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THERMAL HERO NEO 120 x 20 x 1.5 mm THERMAL HERO NEO 120 x 20 x 1.5 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent hardness and pressure distribution Long-term stability Electrical insulation User friendliness Reliable performance THERMAL HERO NEO thermal pads provide an excellent combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g., Xbox, PS3/4/5) as well as other electronics with moderate thermal requirements. The pads are quickly adhesive and easy to install thanks to an adhesive layer on one side. Includes cleaning cloth, pressure-activated, and cuttable, allowing you to flexibly adapt them to different components. Wide selection of thermal conductivities to suit different applications Shore hardness 20–40 (medium soft), easily cut with scissors or knife Suitable for overclocking editions and demanding cooling requirements

THERMAL HERO NEO 120 x 20 x 2.0 mm Thermal Hero NEO 120 x 20 x 2.0 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an outstanding combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g., Xbox, PS3/4/5), as well as other electronics with moderate thermal requirements. The pads have an adhesive layer on one side for quick attachment and easy installation. Includes cleaning cloth, pressure-activated, and can be cut to size so you can flexibly adapt them to various components. Wide range of thermal conductivities to suit different applications Shore hardness 20–40 (medium-soft), easily cut with scissors or knife Suitable for overclocking editions and demanding cooling requirements

THERMAL HERO NEO 120 x 20 x 3.0 mm Thermal Hero NEO 120 x 20 x 3.0 mm – High thermal conductivity thermal pad for BASIC APPLICATIONS (CPU, GPU, laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads provide an excellent combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g., Xbox, PS3/4/5) as well as other electronics with moderate thermal requirements. The pads feature an adhesive layer on one side for quick attachment and easy installation. Includes cleaning wipe, pressure-activated, and cuttable so you can flexibly adapt them to different components. Wide range of thermal conductivities, suitable for different applications Shore hardness 20–40 (medium-soft), easy to cut with scissors or a knife Suitable for overclocking editions and demanding cooling requirements

THERMAL HERO NEO 30 x 30 x 0.5 mm Thermal Hero NEO 30 x 30 x 0.5 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops and gaming consoles (e.g. Xbox, PS3/4/5) as well as other electronics with moderate thermal requirements. The pads are quick to adhere and easy to install thanks to an adhesive layer on one side. Includes cleaning cloth, pressure-activated and easy to cut, so you can flexibly adapt them to different components. Wide range of thermal conductivities available for different applications Shore hardness 20–40 (medium-soft), easily cut with scissors or knife Suitable for overclocking editions and demanding cooling requirements

THERMAL HERO NEO 30 x 30 x 1.0 mm Thermal Hero NEO 30 x 30 x 1.0 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of user-friendliness and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and game consoles (e.g., Xbox, PS3/4/5) as well as other electronics with moderate thermal requirements. The pads feature an adhesive layer on one side for quick sticking and easy installation. Includes cleaning cloth, pressure-activated, and can be cut to size so you can flexibly adapt them to various components. Wide range of thermal conductivities, suitable for different applications Shore hardness 20–40 (medium-soft), easy to cut with scissors or a knife Suitable for overclocking editions and demanding cooling requirements

THERMAL HERO NEO 50 x 50 x 2.0 mm Thermal Hero NEO 50 x 50 x 2.0 mm – High Thermal Conductivity Thermal Pad for BASIC APPLICATIONS (CPU, GPU, Laptops, Xbox, PS3/4/5) Enhanced thermal conductivity Easy installation Consistent firmness and pressure distribution Long-term stability Electrical insulation User-friendly Reliable performance Thermal Hero NEO thermal pads offer an excellent combination of ease of use and performance. Ideal for BASIC applications such as CPUs, GPUs, laptops, and gaming consoles (e.g. Xbox, PS3/4/5), as well as other electronics with moderate heat requirements. The pads are quickly adhesive and easy to install thanks to an adhesive layer on one side. Includes cleaning cloth, pressure-activated, and can be cut to size, allowing you to flexibly adapt them to various components. Wide range of thermal conductivities, suitable for different applications Shore hardness 20–40 (medium-soft), easy to cut with scissors or a knife Suitable for overclocking editions and demanding cooling requirements

<h3>THERMAL MASTER P3 Mini Thermal Imaging Camera (iOS/Android)</h3> <p>The THERMAL MASTER P3 is a professional mini thermal imaging camera designed for precise diagnostics of electronics, PCBs, electrical systems, industrial applications, HVAC, and home and automotive inspections. The device uses a 256 × 192-pixel VOx detector and X³IR™ technology, which increases image resolution to 512 × 384 pixels, providing a clear and detailed view of temperature distribution. The camera measures temperatures ranging from -20°C to 600°C with an accuracy of ±2°C or ±2% of reading, and its thermal sensitivity (NETD) of &lt;35 mK at 25°C allows it to detect even subtle thermal differences. Despite its advanced capabilities, the P3 remains exceptionally compact—it measures 59 × 27 × 17.2 mm, weighs 26.3 g, and consumes only 0.32 W of power.</p> <p> (image) </p><h3>Precise PCB diagnostics at the 1 mA level</h3> <p>The P3 was developed with a focus on printed circuit board analysis, making it particularly well-suited for applications where rapid detection of micro-defects is critical. The camera enables PCB testing and leakage current detection at the 1 mA level, facilitating the identification of problematic components without the need for time-consuming checks of the entire circuit. The macro lens with manual focus allows for precise adjustment of the image to small electronic components, and the 4.3 mm focal length supports close-up work. This makes the P3 a practical tool for service centers, electronics engineers, technicians, and device repair professionals.</p> <p> (image) </p><h3>A thermal image that reveals more detail</h3> <p>X³IR™ technology increases image detail to 512 × 384 pixels, resulting in a clearer thermogram and easier interpretation of results. The Razor X™ algorithm delivers an ultra-clear image, while the Thermal Master High-Sensitivity Sensor core ensures precise mapping of temperature differences. A 25 Hz refresh rate provides a smooth preview during operation, even when the camera is panned across the area being analyzed. You can also use the 15x digital zoom to take a closer look at selected parts of the image. The THERMAL MASTER P3 also offers 12 color palettes, including White Hot, Black Hot, Iron Red, and Red Hot, as well as 8 other variants. This allows you to tailor the image display to a specific task, surface type, or your own preferences. The camera allows for emissivity adjustment, distance correction, and ambient temperature setting, enabling you to better adapt the measurement to working conditions. These features are particularly important when analyzing various materials and surfaces that may reflect or emit heat differently.</p> <p> (image) </p><h3>Wide measurement range for demanding tasks</h3> <p>With a measurement range from -20°C to 600°C, the THERMAL MASTER P3 is suitable for both electronics diagnostics and the inspection of installations, machinery, heating elements, and industrial systems. An accuracy of ±2°C or ±2% of the reading helps ensure reliable results in daily service and inspection work. The camera supports high and low temperature alarms, making it easier to spot values outside the expected range. The isotherm feature allows you to highlight a selected temperature range with a separate color, which speeds up the analysis of areas requiring attention. The aircraft-grade alloy housing ensures durability while maintaining a lightweight design.</p> <p> (image) </p><h3>Intelligent measurement and convenient data analysis</h3> <p>The P3 offers advanced measurement tools that facilitate the analysis of various areas of the image. You can use 3-point, 3-line, 3-rectangle, and 3-circle measurements, as well as automatic tracking of center, maximum, and minimum temperatures. IQ+ Precision Temp technology uses a dynamic temperature drift compensation algorithm and intelligent ambient temperature measurement to help maintain the stability and accuracy of readings. Free professional offline data analysis is also available after taking a photo, which is useful for documenting defects and preparing reports.</p> <p> (image) </p><h3>Temp Master app and multi-device support</h3> <p>The camera works with the Temp Master app, which can be downloaded from Google Play and the App Store. Supported devices include iPhone 8–16, smartphones running Android 7.0 and later, as well as iPads, Android smartphones, and computers. PC software is available on the manufacturer’s website, allowing you to work not only on mobile devices but also on a larger screen. The P3 supports 12 languages, photo and video recording, and IR and PIP (picture-in-picture) modes.</p> <p> (image) </p> <h3>Included in the package:</h3> <ul class="list-disc pl-5"><li>Thermal imaging camera</li><li>Carrying case</li><li>USB-C to Lightning adapter</li><li>Extension cable (50 cm)</li><li>User manual</li></ul> <div class="table-wrapper"> <p> </p> <h3></h3> <table> <tbody> <tr><th>Manufacturer</th><td>THERMAL MASTER</td></tr><tr><th>Model</th><td>P3</td></tr><tr><th>Detector</th><td>VOx 256 × 192 pixels (12 μm)</td></tr><tr><th>X³IR™ resolution</th><td>512 × 384 pixels</td></tr><tr><th>Temperature measurement range</th><td>From -20°C to 600°C</td></tr><tr><th>Temperature measurement accuracy</th><td>±2°C or ±2% of reading</td></tr><tr><th>Focal length</th><td>4.3 mm</td></tr><tr><th>Focusing mode</th><td>Macro lens with manual focus</td></tr><tr><th>Printed circuit board testing</th><td>Detection of PCB leakage current at 1 mA</td></tr><tr><th>Application scenarios</th><td>Printed circuit boards, electronics, industrial, HVAC, home and automotive inspections</td></tr><tr><th>Compatibility</th><td>Connects to iPhone, iPad, Android smartphones, and computers</td></tr><tr><th>Supported systems</th><td>iPhone 8–16 / Android 7.0 and later</td></tr><tr><th>Digital zoom</th><td>15×</td></tr><tr><th>Image refresh rate</th><td>25 Hz</td></tr><tr><th>Thermal sensitivity (NETD)</th><td>&lt;35 mK at 25°C</td></tr><tr><th>Thermal Core</th><td>Thermal Master High-Sensitivity Sensor</td></tr><tr><th>Razor X™</th><td>Ultra-clear image algorithm</td></tr><tr><th>IQ+ Precision Temp</th><td>Dynamic temperature drift compensation algorithm with intelligent ambient temperature measurement</td></tr><tr><th>Temperature measurement</th><td>3 points / 3 lines / 3 rectangles / 3 circles, automatic tracking of center, maximum, and minimum temperatures</td></tr><tr><th>High/low temperature alarm</th><td>Supported</td></tr><tr><th>Isotherm</th><td>Highlighting of selected temperature range with a distinct color</td></tr><tr><th>Photo and video recording</th><td>Supported</td></tr><tr><th>Free professional data analysis</th><td>Offline analysis after taking a photo</td></tr><tr><th>Image mode</th><td>IR (default), PIP (picture-in-picture)</td></tr><tr><th>Color palettes</th><td>12 palettes (White Hot, Black Hot, Iron Red, Red Hot, and 8 others)</td></tr><tr><th>Measurement parameter correction</th><td>Emissivity adjustment, distance correction, and ambient temperature setting</td></tr><tr><th>App name</th><td>Temp Master</td></tr><tr><th>App download</th><td>Google Play / App Store</td></tr><tr><th>PC software</th><td>Available at www.thermalmaster.com</td></tr><tr><th>Estimated runtime</th><td>300 to 480 minutes (e.g., Samsung Galaxy S23+ with a 4700 mAh battery – approximately 367 minutes of runtime)</td></tr><tr><th>Power consumption</th><td>0.32 W</td></tr><tr><th>Field of view (FOV)</th><td>40° × 30.2°</td></tr><tr><th>Dimensions</th><td>59 × 27 × 17.2 mm</td></tr><tr><th>Weight</th><td>26.3 g</td></tr><tr><th>Housing material</th><td>Aviation-grade alloy</td></tr><tr><th>Operating temperature</th><td>-20°C to 55°C</td></tr><tr><th>Storage temperature</th><td>From -20°C to 60°C</td></tr><tr><th>Supported languages</th><td>12 languages</td></tr><tr><th>Connector</th><td>Protrudes 2 mm, compatible with most phone cases</td></tr> </tbody> </table> </div>

<h3>Thermal mop pad cover for Dreame Matrix10 Ultra, L50s Ultra, L50s Pro Ultra, X50s Pro Master, X50s Ultra Complete, X50s Pro Ultra, X60 Ultra, X60 Ultra Complete, X60 Master, X50 Pro Ultra, and X50 Pro Ultra Complete cleaning robots</h3> <p>The thermal mop pad cover for Dreame cleaning robots from the Matrix10, L50s, X50s, and X60 series uses increased temperature to remove dirt and dried stains even more effectively. The heating technology helps dissolve greasy deposits and disinfect surfaces, resulting in more thorough floor cleaning without the need for strong detergents. The high-quality mop material distributes water evenly, adheres well to the floor and leaves no streaks, while the durable construction ensures long life and easy installation and replacement. It is the perfect solution for those who expect maximum hygiene and even better cleaning results every day.</p> <p> (image) </p> <div class="table-wrapper"> <p> </p> <h3></h3> <table> <tbody> <tr><th>Manufacturer</th><td>Dreame</td></tr><tr><th>Model</th><td>RMP12</td></tr><tr><th>Compatibility</th><td>Dreame Matrix10 Ultra, L50s Ultra, L50s Pro Ultra, X50s Pro Master, X50s Ultra Complete, X50s Pro Ultra, X60 Ultra, X60 Ultra Complete, X60 Master, X50 Pro Ultra, X50 Pro Ultra Complete</td></tr> </tbody> </table> </div>

<p>Heatsink silicone thermal pad, 100 x 100 x 1 mm </p><ul> <li>Keep your computer's CPU cool</li> </ul>

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These self-adhesive thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x0,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 0,5mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 0,5mm (120x20mm) for ramplex, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.>

This thermal padd is very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x1,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1,5mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 1,5mm (120x20mm) for ramplex, innovatek, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.

These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 100x100x0,5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 0,5mm Electrically non-conductive Extent of delivery: 1x thermal pad 100x100x0,5mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>

These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technische Daten: Abmaße: ca. 15x15mm Stärke: variablel von ca. 0,5 bis 1,5mmmaximal zu überbrückender Luftspalt: 1 mmelektrisch nicht leitfähig Lieferumfang: 1x Wärmeleitpad 1mm ( 15x15mm)Hinweis: Diese Wärmeleitpads können bis zur Hälfte ihrer Höhe zusammengepresst werden.

These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 15x15x5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 5mm Electrically non-conductive Extent of delivery: 1x thermal pad 15x15x5mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>

These self-adhesive thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads were specially produced for RAM cooling but can also be cut to any desired size. Technical data: Dimensions: 120x20x1mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1mm Electrically non-conductive Extent of delivery: 1x Self-adhesive thermal pad 1mm (120x20mm) for ramplex, Mips and Koolance Note: The thermal pads can be compressed to up to half of their height.

These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 30x30x4mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 4mm Electrically non-conductive Extent of delivery: 1x thermal pad 30x30x4mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>

These thermal pads are very useful to compensate height differences and other irregularities on coolers and surfaces that are to be cooled. Due to the very elastic adaptability and the low hardness of this pad only little contact pressure is needed to allow perfect adaptation to the surfaces to ensure the best possible heat transfer. With these pads almost any unevenness can be compensated, from microscopically small grooves to visible irregularities. The self-adhesive surface of these pads allow easy installation and prevents the pad from shifting during installation of the cooler. These pads can be cut to any desired size and are therefore suitable for just about any application: From VRAM coolers on graphics cards to VRM blocks on the motherboard. Even large components such as the North- or Southbridge can be equipped with these pads, as they have excellent heat conductivity. With their many uses, these thermal pads should be amongst any PC-builder's equipment. Technical data: Dimensions: 30x30x5mm Heat conductivity: 1,5 W/mK Maximum bridgeable gap: 1mm Electrically non-conductive Extent of delivery: 1x thermal pad 30x30x5mm (1 piece) Note: The thermal pads can be compressed to up to half of their height.>

Materjal + protsess: SK7 + must elektroforees; Juhtiv: EI; Kohandage: AM2, AM3, FM1, FM2, AM4; Lisatarvikute sobivus: paksendatud silikoonpadi X2 + TF7 1g