Kõik hinnakirjad

Product Details: Thermal Grizzly - Basic TG Putty Basic is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Basic 3x Spatulas

Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for the modification of graphics cards and the replacement of thermal pads between PCBs and heatsinks. However, Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with versatile areas of application Especially suitable for heatsinks with varying distances to critical components Basic version with medium thermal conductivity for efficient components Safe to use due to electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Basic Thermal Grizzly Putty is a non-conductive alternative to traditional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is thus ideal as a replacement for thermal pads on graphics cards and other devices.⁣ Typically, several types of thermal pads of different heights are installed at the factory. When replacing these pads or modifying the cooler to a GPU water cooler, several different pads are needed. The flexible usability of Thermal Grizzly Putty solves this problem. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g. GeForce GTX 1060), approximately one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card like a GeForce RTX 4090, usually one 30-gram jar is sufficient for the memory (VRAM) and voltage converters (VRM) on the front. On the back, between the PCB and the backplate of larger graphics cards, there is often a uniformly larger gap between the two surfaces. To completely fill this gap, about two 30-gram jars or one 100-gram jar are needed. Three variants for different applications With three different variants, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components that produce little heat. The Advance version, with higher thermal conductivity, targets the mid-range segment with stronger components. For the high-end segment, Thermal Grizzly offers the Putty Pro, which ensures optimal cooling of your high-end components due to its excellent thermal conductivity. Flexible and safe application Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be applied over large areas using the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls that can be sized according to the surface being covered (e.g. VRAM, SMD).

Thermal Grizzly introduces the Thermal Putty series, a new product line specifically developed for upgrading graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putty can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to key components Pro-version with very high thermal conductivity for high-end components Safe to use thanks to its electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Pro Thermal Grizzly Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply, flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices.⁣ Typically, several types of thermal pads in varying thicknesses are used from the manufacturer, so when replacing the pads or modifying the cooler to a GPU water cooler, you would need several different pads. This issue is solved by the flexible application of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? To upgrade a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, a 30-gram jar is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back side, between the PCB and the backplate of larger graphics cards, there is often a uniform, larger gap. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this space. Three versions for different applications With three different versions, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components with low heat generation. The Advance version, with higher thermal conductivity, is intended for midrange components with greater power. For the high-end segment, Thermal Grizzly offers Putty Pro, which provides optimal cooling for your high-end components thanks to its outstanding thermal conductivity. Flexible and safe to use Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be spread over large areas with the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls, which can be matched in size to the area to be covered (e.g., VRAM, SMD).

The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses. High thermal conductivity High compressibility Electrical insulation The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide. Thus, the pads ensure a constant, optimal heat transfer. The lightest of touches is enough to attach them optimally. All pads are ecofriendly and RoHS-compliant. Technical Data Temperature range: -100°C / +250°C Dimensions: 120 x 20 x 1mm

Grey

These self-adhesive thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x0,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 0,5mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 0,5mm (120x20mm) for ramplex, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.>

This thermal padd is very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x1,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1,5mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 1,5mm (120x20mm) for ramplex, innovatek, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.