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Thermal Grizzly Minus Pad Advance - 2 tk termopadjad 100 x 100 x 0,5 mm, elektrit mittejuhtivad, kõrge soojusjuhtivus ja kokkusurutavus Ssd-dele, Gpu-dele ja elektroonikale

Thermal Grizzly Minus Pad Advance - 2 tk termopadjad 100 x 100 x 2,0 mm, elektriliselt mittejuhtiv, kõrge soojusjuhtivus ja kokkusurutavus Ssd-dele, Gpu-dele ja elektroonikale

Thermal Grizzly Minus Pad Advance - 4 termopadjandi komplekt 120 x 20 x 1,5 mm, elektrit mittejuhtiv, kõrge soojusjuhtivus ja kokkusurutavus Ssd-dele, Gpu-dele ja elektroonikale

Very high-performance thermal pad with good thermal conductivity and a thickness of 0.5 mm, size of 100 × 100 mm

Very high-performance thermal pad, with good thermal conductivity and 1.0 mm thickness, size of 100 × 100 mm

Very high-performance thermal pad, with good thermal conductivity and 2.0 mm thickness, size of 100 × 100 mm

Very high-performance thermal pad, with good thermal conductivity and 0.5 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 1.0 mm thickness, size of 120 × 20 mm.

Very high-performance thermal pad, with good thermal conductivity and 1.5 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 2.0 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 3.0 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 0.5 mm thickness, size of 100 × 100 mm

With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the previous Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or where a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use with memory chips or voltage regulators. It is based on a silicone-containing carrier complex and uses aluminum oxide as a heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally even with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, you should choose the thickness based only on the distance that needs to be bridged.

Highly efficient thermal pad, with good thermal conductivity and 1.0 mm thickness, size of 100 × 100 mm

Very high-performance thermal pad, with good thermal conductivity and 2.0 mm thickness, size of 100 × 100 mm

Very high-performance thermal pad with good thermal conductivity and 0.5 mm thickness, size of 120 × 20 mm

Very high-performance thermal pad, with good thermal conductivity and 1.5 mm thickness, size of 120 × 20 mm

High-performance alternative to thermal paste With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use on memory chips or voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, the choice of thickness should only be based on the distance to be bridged.

With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Building on its predecessor, the Minus Pad 8, it has been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for situations where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. This makes it particularly suitable for use on memory chips or voltage regulators. It is based on a silicone-containing carrier complex and aluminum oxide as the thermal transfer medium, achieving a similar thermal conductivity to thermal paste. The Minus Pad is available in various sizes and thicknesses ranging from 0.5 to 3 millimeters. Since it performs optimally with minimal pressure and its thermal conductivity is barely affected by thickness, the selection of thickness should simply match the gap to be bridged.

Very high-performance thermal pad, with good thermal conductivity and 3.0 mm thickness, size of 120 × 20 mm

Wärmeleitpad für Höchstleistungen, 0,5 mm Stärke, 100 x 100 mm Größe

Wärmeleitpad für Höchstleistungen, 1 mm Stärke, 100 x 100 mm Größe

Wärmeleitpad für Höchstleistungen, 1,5 mm Stärke, 100 x 100 mm Größe

Wärmeleitpad für Höchstleistungen, 2 mm Stärke, 100 x 100 mm Größe

Wärmeleitpad für Höchstleistungen, 3 mm Stärke, 100 x 100 mm Größe

Wärmeleitpad für Höchstleistungen, 1,5 mm Stärke, 120 x 20 mm Größe

Wärmeleitpad für Höchstleistungen, 2 mm Stärke, 120 x 20 mm Größe

Wärmeleitpad für Höchstleistungen, 3 mm Stärke, 120 x 20 mm Größe