The Thermal Grizzly Minus Pad Pro is a highly efficient thermal pad designed for superior heat conductivity. Each pad measures 120 x 20 mm with a thickness of 0.5 mm, making it ideal for various cooling applications. The package includes two pieces, ensuring you have a spare for future use. With a net weight of 0.018 kg, it is lightweight and easy to handle, and it comes with a G24 warranty for added peace of mind.
Product Details: Thermal Grizzly - Pro TG Putty Pro is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Pro 3x Spatulas
Product Details: Thermal Grizzly - Advance TG Putty Advance is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Advance 3x Spatulas
Product Details: Thermal Grizzly - Basic TG Putty Basic is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Basic 3x Spatulas
TG Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences, making it ideal as a replacement for thermal pads on GPUs. Graphics cards typically feature several types of thermal pads of varying thicknesses from the factory, requiring different pads during replacement or when converting the cooler to a GPU water cooler. The application of TG Putty is performed using the included spatulas, which also enable large-area application. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. For modifying a single, smaller graphics card without an active backplate (e.g., GeForce GTX 1060), approximately one 30-gram container of TG Putty is required. For larger graphics cards, such as a GeForce RTX 4090, one 30-gram container is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the backside, there is often a uniform, larger gap between the PCB and the backplate on larger graphics cards. In this case, approximately two 30-gram containers are needed to completely fill this gap. Notes: TG Putty is not suitable for use on processors (IHS or Direct Die) or directly on the GPU die! Before application, the target surface should be thoroughly cleaned and degreased, for example, using TG Cleaning Wipes or conventional isopropanol.
The high performance thermal pads of the Thermal Grizzly Minus Pad series consist of a very elastic and flexible surface area with very high thermal conductivity, compensating for even the smallest of gaps between components. Available in a variety of different sizes and thicknesses. High thermal conductivity High compressibility Electrical insulation The easy to process and flexible minus pads are made up of different constituents, based on a ceramic silicon formula complex and nano aluminum oxide. Thus, the pads ensure a constant, optimal heat transfer. The lightest of touches is enough to attach them optimally. All pads are ecofriendly and RoHS-compliant. Technical Data Temperature range: -100°C / +250°C Dimensions: 120 x 20 x 1mm
thermal pad 0.5mm (120x20mm) for ramplex, innovatek, Mips, Koolance
Tootekood: 19041GTIN: 4049469054038Thermal Pads
These self-adhesive thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x0,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 0,5mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 0,5mm (120x20mm) for ramplex, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.>
thermal pad 1.5mm (120x20mm) for ramplex, innovatek, Mips, Koolance
Tootekood: 19060GTIN: 4049469079994Thermal Pads
This thermal padd is very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x1,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1,5mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 1,5mm (120x20mm) for ramplex, innovatek, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.
These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 100x100x0,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 0,5mm Electrically non-conductive Extent of delivery: 1x thermal pad 100x100x0,5mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>
These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 100x100x1mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1mm Electrically non-conductive Extent of delivery: 1x thermal pad 100x100x1mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>
These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technische Daten: Abmaße: ca. 15x15mm Stärke: variablel von ca. 0,5 bis 1,5mmmaximal zu überbrückender Luftspalt: 1 mmelektrisch nicht leitfähig Lieferumfang: 1x Wärmeleitpad 1mm ( 15x15mm)Hinweis: Diese Wärmeleitpads können bis zur Hälfte ihrer Höhe zusammengepresst werden.
These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 15x15x5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 5mm Electrically non-conductive Extent of delivery: 1x thermal pad 15x15x5mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>
These self-adhesive thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x1mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 1mm (120x20mm) for ramplex, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.
These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 30x30x0,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 0,5mm Electrically non-conductive Extent of delivery: 1x thermal pad 30x30x0,5mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>
These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 30x30x1,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1mm Electrically non-conductive Extent of delivery: 1x thermal pad 30x30x1,5mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>
