The graphene thermal pads in the Thermal Grizzly KryoSheet series are an excellent alternative to high-performance thermal pastes. Like the Carbonaut pads, they feature an adaptable surface with extremely high thermal conductivity, but as a high-end product, KryoSheet provides significantly higher thermal conductivity than Carbonaut pads. This improvement is due not only to the choice of materials but also to an innovative manufacturing process. KryoSheet contains no liquid components, meaning it does not age like traditional thermal paste and cannot dry out. Outstanding thermal conductivity Easy to use Consistent high performance Extreme durability Attention: Electrically conductive! Follow the instructions! The KryoSheet graphene pads have a molecular structure stacked in the Z-direction. This optimized structure provides exceptional and consistent thermal conductivity, thanks to a specially designed manufacturing process in which the hexagonal crystal structure of graphite is broken along the basal plane to harness the anisotropy of graphite’s thermal conductivity. However, a side effect of this complex process is increased electrical conductivity and changed pad stability, so KryoSheet pads must only be used as instructed! Note: Reuse of KryoSheet is not recommended! When removing the cooler and handling KryoSheet after use, micro-cracks may form within the graphene pad structure, which could impact performance. KryoSheet is available in multiple sizes to fit various CPU and GPU models. The KryoSheet 29×25 mm is compatible with: Nvidia GPUs: RTX 5080 RTX 4090 RTX 3080, RTX 3080 Ti, RTX 3090, RTX 3090 Ti RTX 2070 Super, RTX 2080, RTX 2080 Super AMD GPUs: RX 7900 XT, RX 7900 XTX RX 6800, RX 6800 XT, RX 6900 XT, RX 6950 XT Intel GPUs: Arc A750, Arc A770
Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for modifying graphics cards and replacing thermal pads between PCBs and heatsinks. However, the Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible replacement for thermal pads with a wide range of applications Especially suitable for heatsinks with varying distances to critical components Advance version with high thermal conductivity for more powerful components Safe to use thanks to its electrically insulating property The flexible alternative to thermal pads: The Thermal Grizzly Putty Advance Thermal Grizzly Putty is a non-electrically-conductive alternative to conventional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is therefore ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads with varying heights are used from the factory, so when replacing the pads or converting the cooler to a GPU water cooler, several different pads are needed. This problem is solved by the flexible applicability of Thermal Grizzly Putty. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g., GeForce GTX 1060), about a 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card such as a GeForce RTX 4090, usually a 30-gram jar is sufficient for the memory (VRAM) and voltage regulators (VRM) on the front side. On the back, between the PCB and the backplate, larger graphics cards often have a consistent, larger gap between the two surfaces. Here, about two 30-gram jars or one 100-gram jar are needed if you want to completely fill this gap. Three variants for different applications The manufacturer offers three different variants for every performance class. The Basic variant is suitable for efficient components that generate low heat. The Advance variant, on the other hand, is aimed at the midrange segment with more powerful components thanks to its higher thermal conductivity. For the high-end segment, Thermal Grizzly offers Putty Pro, which ensures optimal cooling for your high-end components thanks to its particularly high thermal conductivity. Flexible and safe use Before application, the target surface should be thoroughly cleaned and degreased, for example with cleaning wipes from Thermal Grizzly or common isopropanol. Thanks to its electrically insulating property, it can be applied over large areas with the supplied spatula. Alternatively, the Thermal Putty can be formed by hand into small pellets that can be adapted in size to the surface to be applied (e.g., VRAM, SMD).
Thermal Grizzly introduces the Thermal Putties, a new product line specifically developed for the modification of graphics cards and the replacement of thermal pads between PCBs and heatsinks. However, Thermal Putties can also be used by hobbyists and experienced technicians for a variety of devices such as notebooks, handhelds, and gaming consoles. Flexible alternative to thermal pads with versatile areas of application Especially suitable for heatsinks with varying distances to critical components Basic version with medium thermal conductivity for efficient components Safe to use due to electrically insulating properties The flexible alternative to thermal pads: The Thermal Grizzly Putty Basic Thermal Grizzly Putty is a non-conductive alternative to traditional thermal pads. As an easy-to-apply and flexible gap filler, it compensates for height differences and is thus ideal as a replacement for thermal pads on graphics cards and other devices. Typically, several types of thermal pads of different heights are installed at the factory. When replacing these pads or modifying the cooler to a GPU water cooler, several different pads are needed. The flexible usability of Thermal Grizzly Putty solves this problem. How much Thermal Grizzly Putty do I need? For modifying a single, smaller graphics card without a backplate (e.g. GeForce GTX 1060), approximately one 30-gram jar of Thermal Grizzly Putty is needed. For a larger graphics card like a GeForce RTX 4090, usually one 30-gram jar is sufficient for the memory (VRAM) and voltage converters (VRM) on the front. On the back, between the PCB and the backplate of larger graphics cards, there is often a uniformly larger gap between the two surfaces. To completely fill this gap, about two 30-gram jars or one 100-gram jar are needed. Three variants for different applications With three different variants, the manufacturer offers the right product for every performance class. The Basic version is suitable for efficient components that produce little heat. The Advance version, with higher thermal conductivity, targets the mid-range segment with stronger components. For the high-end segment, Thermal Grizzly offers the Putty Pro, which ensures optimal cooling of your high-end components due to its excellent thermal conductivity. Flexible and safe application Before application, the target surface should be thoroughly cleaned and degreased, for example with Thermal Grizzly cleaning wipes or standard isopropanol. Thanks to its electrically insulating property, it can be applied over large areas using the included spatula. Alternatively, the Thermal Putty can be shaped by hand into small balls that can be sized according to the surface being covered (e.g. VRAM, SMD).
Product Details: Thermal Grizzly - Basic TG Putty Basic is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Basic 3x Spatulas
