High-performance alternative to thermal paste With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Based on the predecessor Minus Pad 8, they have been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for applications where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. It is therefore optimal for use on memory chips or voltage regulators. It is based on a silicone carrier complex and aluminum oxide as the heat transfer medium, achieving thermal conductivity similar to that of thermal paste. The Minus Pad is available in various sizes and thicknesses from 0.5 to 3 millimeters. Since it works optimally with minimal contact pressure and the thermal conductivity is hardly affected by the thickness, the choice of thickness should only be based on the distance to be bridged.
With the Thermal Grizzly Minus Pad Basic, the Hamburg-based cooling specialist expands its product range with advanced thermal pads. Building on its predecessor, the Minus Pad 8, it has been further developed to significantly improve thermal conductivity. The Minus Pad Basic is ideal for situations where thermal paste is difficult to apply or when a gap between the heat source and heatsink needs to be bridged. This makes it particularly suitable for use on memory chips or voltage regulators. It is based on a silicone-containing carrier complex and aluminum oxide as the thermal transfer medium, achieving a similar thermal conductivity to thermal paste. The Minus Pad is available in various sizes and thicknesses ranging from 0.5 to 3 millimeters. Since it performs optimally with minimal pressure and its thermal conductivity is barely affected by thickness, the selection of thickness should simply match the gap to be bridged.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads to the market. It is designed for enthusiasts and professionals who demand maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material required Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat transfer The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes reliably fill even the smallest gaps with thermally conductive material, ensuring uniform and effective dissipation of excess heat. Softer, more flexible, and more adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more uniform heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether used in overclocking or in compact builds with tight contact between the cooler and component, the Minus Pad Extreme 2 offers a secure, long-lasting solution that's easy to apply. Its electrical non-conductivity also enhances safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals seeking maximum cooling performance, combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing required for the thermal material Safe installation due to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and components, the Minus Pad Extreme 2 offers a safe, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance along with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing required for the thermal material Safe installation due to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 features an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure that even the smallest gaps are reliably filled with thermal material, promoting uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to the previous version, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether for overclocking or in compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 offers a secure, long-lasting solution with easy application. Its electrical non-conductivity also enhances safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is aimed at enthusiasts and professionals seeking maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for consistent and effective dissipation of excess heat. Softer, more flexible and adaptable Compared to its predecessor, the new pad is softer and thus adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more uniform heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and component—the Minus Pad Extreme 2 offers a secure, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.
With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance, flexibility, and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No hardening of the thermal conductive material Safe installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat transfer The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes reliably fill even the smallest gaps with thermally conductive material—ensuring uniform and efficient dissipation of excess heat. Softer, more flexible, and more adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without hardening or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 provides a secure, durable solution with easy installation. Its electrical non-conductivity also increases safety during installation.
Thermal pad with excellent thermal conductivity, suitable for high-performance hardware, does not harden, electrically non-conductiveWith the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance combined with high flexibility and user-friendliness.Optimized material blend for efficient heat transferSoft consistency to perfectly conform to component surfacesThermal material does not cureSafe installation thanks to electrically insulating propertiesIdeal for high-end hardware and overclockersNew materials for improved heat dissipationThe Minus Pad Extreme 2 utilizes an innovative combination of aluminum oxide, hydroxide, and powder. Varying particle sizes reliably fill even the smallest gaps with thermal material, ensuring uniform and effective dissipation of excess heat.Softer, more flexible, and adaptableCompared to its predecessor, the new pad is softer, allowing it to adapt even better to uneven surfaces. This flexibility lowers thermal resistance and ensures more consistent heat transfer—all without curing or waiting periods.Reliable performance for demanding applicationsWhether in overclocking or compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 offers a safe, durable solution that is easy to apply. Its electrical non-conductivity also enhances safety during installation.
The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders who need flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, you can reliably compensate for different height variations—no complex measuring required. High compressibility – reliably compensates for varying height differences Easy installation with just one thickness – ideal when heights are uncertain Very good thermal conductivity – efficiently keeps components cool Electrically non-conductive – safe to use with no risk of short circuits Versatile applications – for SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full compression The High Compression Pads can be highly compressed and reliably balance out height differences, even when the exact gap between heatsink and component is unknown. Often, a single thickness is sufficient to cover multiple components at once. High-performance heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for different components.
High compression thermal pad, very high compressibility, high thermal conductivity, electrically non-conductive, easy installation The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, it reliably compensates for different heights—without the need for complicated measurements. High compressibility – reliably compensates for varying heightsEasy installation with just one thickness – ideal when height is uncertain Very good thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe without risk of short circuits Versatile applications – SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be compressed significantly and reliably compensate for height differences, even when the exact height between heatsink and component is unknown. Often, just one thickness is enough to cover multiple components at once. Powerful heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially in VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for various components.
High compression thermal pad, extremely high compressibility, high thermal conductivity, electrically non-conductive, easy to install The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Its high compressibility and thermal conductivity allow you to reliably compensate for different heights—without the need for complicated measurements. High compressibility – reliably compensates for varying heights Easy installation with a single thickness – ideal when the required height is uncertain Excellent thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe with no risk of short circuits Versatile applications – suitable for SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be significantly compressed and reliably compensate for height differences, even when the precise height between heatsink and component is unknown. Frequently, one thickness is sufficient to cover several components at once. Efficient heat transfer & protection With excellent thermal conductivity, the pad ensures efficient heat exchange. Additionally, it is electrically insulating, preventing short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as required. It is ideal for GPU water coolers, laptop coolers, or SSDs—providing a practical all-round solution for various components.
High compression thermal pad with very high compressibility, high thermal conductivity, electrically non-conductive, easy to install The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, it reliably compensates for different heights—eliminating the need for complicated measurements. High compressibility – reliably compensates for varying heights Simple installation with a single thickness – ideal when heights are uncertain Excellent thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe with no risk of short circuits Versatile applications – SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full compression The High Compression Pads can be heavily compressed and reliably compensate for height differences, even when the exact spacing between heatsink and component is unknown. Often, one thickness is enough for several components at once. Powerful heat transfer & protection With excellent thermal conductivity, the pad ensures efficient heat transfer. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially for VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to the desired size. It is ideal for GPU water blocks, laptop coolers, or SSDs—a practical all-round solution for various components.
High compression thermal pad, very high compressibility, high thermal conductivity, electrically non-conductive, easy installation The Thermal Grizzly Minus Pad High Compression is designed for PC enthusiasts and modders seeking flexible thermal pads for various components. Thanks to its high compressibility and thermal conductivity, you can reliably compensate for different heights—all without complex measurements. High compressibility – reliably compensates for varying heights Easy installation with just one thickness – ideal when height is uncertain Very good thermal conductivity – keeps components efficiently cool Electrically non-conductive – safe without risk of short circuits Versatile applications – SSDs, laptops, VRMs, or graphics cards Flexible height tolerance without full load The High Compression Pads can be compressed strongly and reliably compensate for height differences, even when the exact height between heatsink and component is unknown. Often, a single thickness is enough to cover several components at once. Powerful heat transfer & protection With very good thermal conductivity, the pad ensures efficient heat exchange. At the same time, it is electrically insulating and prevents short circuits in sensitive electronics—especially with VRAM, VRMs, or SSDs. Easy installation & universal use The thermal pad can be cut to size as needed. It is ideal for GPU water coolers, notebook coolers, or SSDs—a practical all-round solution for various components.
The Thermal Grizzly Minus Pad Pro thermal pads are part of the Basic, Advance, and Pro series. The Pro pads offer extremely high thermal conductivity and outstanding compressibility—at a slightly higher price.
The Thermal Grizzly Minus Pad Pro is a highly efficient thermal pad designed for superior heat conductivity. Each pad measures 120 x 20 mm with a thickness of 0.5 mm, making it ideal for various cooling applications. The package includes two pieces, ensuring you have a spare for future use. With a net weight of 0.018 kg, it is lightweight and easy to handle, and it comes with a G24 warranty for added peace of mind.
The phase change material used in the PhaseSheet PTM is solid at room temperature. The material only starts to liquefy at temperatures above 45 degrees Celsius. For optimal distribution of the liquid PhaseSheet PTM and thus the thinnest possible layer, a high contact force of around 300-400N is required. PhaseSheet PTM has very low viscosity in its liquid state and contracts again when reverting to a solid, mitigating the pump-out effect. The pump-out effect is especially noticeable when a copper cooler is paired with a graphics chip, as silicon and copper expand to different extents when heated. Under load, the heat spreader and base plate may deform (concave or convex) and return to their original shape when cooled. This causes thermal paste to be slowly squeezed out, for example between the heat spreader and the CPU cooler’s base plate. PhaseSheet PTM is more durable than conventional thermal pastes, though not as long-lasting as, for example, KryoSheet, which is virtually maintenance-free. The maximum thermal conductivity of PhaseSheet PTM is achieved and stabilized after approximately ten thermal cycles at 60 degrees Celsius each. Brief information Outstanding thermal conductivity Consistently high performance Very high durability Versatile in application Not electrically conductive Easy to use Scope of delivery 1x PhaseSheet PTM
Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for modifying graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible replacement for thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to critical components Advance version with high thermal conductivity for more powerful components Safe to use thanks to its electrically insulating property The flexible alternative to thermal pads: The Thermal Grizzly Putty Advance Thermal Grizzly Putty is a non-electrically-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads with varying heights are used from the factory, so when replacing the pads or converting the cooler to a GPU water cooler, several different pads are needed. This problem is solved by the flexible applicability of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about a 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, usually a 30-gram jar is sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back, between the PCB and the backplate, larger graphics cards often have a consistent, larger gap between the two surfaces. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this gap. Three variants for different applications The manufacturer offers three different variants for every performance class. The Basic variant is suitable for efficient components that generate low heat. The Advance variant, on the other hand, is aimed at the midrange segment with more powerful components thanks to its higher thermal conductivity. For the high-end segment, Thermal Grizzly offers Putty Pro, which ensures optimal cooling for your high-end components thanks to its particularly high thermal conductivity. Flexible and safe use Before application, the target surface should be thoroughly cleaned and degreased, for example with cleaning wipes from Thermal Grizzly or common isopropanol. Thanks to its electrically insulating property, it can be applied over large areas with the supplied spatula. Alternatively, the Thermal Putty can be formed by hand into small pellets that can be adapted in size to the surface to be applied (e.g., VRAM, SMD).
Product Details: Thermal Grizzly - Advance TG Putty Advance is a non-electrically conductive gap filler designed as an alternative to traditional thermal pads. Its flexible and easy-to-apply formula compensates for height differences and is ideal for replacing pads on graphics cards, especially where varied pad thicknesses are needed. The putty can be applied using the included spatulas for smooth, even coverage, or shaped by hand (gloves recommended) into custom-sized beads for components like VRAM and SMDs, accommodating gaps from 0.2 mm to 3.0 mm. TG Putty Advance features good thermal conductivity and comes in a 30g jar, typically sufficient for upgrading a smaller graphics card or covering VRAM and VRM on one side of a larger card. Note: TG Putty is not suitable for direct application on processors or GPU chips, and surfaces should be clean and grease-free before use. 1x TG Putty Advance 3x Spatulas
Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for the modification of graphics cards and the replacement of thermal pads between PCBs and heatsinks. However, Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with versatile areas of application Especially suitable for heatsinks with varying distances to critical components Basic version with medium thermal conductivity for efficient components Safe to use due to electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Basic Thermal Grizzly Putty is a non-conductive alternative to traditional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is thus ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads of different heights are installed at the factory. When replacing these pads or modifying the cooler to a GPU water cooler, several different pads are needed. The flexible usability of Thermal Grizzly Putty solves this problem. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g. GeForce GTX 1060), approximately one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card like a GeForce RTX 4090, usually one 30-gram jar is sufficient for the memory (VRAM) and voltage converters (VRM) on the front. On the back, between the PCB and the backplate of larger graphics cards, there is often a uniformly larger gap between the two surfaces. To completely fill this gap, about two 30-gram jars or one 100-gram jar are needed. Three variants for different applications With three different variants, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components that produce little heat. The Advance version, with higher thermal conductivity, targets the mid-range segment with stronger components. For the high-end segment, Thermal Grizzly offers the Putty Pro, which ensures optimal cooling of your high-end components due to its excellent thermal conductivity. Flexible and safe application Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be applied over large areas using the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls that can be sized according to the surface being covered (e.g. VRAM, SMD).
Product Details: Thermal Grizzly - Basic TG Putty Basic is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Basic 3x Spatulas
Thermal Grizzly introduces the Thermal Putty series, a new product line specifically developed for upgrading graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putty can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to key components Pro-version with very high thermal conductivity for high-end components Safe to use thanks to its electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Pro Thermal Grizzly Putty is an electrically non-conductive alternative to conventional thermal pads. As an easy-to-apply, flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads in varying thicknesses are used from the manufacturer, so when replacing the pads or modifying the cooler to a GPU water cooler, you would need several different pads. This issue is solved by the flexible application of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? To upgrade a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, a 30-gram jar is generally sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back side, between the PCB and the backplate of larger graphics cards, there is often a uniform, larger gap. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this space. Three versions for different applications With three different versions, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components with low heat generation. The Advance version, with higher thermal conductivity, is intended for midrange components with greater power. For the high-end segment, Thermal Grizzly offers Putty Pro, which provides optimal cooling for your high-end components thanks to its outstanding thermal conductivity. Flexible and safe to use Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be spread over large areas with the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls, which can be matched in size to the area to be covered (e.g., VRAM, SMD).
Product Details: Thermal Grizzly - Pro TG Putty Pro is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Pro 3x Spatulas
