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Gelid GP-Ultimate Thermal Pad

Gelid gp-ultimate thermalpad 90x50x1mm tp-gp04-b

The Gelid Solutions TP-GP04-R-A is a high-performance thermal pad designed to efficiently transfer heat away from electronic components. With a thickness of 0.5 mm, it is ideal for filling gaps between heat sinks and heat-generating components, ensuring optimal thermal conductivity. The pad comes in a sleek gray color, blending seamlessly with most electronic setups. Backed by a 36-month warranty, this thermal pad offers both reliability and peace of mind.

The Gelid Solutions TP-GP04-R-D heat sink compound Thermal Pad is an essential accessory for maintaining optimal thermal performance in electronic devices. With a height of 2 mm, this thermal pad efficiently transfers heat away from critical components, ensuring your systems run smoothly. It comes with a warranty of 36 months, providing peace of mind for long-term use. Ideal for both personal and professional applications, this thermal pad is a reliable choice for enhancing cooling efficiency.

Heatsink silicone thermal pad 100 x 100 x 1 mm Silicone thermal pad designed for merging with heat sinks It facilitates the removal of heat from the processor, chipset and processor to the heat sink Excellent thermal impedance It provides stability, perfectly merges, does not stratify, does not oxidize. It does not conduct electricity

GeForce RTX 5050 WINDFORCE OC 8G Powered by the NVIDIA Blackwell architecture and DLSS 4 Powered by GeForce RTX 5050 Integrated with 8GB GDDR6 128bit memory interface WINDFORCE cooling system: Hawk fan; Server-grade Thermal conductive gel Reinforced structure The WINDFORCE cooling system delivers exceptional thermal performance through a combination of cutting-edge technologies. It features server-grade thermal conductive gel, innovative Hawk fans with alternate spinning, composite copper heat pipes, a copper plate, 3D active fans, and screen cooling. HAWK FANThe Hawk Fan features a unique blade design inspired by the aerodynamics of an eagle's wing. This design reduces air resistance and noise levels, resulting in up to a 53.6% increase in air pressure and a 12.5% increase in air volume without compromising acoustics. SERVER-GRADE THERMAL CONDUCTIVE GELTo enhance product quality and reliability, we have introduced server-grade thermal conductive gel for cooling critical components such as VRAM and MOSFETs. This highly deformable, non-fluid gel provides optimal contact for uneven surface and effectively resists deformation from transport or long-term use, unlike traditional thermal pads. COPPER PLATE & COMPOSITE COPPER HEAT PIPEThe copper plate directly contacts the GPU, coupled with the composite copper heat pipes, which quickly transfers the heat of the GPU and VRAM to the heatsink. SCREEN COOLINGExtended heatsink allows air to pass through, providing better heat dissipation. ULTRA DURABLE ULTRA COOLING - Lower RDS(on) MOSFETs are specially designed to produce lower switching resistance for faster electric current charging and discharging at extremely low temperature. LOW POWER LOSS - Metal Choke hold energy much longer than common iron-core chokes at high frequency, thus effectively reduce core energy loss and EMI interference. LONGER LIFE - Lower ESR Solid Capacitors ensure better electronic conductivity for excellent system performance and longer lifespan. FRIENDLY PCB DESIGNFully automated production process ensures top quality of the circuit boards and eliminates sharp protrusions of the solder connectors seen on the conventional PCB surface. This friendly design prevents your hands from getting cut or inadvertently damaging components when making your build.