Thermal Grizzly TG-P-P-100

Thermal Grizzly introduces the Thermal Putty series, a new product line specifically developed for upgrading graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putty can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to key components Pro-version with very high thermal conductivity for high-end components Safe to use thanks to its electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Pro Thermal Grizzly Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply, flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices.⁣ Typically, several types of thermal pads in varying thicknesses are used from the manufacturer, so when replacing the pads or modifying the cooler to a GPU water cooler, you would need several different pads. This issue is solved by the flexible application of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? To upgrade a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, a 30-gram jar is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back side, between the PCB and the backplate of larger graphics cards, there is often a uniform, larger gap. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this space. Three versions for different applications With three different versions, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components with low heat generation. The Advance version, with higher thermal conductivity, is intended for midrange components with greater power. For the high-end segment, Thermal Grizzly offers Putty Pro, which provides optimal cooling for your high-end components thanks to its outstanding thermal conductivity. Flexible and safe to use Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be spread over large areas with the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls, which can be matched in size to the area to be covered (e.g., VRAM, SMD).