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Very high-performance thermal pad, with good thermal conductivity and 2.0 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 3.0 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 0.5 mm thickness, size of 100 × 100 mm

With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the previous Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use with memory chips or voltage regulators. It is based on a silicone-containing carrier complex and uses aluminum oxide as a heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, you should choose the thickness based only on the distance that needs to be bridged.

Highly efficient thermal pad, with good thermal conductivity and 1.0 mm thickness, size of 100 × 100 mm

Very high-performance thermal pad, with good thermal conductivity and 2.0 mm thickness, size of 100 × 100 mm

Very high-performance thermal pad with good thermal conductivity and 0.5 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 1.5 mm thickness, size of 120 × 20 mm

High-performance alternative to thermal paste With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use on memory chips or voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, the choice of thickness should only be based on the distance to be bridged.

With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Building on its predecessor, the Minus Pad 8, it has been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for situations where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. This makes it particularly suitable for use on memory chips or voltage regulators. It is based on a silicone-containing carrier complex and aluminum oxide as the thermal transfer medium, achieving a similar thermal conductivity to thermal paste. The Minus Pad is available in various sizes and thicknesses ranging from 0.5 to 3 millimeters. Since it performs optimally with minimal pressure and its thermal conductivity is barely affected by thickness, the selection of thickness should simply match the gap to be bridged.

Very high-performance thermal pad, with good thermal conductivity and 3.0 mm thickness, size of 120 × 20 mm

Thermal pad with excellent thermal conductivity, suitable for high-performance hardware, does not harden, electrically non-conductive.With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. Designed for enthusiasts and professionals, it delivers maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat transfer The Minus Pad Extreme 2 utilizes an innovative combination of aluminum oxide, hydroxide, and powder. Varying particle sizes ensure that even the smallest gaps are reliably filled with thermal material, delivering uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking scenarios or compact builds with tight cooler-component contact, the Minus Pad Extreme 2 offers a secure, durable solution with easy application. Its electrical non-conductivity also increases safety during installation.

With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who seek maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material required Safe installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Through various particle sizes, even the smallest gaps are reliably filled with thermal material—ensuring uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and thus adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more even heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or in compact builds with close contact between cooler and component—the Minus Pad Extreme 2 offers a safe, durable solution with easy application. Its electrical non-conductivity also increases safety during installation.

With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals seeking maximum cooling performance, combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing required for the thermal material Safe installation due to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and components, the Minus Pad Extreme 2 offers a safe, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.

With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance along with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing required for the thermal material Safe installation due to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 features an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure that even the smallest gaps are reliably filled with thermal material, promoting uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to the previous version, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether for overclocking or in compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 offers a secure, long-lasting solution with easy application. Its electrical non-conductivity also enhances safety during installation.

With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is aimed at enthusiasts and professionals seeking maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for consistent and effective dissipation of excess heat. Softer, more flexible and adaptable Compared to its predecessor, the new pad is softer and thus adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more uniform heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and component—the Minus Pad Extreme 2 offers a secure, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.

Thermal pad with excellent thermal conductivity, suitable for high-performance hardware, does not harden, electrically non-conductiveWith the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance combined with high flexibility and user-friendliness.Optimized material blend for efficient heat transferSoft consistency to perfectly conform to component surfacesThermal material does not cureSafe installation thanks to electrically insulating propertiesIdeal for high-end hardware and overclockersNew materials for improved heat dissipationThe Minus Pad Extreme 2 utilizes an innovative combination of aluminum oxide, hydroxide, and powder. Varying particle sizes reliably fill even the smallest gaps with thermal material, ensuring uniform and effective dissipation of excess heat.Softer, more flexible, and adaptableCompared to its predecessor, the new pad is softer, allowing it to adapt even better to uneven surfaces. This flexibility lowers thermal resistance and ensures more consistent heat transfer—all without curing or waiting periods.Reliable performance for demanding applicationsWhether in overclocking or compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 offers a safe, durable solution that is easy to apply. Its electrical non-conductivity also enhances safety during installation.

The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders who need flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, you can reliably compensate for different height variations—no complex measuring required. High compressibility – reliably compensates for varying height differences Easy installation with just one thickness – ideal when heights are uncertain Very good thermal conductivity – efficiently keeps components cool Electrically non-conductive – safe to use with no risk of short circuits Versatile applications – for SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full compression The High Compression Pads can be highly compressed and reliably balance out height differences, even when the exact gap between heatsink and component is unknown. Often, a single thickness is sufficient to cover multiple components at once. High-performance heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for different components.

High compression thermal pad, very high compressibility, high thermal conductivity, electrically non-conductive, easy installation The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, it reliably compensates for different heights—without the need for complicated measurements. High compressibility – reliably compensates for varying heightsEasy installation with just one thickness – ideal when height is uncertain Very good thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe without risk of short circuits Versatile applications – SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be compressed significantly and reliably compensate for height differences, even when the exact height between heatsink and component is unknown. Often, just one thickness is enough to cover multiple components at once. Powerful heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially in VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for various components.

High compression thermal pad, extremely high compressibility, high thermal conductivity, electrically non-conductive, easy to install The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Its high compressibility and thermal conductivity allow you to reliably compensate for different heights—without the need for complicated measurements. High compressibility – reliably compensates for varying heights Easy installation with a single thickness – ideal when the required height is uncertain Excellent thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe with no risk of short circuits Versatile applications – suitable for SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be significantly compressed and reliably compensate for height differences, even when the precise height between heatsink and component is unknown. Frequently, one thickness is sufficient to cover several components at once. Efficient heat transfer & protection With excellent thermal conductivity, the pad ensures efficient heat exchange. Additionally, it is electrically insulating, preventing short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as required. It is ideal for GPU water coolers, laptop coolers, or SSDs—providing a practical all-round solution for various components.

High compression thermal pad with very high compressibility, high thermal conductivity, electrically non-conductive, easy to install The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, it reliably compensates for different heights—eliminating the need for complicated measurements. High compressibility – reliably compensates for varying heights Simple installation with a single thickness – ideal when heights are uncertain Excellent thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe with no risk of short circuits Versatile applications – SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full compression The High Compression Pads can be heavily compressed and reliably compensate for height differences, even when the exact spacing between heatsink and component is unknown. Often, one thickness is enough for several components at once. Powerful heat transfer & protection With excellent thermal conductivity, the pad ensures efficient heat transfer. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to the desired size. It is ideal for GPU water blocks, laptop coolers, or SSDs—a practical all-round solution for various components.

High compression thermal pad, very high compressibility, high thermal conductivity, electrically non-conductive, easy installation The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, you can reliably compensate for different heights—all without complex measurements. High compressibility – reliably compensates for varying heights Easy installation with just one thickness – ideal when height is uncertain Very good thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe without risk of short circuits Versatile applications – SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be compressed strongly and reliably compensate for height differences, even when the exact height between heatsink and component is unknown. Often, a single thickness is enough to cover several components at once. Powerful heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially with VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for various components.

Highly efficient thermal pad with good thermal conductivity and a thickness of 0.5 mm, size of 100 × 100 mm

The Thermal Grizzly Minus Pad Pro thermal pads are part of the Basic, Advance, and Pro series. The Pro pads offer extremely high thermal conductivity and outstanding compressibility—at a slightly higher price.

Very high-performance thermal pad, with good thermal conductivity and a thickness of 1.5 mm, size of 100 × 100 mm

Very high-performance thermal pad, with good thermal conductivity and 2.0 mm thickness, size of 100 × 100 mm

The Thermal Grizzly Minus Pad Pro is a highly efficient thermal pad designed for superior heat conductivity. Each pad measures 120 x 20 mm with a thickness of 0.5 mm, making it ideal for various cooling applications. The package includes two pieces, ensuring you have a spare for future use. With a net weight of 0.018 kg, it is lightweight and easy to handle, and it comes with a G24 warranty for added peace of mind.

Very high-performance thermal pad, with good thermal conductivity and 1.5 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 1.0 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 2.0 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad with good thermal conductivity and a thickness of 3.0 mm, size of 120 × 20 mm

The phase change material used in the PhaseSheet PTM is solid at room temperature. The material only starts to liquefy at temperatures above 45 degrees Celsius. For optimal distribution of the liquid PhaseSheet PTM and thus the thinnest possible layer, a high contact force of around 300-400N is required. PhaseSheet PTM has very low viscosity in its liquid state and contracts again when reverting to a solid, mitigating the pump-out effect. The pump-out effect is especially noticeable when a copper cooler is paired with a graphics chip, as silicon and copper expand to different extents when heated. Under load, the heat spreader and base plate may deform (concave or convex) and return to their original shape when cooled. This causes thermal paste to be slowly squeezed out, for example between the heat spreader and the CPU cooler’s base plate. PhaseSheet PTM is more durable than conventional thermal pastes, though not as long-lasting as, for example, KryoSheet, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM is achieved and stabilized after approximately ten thermal cycles at 60 degrees Celsius each. Brief information Outstanding thermal conductivity Consistently high performance Very high durability Versatile in application Not electrically conductive Easy to use Scope of delivery 1x PhaseSheet PTM

Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for modifying graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible replacement for thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to critical components Advance version with high thermal conductivity for more powerful components Safe to use thanks to its electrically insulating property The flexible alternative to thermal pads: The Thermal Grizzly Putty Advance Thermal Grizzly Putty is a non-electrically-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads with varying heights are used from the factory, so when replacing the pads or converting the cooler to a GPU water cooler, several different pads are needed. This problem is solved by the flexible applicability of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about a 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, usually a 30-gram jar is sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back, between the PCB and the backplate, larger graphics cards often have a consistent, larger gap between the two surfaces. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this gap. Three variants for different applications The manufacturer offers three different variants for every performance class. The Basic variant is suitable for efficient components that generate low heat. The Advance variant, on the other hand, is aimed at the midrange segment with more powerful components thanks to its higher thermal conductivity. For the high-end segment, Thermal Grizzly offers Putty Pro, which ensures optimal cooling for your high-end components thanks to its particularly high thermal conductivity. Flexible and safe use Before application, the target surface should be thoroughly cleaned and degreased, for example with cleaning wipes from Thermal Grizzly or common isopropanol. Thanks to its electrically insulating property, it can be applied over large areas with the supplied spatula. Alternatively, the Thermal Putty can be formed by hand into small pellets that can be adapted in size to the surface to be applied (e.g., VRAM, SMD).

Product Details: Thermal Grizzly - Advance TG Putty Advance is a non-electrically conductive gap filler designed as an alternative to traditional thermal pads. Its flexible and easy-to-apply formula compensates for height differences and is ideal for replacing pads on graphics cards, especially where varied pad thicknesses are needed. The putty can be applied using the included spatulas for smooth, even coverage, or shaped by hand (gloves recommended) into custom-sized beads for components like VRAM and SMDs, accommodating gaps from 0.2 mm to 3.0 mm. TG Putty Advance features good thermal conductivity and comes in a 30g jar, typically sufficient for upgrading a smaller graphics card or covering VRAM and VRM on one side of a larger card. Note: TG Putty is not suitable for direct application on processors or GPU chips, and surfaces should be clean and grease-free before use. 1x TG Putty Advance 3x Spatulas

Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for the modification of graphics cards and the replacement of thermal pads between PCBs and heatsinks. However, Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with versatile areas of application Especially suitable for heatsinks with varying distances to critical components Basic version with medium thermal conductivity for efficient components Safe to use due to electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Basic Thermal Grizzly Putty is a non-conductive alternative to traditional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is thus ideal as a replacement for thermal pads on graphics cards and other devices.⁣ Typically, several types of thermal pads of different heights are installed at the factory. When replacing these pads or modifying the cooler to a GPU water cooler, several different pads are needed. The flexible usability of Thermal Grizzly Putty solves this problem. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g. GeForce GTX 1060), approximately one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card like a GeForce RTX 4090, usually one 30-gram jar is sufficient for the memory (VRAM) and voltage converters (VRM) on the front. On the back, between the PCB and the backplate of larger graphics cards, there is often a uniformly larger gap between the two surfaces. To completely fill this gap, about two 30-gram jars or one 100-gram jar are needed. Three variants for different applications With three different variants, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components that produce little heat. The Advance version, with higher thermal conductivity, targets the mid-range segment with stronger components. For the high-end segment, Thermal Grizzly offers the Putty Pro, which ensures optimal cooling of your high-end components due to its excellent thermal conductivity. Flexible and safe application Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be applied over large areas using the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls that can be sized according to the surface being covered (e.g. VRAM, SMD).

Product Details: Thermal Grizzly - Basic TG Putty Basic is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Basic 3x Spatulas

Thermal Grizzly introduces the Thermal Putty series, a new product line specifically developed for upgrading graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putty can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to key components Pro-version with very high thermal conductivity for high-end components Safe to use thanks to its electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Pro Thermal Grizzly Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply, flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices.⁣ Typically, several types of thermal pads in varying thicknesses are used from the manufacturer, so when replacing the pads or modifying the cooler to a GPU water cooler, you would need several different pads. This issue is solved by the flexible application of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? To upgrade a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, a 30-gram jar is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back side, between the PCB and the backplate of larger graphics cards, there is often a uniform, larger gap. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this space. Three versions for different applications With three different versions, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components with low heat generation. The Advance version, with higher thermal conductivity, is intended for midrange components with greater power. For the high-end segment, Thermal Grizzly offers Putty Pro, which provides optimal cooling for your high-end components thanks to its outstanding thermal conductivity. Flexible and safe to use Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be spread over large areas with the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls, which can be matched in size to the area to be covered (e.g., VRAM, SMD).

Product Details: Thermal Grizzly - Pro TG Putty Pro is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Pro 3x Spatulas

Nano-cleaner based on acetone by Thermal Grizzly, for optimal removal of thermal paste & impurities, deep cleaning and degreasing effect, perfect for cleaning CPU & GPU, 10 ml content (10 - 20 applications)

The Ryzen 7000 Delid-Die-Mate is a tool for removing the heat spreaders ("delidding") on AMD Ryzen 7000/8X00G/9000 processors. By removing it, direct die cooling is possible, which means that the CPU cooler is mounted directly on the CPU chip. This allows for a significantly optimized heat transfer.

Compatible with AMD Ryzen 7000 & 7000X3D Allows installation of delidded Ryzen CPUs Replaces Socket Actuation Mechanism (SAM) Easy installation Anodized aluminum Only for delidded CPUs! The Thermal Grizzly Ryzen 7000 Direct Die Frame V2 in detail The Thermal Grizzly Ryzen 7000 Direct Die Frame V2 (DDFV2) is a CPU mounting frame specifically developed for the AMD X3D processors of the 7000 series, while maintaining compatibility with non-X3D CPUs. Please note that the DDFV2 is not compatible with Ryzen 8000G processors. It is compatible with both standard Ryzen 7000 processors and X3D CPUs, allowing them to be mounted with this direct die frame without the integrated heatspreader and without the Socket Actuation Mechanism (SAM). The changes made to the Thermal Grizzly Ryzen Direct Die Frame V2 compared to the AMD Ryzen 7000 Direct Die Frame became necessary after AMD added extra adhesive dots to the X3D CPUs. Technical Details Color: Black Material: Aluminum Socket: AM5 Compatibility: Ryzen 5 7600 Ryzen 5 7600X Ryzen 7 7700 Ryzen 7 7800X3D Ryzen 9 7900 Ryzen 9 7900X Ryzen 9 7900X3D Ryzen 9 7950X Ryzen 9 7950X3D Not compatible with the APUs of the Ryzen 8X00G series Scope of delivery: 1x Direct Die Frame V2 4x button head screws UNC thread 1/4" 1x 5/64" hex key 1x Torx T20 key

Thermal Grizzly TG Shield is a high temperature conformal coating to protect components from liquid metal short circuits. TG Shield is fast drying for quick application and will provide reliable protection of PC components in combination with liquid metal. The integrated brush allows easy and precise application. The wide operating temperature allows application around CPUs and GPUs even at high operating temperature. **Technical Data:** - Application Temperature -20° C to 110° C - Curing time 30 min at 20 °C - Typical Application CPUs, GPUs, Mainboards

With these spatulas from Thermal Grizzly, even and easy application of thermal paste is made possible. Technical Data Color: Black Material: Plastic Quantity: 3

Made from acrylic, the TG Scraper features a narrow tip specifically developed to remove, for example, silicone adhesive from the package (PCB) of a delidded processor or residual indium solder from the CPU dies. The ergonomic design ensures a firm and secure grip during use. Note: Careful and precise handling of the TG Scraper is essential to avoid damaging small electronic components on the CPU package or the dies. When removing indium solder from the die(s), it is recommended to first gently scrape the surface with the TG Scraper, then clean remaining solder residue from the die surfaces using liquid metal. Scope of Delivery: 3× TG Scraper

Recommended for the following Thermal Grizzly pastes: Aeronaut, Hydronaut, Kryonaut, and Kryonaut Extreme. The Thermal Grizzly Spatula, in its basic version for thermal paste, is an essential tool to ensure precise and even application. These plastic spatulas are soft and have lower hardness compared to metal tools, reducing the risk of scratching or damaging the surface of the CPU or other components where the thermal paste is applied. Plastic spatulas also offer the added benefit of being non-reactive with the metallic components of thermal compounds. Notes: Care should be taken to ensure that the spatula used is clean and free from residues or impurities. Residues on the applicator may affect the results of the application. The spatulas should only be used with thermal paste. The TG Spatula is recommended for Aeronaut, Hydronaut, Kryonaut, and Kryonaut Extreme, and is supplied in a convenient pack of three.

Device for measuring the power consumption of GPUsFor cards with 3x 8-pin PCIe and normal connector orientationIntegrated memory for recording measurement dataClean appearance thanks to optimized cable routingDeveloped in collaboration with Jon "elmor" SandströmSuitable for continuous operationThe Thermal Grizzly WireView GPU, 3x 8-pin PCIe (Normal) in detailThe Thermal Grizzly WireView GPU is a device for long-term measurement of the power consumption of PCI expansion and add-in cards with a PCIe power connector. The U-shaped design of the adapter enables optimized cable routing for clean cable management.What does the WireView GPU do?The WireView GPU enables continuous measurement of the power draw of PCI expansion and add-in cards and records this data to determine power consumption. Among other things, this data can be used to determine the electricity costs of a graphics card or to compare its power draw with that of other graphics cards.By measuring power draw, the power consumption of PCI expansion/add-in cards can be determined over a specific period of time or in specific applications. In addition, power draw spikes ("peaks") that may occur when operating current high-end graphics cards can be identified. The WireView GPU displays the recorded measurement data on its OLED display.Why use a power meter for the graphics card?The WireView GPU is particularly interesting for extreme overclockers and hardware reviewers, as it can display a graphics card's power draw in real time. However, it is also useful when testing the performance of a graphics card. Since no additional software has to run to record power draw during testing, benchmark results are not affected by the measurement.When manually overclocking the graphics card (e.g. with MSI Afterburner, ASUS GPU Tweak, EVGA Precision), adjustments made in the software can also be directly monitored on the WireView GPU's OLED display through the changed power draw.In addition to displaying power consumption in real time, the WireView GPU stores the measured data in its internal memory in order to record the graphics card's average consumption over a longer period. The stored data can be reset during operation.Which WireView GPU is required?Regardless of the number of PCIe power connectors on the graphics card, the orientation of the connectors is decisive when choosing the correct WireView GPU. The WireView GPU is available in "Normal" (N) and "Reverse" (R) versions. If the graphics card—or expansion card in general—is equipped with PCIe power connectors whose connector retaining clips face away from the PCB, the "N" variant is required. With the graphics card installed horizontally as usual, these would be at the bottom. The "N" variant is the most common type of connector orientation. If the graphics card is equipped with PCIe power connectors whose connector retaining clips face towards the PCB, the "R" variant is required. With the graphics card installed horizontally as usual, these would be at the top. This can be easily recognized by the cutouts in the PCB for the connector latches. The "R" variant is used by ASUS, among others.Warning, important note: Risk of injury!Depending on the graphics card used, but especially in the case of the GeForce RTX 4090, up to 450 watts of power flow through the WireView's connectors. The resulting waste heat can heat the PCB at the WireView connector to up to 60 degrees Celsius with an air-cooled graphics card. In the case of a water-cooled graphics card without airflow, the WireView PCB can heat up to 100 degrees Celsius! Do not touch the WireView housing during operation. After switching off the system, allow the WireView to cool down before handling it.

The WireView Pro GPU is an advanced device for measuring and monitoring the power consumption of graphics cards. Developed in collaboration with Jon "elmor" Sandström, the WireView Pro GPU connects to the graphics card's 12VHPWR power connector and links to the power supply via the power cable. Power consumption data is shown on an OLED display. The Pro version has been improved with connector detection and temperature sensors. An integrated buzzer provides an audible warning if an adjustable temperature or current limit is exceeded, if the cable is not properly connected, or if an incorrectly specified cable is in use. OLED display Power consumption measurement Power consumption recording Internal temperature sensors at the power connectors External temperature sensors Pin detection for sensor-pin connectors Alarm function Optimized cable management The WireView Pro GPU enables the measurement and monitoring of power consumption from graphics cards via the 12VHPWR power connector and records this data to determine power usage. This information can be used to calculate the operating cost of a graphics card or compare its consumption with other graphics cards. A special 60-second measurement cycle allows for a quick and convenient display of power consumption, making it especially useful for reviews. It can also be used to assess power consumption in specific scenarios or over certain periods. Additionally, it can detect power spikes that occur when using modern high-end graphics cards. The Pro version includes enhanced connector detection, temperature sensors, and an audible warning signal. The WireView Pro GPU’s connector detection identifies whether a cable specified for 150 watts, 300 watts, 450 watts, or 600 watts is being used. Please note that the WireView Pro GPU measures power consumption only through the power connector, not through the motherboard’s PCIe slot. If an incorrect cable is used or the cable is not properly connected, an audible warning will sound. Two temperature sensors located on the board at the power connectors monitor temperatures at those connectors. Up to 600 watts can pass through the connectors, potentially heating them and the surrounding board. An audible alarm will sound if the temperature exceeds an adjustable limit. Two additional temperature sensors (10K NTC) can be connected via cables; two sensors with cable lengths of 5 cm and 20 cm are included. The alarm can also be triggered if the adjustable current limit (amps) is exceeded. The WireView Pro GPU displays measured values on the OLED screen. By pressing a button, you can toggle through the displayed values. The following values may be shown: Current power consumption in watts (W) Current voltage in volts (V), current in amperes (A) Minimum and maximum power consumption in watts (W) Average power consumption over 60 seconds (RAVG in W) and total energy used (E in Wh) Measured temperatures of individual temperature sensors (°C) The WireView Pro GPU is available with the 12VHPWR 16-pin power connector (4x sensor + 12x power/ground) in "Normal" (N) and "Reverse" (R) versions: If the graphics card uses power connectors with the four sensor pins located between the PCB and the 12 power pins, the "N" version is required (PCB - 4x sensor pin - 12x power pins). If the graphics card uses power connectors with the 12 power pins located between the PCB and the four sensor pins, the "R" version is required (PCB - 12x power pins - 4x sensor pin). Note: When using the 12VHPWR adapter, ensure each of the three or four 8-pin PCIe connectors is connected to the power supply with a separate 8-pin PCIe cable. The use of splitters (Y-cables) is strongly discouraged! Warning – Important Notice: Risk of Injury! Depending on the graphics card used, especially with the GeForce RTX 4090, up to 450 watts of power can pass through the WireView connectors. This can cause the PCB at the WireView connector to heat to 60 degrees Celsius with an air-cooled card. With a water-cooled card and no airflow, the WireView PCB can heat up to 100 degrees Celsius! Do not touch the WireView casing during operation. After shutting down the system, allow the WireView to cool before handling.

Thermal Grizzly WireView Pro II GPU 12V-2x6 Normal: Real-Time GPU Power Monitoring The Thermal Grizzly WireView Pro II is looped directly into the 12V-2x6 power cable of the graphics card (Normal orientation) and measures current, voltage, temperature, and power draw in real time. A 320x170-pixel TFT-IPS display shows per-pin current as well as all other readings in real time. Key Features: Precise Per-Pin Current Measurement: Rather than just a total value, current flow through individual conductors of the connector is measured separately, revealing unbalanced load distribution. A 320x170-pixel TFT-IPS display shows per-pin current as well as all other readings in real time.: All relevant readings can be read directly on the device without launching additional software. Integrated Protective Mechanism: Protective circuitry is designed to help prevent damage to the graphics card's 12VHPWR/12V-2x6 connector. Compatible with High-Power GPUs: Designed for graphics cards with high power draw through the 12V-2x6 connector. Technical Specifications: Model: Thermal Grizzly WireView Pro II Connector: 12V-2x6 Orientation: Normal Measured Values: Current (A), Voltage (V), Temperature (°C), Power (W) Manufactured In: Germany Ideal for: The Thermal Grizzly WireView Pro II 12V-2x6 Normal is ideal for: users who want to monitor the actual power draw and load distribution of their graphics card in real time overclocking and stress-testing scenarios where unbalanced power delivery should be detected early With the Thermal Grizzly WireView Pro II 12V-2x6 Normal, you keep an eye on your graphics card's power draw at all times.

The WireView Pro II - Noctua Edition is a monitoring and current measurement device for modern graphics cards with a 12V-2x6 connector. The Noctua Edition retains the full functionality of the WireView Pro II and adds a Noctua NF-A4x10 PWM fan, an optimized cooling system and a Noctua-specific display design.

Thermal Grizzly WireView Pro II GPU 12V-2x6 Reverse: Real-Time GPU Power Monitoring The Thermal Grizzly WireView Pro II is looped directly into the 12V-2x6 power cable of the graphics card (Reverse orientation) and measures current, voltage, temperature, and power draw in real time. A 320x170-pixel TFT-IPS display shows per-pin current as well as all other readings in real time. Key Features: Precise Per-Pin Current Measurement: Rather than just a total value, current flow through individual conductors of the connector is measured separately, revealing unbalanced load distribution. A 320x170-pixel TFT-IPS display shows per-pin current as well as all other readings in real time.: All relevant readings can be read directly on the device without launching additional software. Integrated Protective Mechanism: Protective circuitry is designed to help prevent damage to the graphics card's 12VHPWR/12V-2x6 connector. Compatible with High-Power GPUs: Designed for graphics cards with high power draw through the 12V-2x6 connector. Technical Specifications: Model: Thermal Grizzly WireView Pro II Connector: 12V-2x6 Orientation: Reverse Measured Values: Current (A), Voltage (V), Temperature (°C), Power (W) Manufactured In: Germany Ideal for: The Thermal Grizzly WireView Pro II 12V-2x6 Reverse is ideal for: users who want to monitor the actual power draw and load distribution of their graphics card in real time overclocking and stress-testing scenarios where unbalanced power delivery should be detected early With the Thermal Grizzly WireView Pro II 12V-2x6 Reverse, you keep an eye on your graphics card's power draw at all times.