely fill this gap, about two 30-gram jars or one 100-gram jar are needed. Three variants for different applications With three different variants, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components that produce little heat. The Advance version, with higher thermal conductivity, targets the mid-range segment with stronger components. For the high-end segment, Thermal Grizzly offers the Putty Pro, which ensures optimal cooling of your high-end components due to its excellent thermal conductivity. Flexible and safe application Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be applied over large areas using the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls that can be sized according to the surface being covered (e.g. VRAM, SMD).
Product Details: Thermal Grizzly - Basic TG Putty Basic is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Basic 3x Spatulas
Thermal Grizzly introduces the Thermal Putty series, a new product line specifically developed for upgrading graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putty can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to key components Pro-version with very high thermal conductivity for high-end components Safe to use thanks to its electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Pro Thermal Grizzly Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply, flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads in varying thicknesses are used from the manufacturer, so when replacing the pads or modifying the cooler to a GPU water cooler, you would need several different pads. This issue is solved by the flexible application of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? To upgrade a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, a 30-gram jar is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back side, between the PCB and the backplate of larger graphics cards, there is often a uniform, larger gap. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this space. Three versions for different applications With three different versions, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components with low heat generation. The Advance version, with higher thermal conductivity, is intended for midrange components with greater power. For the high-end segment, Thermal Grizzly offers Putty Pro, which provides optimal cooling for your high-end components thanks to its outstanding thermal conductivity. Flexible and safe to use Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be spread over large areas with the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls, which can be matched in size to the area to be covered (e.g., VRAM, SMD).
Product Details: Thermal Grizzly - Pro TG Putty Pro is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Pro 3x Spatulas
Thermal Hero GAMMA Phase Changer – Phase Change Thermal Interface Material (TIM) Experience a new era of cooling with the Thermal Hero GAMMA Phase Changer. This phase change thermal pad combines high thermal conductivity with excellent cooling performance, making it perfect for computers, PCs, electronics, gaming consoles, laptops, and graphics cards. High thermal conductivity through phase change More efficient heat transfer Self-adapts to the contact surface – perfect fit Clean application thanks to fast, adhesive coating on one side Consistent performance under variable load User-friendly and pressure-activated Thin material / low profile Includes cleaning wipe for easy surface preparation Cuttable, ideal for overclocking GAMMA is characterized by its unique ability to change from solid to semi-solid at operating temperatures above 44 °C. This phase change completely fills microscopic gaps and surface irregularities, ensuring optimal heat transfer and reliable cooling—especially under high thermal demands. Applications: CPUs and GPUs Heatsinks in PCs, laptops, and graphics cards Electronic components with high heat output Overclocking scenarios where maximum cooling is required Instructions for use: Use the adhesive side and prepare the surface cleanly (with the included cleaning wipe) Cut the pad to size and apply precisely Apply pressure to ensure even distribution
Thermal Hero GAMMA Phase Changer – Phase Change Thermal Interface Material (TIM) Discover a new era of cooling with the Thermal Hero GAMMA Phase Changer. This liquid thermal pad combines high thermal conductivity with excellent cooling performance and is perfectly suited for computers, PCs, electronics, gaming consoles, laptops, and graphics cards. High thermal conductivity through phase change More efficient heat transfer Self-adapts to contact surface – optimal fit Clean application thanks to fast, adhesive layer on one side Consistent performance under varying loads User-friendly and pressure-activated Low material thickness / slim profile Includes cleaning cloth for easy surface preparation Cuttable, ideal for overclocking GAMMA is characterized by its unique ability to change from solid to semi-solid at operating temperatures above 44 °C. This phase change completely fills microscopic gaps and surface irregularities, ensuring optimal heat transfer and reliable cooling—especially under high thermal loads. Applications: CPUs and GPUs Heatsinks in PCs, laptops, and graphics cards Electronic components with high heat output Overclocking scenarios that require maximum cooling performance Application instructions: Use the adhesive side and clean the surface (with the included cleaning cloth) Cut the pad and apply it precisely Activate with pressure to ensure even distribution
THERMAL HERO NEO 100 x 100 x 0.5 mm Thermal Hero NEO 100 x 100 x 0.5 mm – High thermal conductivity thermal pad for BASIC APPLICATIONS (CPU, GPU, laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of ease of use and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g. Xbox, PS3/4/5) as well as other electronics with moderate thermal requirements. The pads adhere quickly and are easy to install thanks to an adhesive layer on one side. Includes cleaning cloth, pressure-activated, and can be cut to size, making them flexible for different components. Wide range of thermal conductivities, suitable for various applications Shore hardness 20–40 (medium soft), easy to cut with scissors or a knife Suitable for overclocking editions and demanding cooling requirements
THERMAL HERO NEO 100 x 100 x 1.0 mm Thermal Hero NEO 100 x 100 x 1.0 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an outstanding combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g., Xbox, PS3/4/5), as well as other electronics with moderate thermal demands. The pads are quickly adhesive and easy to install thanks to an adhesive layer on one side. Includes cleaning cloth, pressure-activated, and can be cut to size, allowing you to adapt them flexibly to various components. Wide range of thermal conductivities, suitable for different applications Shore hardness 20–40 (medium-soft), easy to cut with scissors or a knife Suitable for overclocking editions and demanding cooling requirements
THERMAL HERO NEO 100 x 100 x 1.5 mm Thermal Hero NEO 100 x 100 x 1.5 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent strength and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of user-friendliness and performance. Ideal for basic applications such as CPUs, GPUs, laptops, and gaming consoles (e.g. Xbox, PS3/4/5), as well as other electronics with moderate cooling needs. The pads come with an adhesive layer on one side for quick stick-on and easy installation. Includes cleaning cloth, pressure-activatable, and cuttable to flexibly adapt to different components. Wide range of thermal conductivities available for different applications Shore hardness 20–40 (medium-soft), easily cut to size with scissors or a knife Suitable for overclocking editions and demanding cooling requirements
THERMAL HERO NEO 100 x 100 x 2.0 mm Thermal Hero NEO 100 x 100 x 2.0 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of user-friendliness and performance. Ideal for basic applications such as CPUs, GPUs, laptops, and gaming consoles (e.g., Xbox, PS3/4/5), as well as other electronics with moderate heat requirements. The pads have an adhesive layer on one side for quick adhesion and easy installation. They come with a cleaning cloth, are pressure-activated and can be cut to size, allowing you to flexibly adapt them to different components. Wide range of thermal conductivities, suitable for various applications Shore hardness 20–40 (medium soft), easy to cut with scissors or a knife Suitable for overclocking editions and demanding cooling requirements
THERMAL HERO NEO 100 x 100 x 3.0 mm Thermal Hero NEO 100 x 100 x 3.0 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g., Xbox, PS3/4/5), as well as other electronics with moderate thermal requirements. Thanks to an adhesive layer on one side, the pads adhere quickly and are easy to install. Includes cleaning cloth, pressure-activated and cuttable, allowing you to flexibly adapt them to different components. Wide range of thermal conductivities, suitable for different applications Shore hardness 20–40 (medium-soft), easy to cut with scissors or knife Suitable for overclocking editions and demanding cooling requirements
THERMAL HERO NEO 120 x 20 x 0.5 mm Thermal Hero NEO 120 x 20 x 0.5 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g., Xbox, PS3/4/5), as well as other electronics with moderate heat requirements. The pads feature an adhesive layer on one side for quick stick-on installation and are easy to apply. Includes cleaning cloth, pressure-activatable, and can be cut to size, making them flexible and adaptable for various components. Wide range of thermal conductivities available, suitable for different applications Shore hardness 20–40 (medium soft), easily cut with scissors or knife Suitable for overclocking editions and demanding cooling requirements
