High-performance alternative to thermal paste With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use on memory chips or voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, the choice of thickness should only be based on the distance to be bridged.
With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Building on its predecessor, the Minus Pad 8, it has been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for situations where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. This makes it particularly suitable for use on memory chips or voltage regulators. It is based on a silicone-containing carrier complex and aluminum oxide as the thermal transfer medium, achieving a similar thermal conductivity to thermal paste. The Minus Pad is available in various sizes and thicknesses ranging from 0.5 to 3 millimeters. Since it performs optimally with minimal pressure and its thermal conductivity is barely affected by thickness, the selection of thickness should simply match the gap to be bridged.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads to the market. It is designed for enthusiasts and professionals who demand maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material required Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat transfer The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes reliably fill even the smallest gaps with thermally conductive material, ensuring uniform and effective dissipation of excess heat. Softer, more flexible, and more adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more uniform heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether used in overclocking or in compact builds with tight contact between the cooler and component, the Minus Pad Extreme 2 offers a secure, long-lasting solution that's easy to apply. Its electrical non-conductivity also enhances safety during installation.
Thermal pad with excellent thermal conductivity, suitable for high-performance hardware, does not harden, electrically non-conductive.With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. Designed for enthusiasts and professionals, it delivers maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat transfer The Minus Pad Extreme 2 utilizes an innovative combination of aluminum oxide, hydroxide, and powder. Varying particle sizes ensure that even the smallest gaps are reliably filled with thermal material, delivering uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking scenarios or compact builds with tight cooler-component contact, the Minus Pad Extreme 2 offers a secure, durable solution with easy application. Its electrical non-conductivity also increases safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who seek maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material required Safe installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Through various particle sizes, even the smallest gaps are reliably filled with thermal material—ensuring uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and thus adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more even heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or in compact builds with close contact between cooler and component—the Minus Pad Extreme 2 offers a safe, durable solution with easy application. Its electrical non-conductivity also increases safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals seeking maximum cooling performance, combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing required for the thermal material Safe installation due to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and components, the Minus Pad Extreme 2 offers a safe, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.
Das Thermal Grizzly Minus Pad extreme 2 ist der Nachfolger des Minus Pad extreme und für leistungsintensive Anwendungen ausgelegt. Der Materialmix von Minus Pad extreme 2 besteht aus Aluminiumoxid, Aluminiumhydroxid sowie Aluminiumpulver. Durch die unterschiedlichen Größen der einzelnen Bestandteile können kleinste Lücken im Trägermaterial (Matrix) mit wärmeleitfähigen Partikeln ausgefüllt werden. Ein weiterer Vorteil des Minus Pad extreme 2 gegenüber dem Vorgänger ist die weichere Konsistenz. Dadurch passt sich das Wärmeleitpad besser an die Oberflächen von Wärmequelle und Kühler an.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance along with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing required for the thermal material Safe installation due to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 features an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure that even the smallest gaps are reliably filled with thermal material, promoting uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to the previous version, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether for overclocking or in compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 offers a secure, long-lasting solution with easy application. Its electrical non-conductivity also enhances safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is aimed at enthusiasts and professionals seeking maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for consistent and effective dissipation of excess heat. Softer, more flexible and adaptable Compared to its predecessor, the new pad is softer and thus adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more uniform heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and component—the Minus Pad Extreme 2 offers a secure, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance, flexibility, and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No hardening of the thermal conductive material Safe installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat transfer The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes reliably fill even the smallest gaps with thermally conductive material—ensuring uniform and efficient dissipation of excess heat. Softer, more flexible, and more adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without hardening or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 provides a secure, durable solution with easy installation. Its electrical non-conductivity also increases safety during installation.
Thermal pad with excellent thermal conductivity, suitable for high-performance hardware, does not harden, electrically non-conductiveWith the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance combined with high flexibility and user-friendliness.Optimized material blend for efficient heat transferSoft consistency to perfectly conform to component surfacesThermal material does not cureSafe installation thanks to electrically insulating propertiesIdeal for high-end hardware and overclockersNew materials for improved heat dissipationThe Minus Pad Extreme 2 utilizes an innovative combination of aluminum oxide, hydroxide, and powder. Varying particle sizes reliably fill even the smallest gaps with thermal material, ensuring uniform and effective dissipation of excess heat.Softer, more flexible, and adaptableCompared to its predecessor, the new pad is softer, allowing it to adapt even better to uneven surfaces. This flexibility lowers thermal resistance and ensures more consistent heat transfer—all without curing or waiting periods.Reliable performance for demanding applicationsWhether in overclocking or compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 offers a safe, durable solution that is easy to apply. Its electrical non-conductivity also enhances safety during installation.
The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders who need flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, you can reliably compensate for different height variations—no complex measuring required. High compressibility – reliably compensates for varying height differences Easy installation with just one thickness – ideal when heights are uncertain Very good thermal conductivity – efficiently keeps components cool Electrically non-conductive – safe to use with no risk of short circuits Versatile applications – for SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full compression The High Compression Pads can be highly compressed and reliably balance out height differences, even when the exact gap between heatsink and component is unknown. Often, a single thickness is sufficient to cover multiple components at once. High-performance heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for different components.
High compression thermal pad, very high compressibility, high thermal conductivity, electrically non-conductive, easy installation The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, it reliably compensates for different heights—without the need for complicated measurements. High compressibility – reliably compensates for varying heightsEasy installation with just one thickness – ideal when height is uncertain Very good thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe without risk of short circuits Versatile applications – SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be compressed significantly and reliably compensate for height differences, even when the exact height between heatsink and component is unknown. Often, just one thickness is enough to cover multiple components at once. Powerful heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially in VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for various components.
High compression thermal pad, extremely high compressibility, high thermal conductivity, electrically non-conductive, easy to install The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Its high compressibility and thermal conductivity allow you to reliably compensate for different heights—without the need for complicated measurements. High compressibility – reliably compensates for varying heights Easy installation with a single thickness – ideal when the required height is uncertain Excellent thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe with no risk of short circuits Versatile applications – suitable for SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be significantly compressed and reliably compensate for height differences, even when the precise height between heatsink and component is unknown. Frequently, one thickness is sufficient to cover several components at once. Efficient heat transfer & protection With excellent thermal conductivity, the pad ensures efficient heat exchange. Additionally, it is electrically insulating, preventing short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as required. It is ideal for GPU water coolers, laptop coolers, or SSDs—providing a practical all-round solution for various components.
