Otsing: thermal pad (arhiveeritud tooted)

Hi-FiA combination of exclusive hardware & software design including "ground-isolation circuit design","an independent audio power", and "a built=on-board amplifier", with all these hardware features gives you the best audio quality and performance. As for software, we offer you a free bundle utility "Multi-Channel Calibration" which normally you'll find in high level sound systems; this feature allows you to auto detect your location; with a user friendly interface, you can easily adjust the volume of every speakers to make a well balanced surround sound. And of course, the built-on-board amplifier always gives you a super powerful sound comparing to other motherboards.Blu-ray AudioUpgrading your Audio performance in the easiest way is choosing BIOSTAR ultimate Motherboard. It does support Blu-ray audio DRM (compatible driver/software) and provide the higher audio output of 24 bit/ 192KHz than the 16 bit/ 48KHz from the normal MB. You will experience the high quality sound effect with pure Blu-Ray Audio.Super Hi-Fi Audio Connectors30uF “Golden” plated audio connectors provide superb signal conductivity, less oxidation, and best possible studio-grade headgears.Hi-Fi PowerAudio power is an important factor in audio quality. Most AV equipment isolates the power supply for each analog and digital signal to gather high-quality sound reproduction. Equipped with BIOSTAR Hi-Fi Power technology, it will utilize audio components with independent power design for a significant reduction in electronic noise and superb sound quality.Hi-Fi GroundBIOSTAR Hi-Fi Ground ( Golden Line ) is noise-blocking multi-layer PCB design to isolates analog audio signals from digital sources. Unique PCB layout is ideal for exceptional clarity and high fidelity sound.Hi-Fi SoundBIOSTAR Hi-Fi series motherboards have a sampling rate of 192kHz/24-bit which delivers a high quality audio through an analog connection to your home theater system, multi-channel speakers and high-end headphone. You can enjoy real Blu-ray grade high-definition sound that you’ve never experienced before.Hi-Fi AMPThe built-in amplifier can drive major high-end headphones with over 100dB loads and offer wide band-width, low noise, high slew rate and low distortion audio source from front panel I/O. Gaming enthusiasts can enjoy a fuller range of dynamic sound with crisper details and less distortion.Smart EarSmart EAR is a windows-based audio utility which allows you to easily adjust system volume. With its user-friendly GUI, you can also increase or decrease impedance setting (Low/High Gain) to optimize your headphone performance. You can easily enjoy high-quality and awesome sound.Hi-Fi ResistorMetal-oxide film resistors are made of metal oxides such as tin oxide. The electric characteristics are greater stability and reliability than regular metal film resistors when operating in an extremely broad working temperature range. This special component is used in applications with high endurance audio demands.Hi-Fi CapBIOSTAR Hi-Fi series motherboards come with high quality ‘Non-Polarized Electrolysis Electric audio capacitors’ for each audio channel circuit. The customized audio capacitors deliver low noise, low distortion, and wide bandwidth to achieve the highest sound resolution and sound expansion. The critical component will ensure the most realistic sound effects to gaming enthusiasts.Hi-Fi 110dB+Embrace exceptional sound quality for the win with 110dB SNR and stylish and efficient EMI shield blocks electromagnetic interference to help provide cleaner audio. It has achieved a signal-to-noise ratio (SNR) of 110dB, yielding almost loss-less audio form rear audio connectors.DX11Direct3D 11 enables Direct3D 10 APIs and Direct3D 11 APIs to use one underlying rendering device. And it allows developers to achieve a high speed, fully conformant software rasterizer.SmartSpeedLANSmartSpeedLAN is a free software application which monitors and manages your PC's network behavior. With user-friendly GUI, it allows you to select and prioritize different types of network traffic, including gaming, media streaming, communications or web surfing.You can also set any specific applications, choosing to prioritize or block accordingly. SmartSpeedLAN can feature automatic management options that use adaptive networking intelligence to ensure that you are getting the best online experience possible.Charger BoosterCharger booster is the best and efficient charger solution for apple devices such as iPad, iPhone. Basically, Charger booster Technology is able to boost the charging time to be more efficiency and faster once any apple goods connecting to our Motherboard. With charger booster technology, you are able to charge your apple devices up to 42 % faster.mini-PCIe+mSATACombo connector which allows both mini-PCIe and mSATA SSD and others upgradesUSB 3.0Experience Fastest data transfers at 5 Gbps with USB 3.0--the new latest connectivity standard. Built to connect easily with next-generation components and peripherals, USB 3.0 transfers data 10X faster and backward compatible with previous USB 2.0 components.Super Durable Ferrite ChokeSuper Durable Ferrite Choke brings the benefits of higher current capacity, lower energy loss and better power stability.Super Durable Solid CapsThe best quality solid state capacitors with ultra low ESR design, the Super Durable Solid Caps doubles the lifespan.Moistureproof PCBThe popularity of PC usage and working environment is getting deteriorating and moist(rural, coastal, etc.). The PCB will be oxidizing easily by damp or absorbed moisture, and ionic migration or CAF (Conductive Anodic Filament) will be generated. Moisture-proof PCB meets high density and high reliability requirements for moisture proof.Low RdsOn P-Pak MOSLow resistance design can significantly reduce the current out of energy loss.Low temperature, small size, excellent thermal conductivity.100% Solid CapsWith armor-plated Biostar Technology, all capacitors are placed with 100% solid capacitors that have a lasting life cycle, durability and stability for crucial components.ESD ProtectionESD (Electrostatic Discharge) is the major factor to destroy PC by electrical overstress(EOS) condition, ESD occurred by PC users when touch any devices connect to PC, which may result in damage to motherboard or parts .ESD protection is designed to protect the motherboard and equipment from damage by EOSUSB PolyswitchOn board dedicated power fuse to help prevent USB port failure. It prevents USB Port overcurrent and safegurand your system and device lifespan.BIOS Virus ProtectionWhen enabled, the BIOS will protect the boot sector and partition table by halting the system and flashing a warning message whether there's an attempt to write to these areas.OC / OV / OH ProtectionAll BIOSTAR special circuit design detects overvoltage conditions and prevents voltage surges from spreading in real time. It also actively cuts off the overvoltage supply to protect your system. Over current protection, avoid motherboard from damage when doing overclock or an unusual current import. Over heat protection, avoid motherboard & CPU from burning when exceeding the temperature limitation.BullGuard Internet Security (90 days FREE trial)BullGuard Internet Security comes with the broadest line-up of internet security features on the market, including: a cutting-edge dual Antivirus engine, Online Backup for your precious files, PC Tune Up to speed up your system, a Game Mode for a seamless gaming experience, Parental Control, Firewall, Safe Browsing and many more. Make the most of your digital life with Bullguard!UEFI BIOSUnified Extensible Firmware Interface (UEFI) is a brand new framework that provides a revolutionary interface. It is a modern clear and easy-to-use graphical user interface. The UEFI comes with a colorful easy-understand icons leads users into the setup layer directly.Header ZoneUsers can easily assemble their own computer, a simple-swap data discs and other accessories.BIO-Remote 2BIO-Remote2 Technology is featuring users a better Home Theater environment. Users who own either Android mobile or Apple goods are able to access and control your PC remotely; At this moment, you’re smart device became a intelligent and functional remote controller; more than that, BIO-Remote2 also includes both function of mouse pad and power point presentation mode.BIO-FlasherUpdate BIOS effortlessly from a USB flash disk before entering the OS.BIO-Flasher is a convenient BIOS update tool. Just launch this tool and put the BIOS on USB pen driver before entering the OS. You can update your BIOS with only a few clicks without preparing an additional floppy disk or other complicated flash utility.eHot-Line UtiltiyIntegrated e-service automatically sends your technical support request to Biostar Globe tech support without any delay.BIOScreen UtilityPersonalize your desktop with customizable boot logo. BIOScreen is the new feature that lets you personalize and create your own style with unique, custom-made boot logo.Super Durable Box HeaderSuper Durable Box Header provides solid, secure and durable connections between motherboard and peripheral cables.AMD 970 chipsetAMD 970 Chipset is designed to support up to 4800MT HT 3.0 interface speed and PCI-Express 2.0 x16 graphics. It is optimized with AMDR’s latest AM3+ and multi-core CPUs to provide excellent system performance and overclocking capabilities.AM3+/AM3 SupportSupporting upcoming AMD Socket AM3+/AM3 32nm processors, it delivers better overclocking capabilities and reduces power consumption. Moreover, AM3+ CPU supports DDR3 memory module and accelerates data transfer rate by up to 5200MT/s via HyperTransport 3.0 technology.Toetatud mälutüübidDDR3-SDRAMMälupesa tüüpDIMMToetatud mälu taktsagedused800,1066,1333,1600,1866 MHzMälukaardi pesade arv4MälukanalidDuaalneMaksimaalne sisemälu64 GBProtsessori perekondAMDÜhilduvad protsessoriseeriadAthlon II X2,Athlon II X3,Athlon II X4,Phenom II X2,Phenom II X3,Phenom II X4,Phenom II X6,SempronProtsessori pesaSocket AM3+Protsessori jõujaam (max)140 WUSB 2.0 pistmikud2USB 3.0 pistmikud1SATA III ühenduste arv5mSATA-pesade arv1Kõvaketta ühenduse tüüpJada ATA IIIS/PDIF-väljundpistmikJahCPU-ventilaatori pistmikJahEsipaneeli audiopistikJahJadapordi ühenduspesa1USB 2.0 portide arv6USB 3.0 (3.1 Gen 1) A-tüüpi portide hulk2Ethernet LAN (RJ-45) pordid1PS/2-portide kogus2Ethernet LANJahLAN-kontrollerRealtek RTL8111GREthernet-liidese tüüpGigabit EthernetKomponentPCEmaplaadi kiibistikAMDEmaplaadi kiipAMD 970Emaplaadi kujutegurATXAudioväljundi kanalid7.1 kanalidRAID-tasemed0, 1, 5, 10HelisüsteemRealtek ALC892Toetatud Windowsi operatsioonisüsteemidJahDirectX-i versioon11PCI Expressi x1 (Gen 2.x) pesad2PCI Expressi x16 (Gen 2.x) pesad2PCI-pesad2BIOS-i tüüpUEFILaius305 mmSügavus225 mmKaablid kaasa arvatudSATADraiverid kaasa arvatudJah

Thermal Pad von EK Water Blocks für hohe Wärmeleitfähigkeit (3,5 W/mK), 100 x 16 mm, vorgeschnitten in acht kleinere Stücke - 0,5 mm Stärke

MSI GT83 Titan SLI 8RFTootekirjeldus inglise keeles: Hexa-ordinary Performance 8th Gen Intel® Core™ i7 ProcessorsTake a huge leap in performance with the 1st-ever Hexa Core notebook processors! Experience boosted gameplay and faster rendering by up to 40% with the extra cores. The more the merrier!GAME READYGEFORCE® GTX 10 Series.This is the ultimate gaming experience, fueled by the fastest performance, most advanced gaming technologies, and best gaming ecosystem.PERFORMANCEGeForce GTX 10-Series GPUs give you up to 3X the performance of previous-generation GPUs. They’re built with ultra-fast FinFET, the latest high-bandwidth memory technologies, and support for DirectX 12 features to deliver the fastest, smoothest gaming notebook experiences.IPS Level, True-to-Life Viewing ExperienceIPS level display with higher gamut of 72% NTSC color range takes image clarity to a whole new level with higher pixel resolution. Images are amazingly 40% more sharp and vivid in contrast level and 20% clearer in brightness level compared with those on regular TN panels. Hence, images are more vivid even from left and right side of the viewing angle. When you're playing games, you will have breathtaking and brilliantly true-to-life viewing experience.*This feature may vary by SKU and country.Best Surround Mode On GT Series Gaming NotebooksExpand the vision for extreme gaming experience. Embrace immersive gaming experience by expanding your gaming real estate across 3 external displays in 4K UHD resolution with the Latest Surround Mode technology.MSI GT series has innovative design of pure discrete graphics mode. The Matrix Display on GT series therefore supports up to 3 external 4K displays, 4 displays in total simultaneously through one HDMI (4K @ 60Hz) compatible port, one Mini DisplayPort 1.2 and one Thunderbolt 3* (Type-C port) plus the laptop built-in display. Multi-task is made possible even during competitive gameplays. Connect the laptop to HDTV display, Matrix Display supports 4K output with a resolution up to 3840 x 2160 @60Hz.MSI Matrix Display and Latest Surround Mode technologies create an ideal environment for extreme gaming experience and pleasant multimedia entertainment.*A Type-C to Mini DisplayPort cable is required.All New ID Design, 18.4” Gaming Monster with SLIInspired by ultimate weapon in Sci-Fi scenarios and the previous GT80, the design should give it a fluid look with feeling of light speed. The engineers refine every detailed component and enhance the mechanical materials while staying true to its extreme performance. The GT83 Titan SLI is no doubt the world's most powerful 18.4” SLI gaming notebook in the mobile market.True Color 2.0The Next-to-Perfect color presentationNothing is perfect, but closing in on perfection is as close as it gets. MSI True Color Technology, partnered with Portrait Displays, Inc. spawned a new height for the display technology. Each panel will undergo thorough examinations and an extensive factory calibration process so that each color is presented with the utmost precision in details, guaranteeing exceptional color fidelity of close to 100% sRGB. The 2.0 version offers better accuracy and compatibility, as well as intuitive user-friendly functions.Only everything in 3D!TriDef VR enables gamer to play their favorite games in 3D on your HMD(head mounted display). DirectX 9,10 and 11 games have been pre-configured to generate an optimal 3D experience using GenMe’s industry leading 2D-to-3D conversion technology. TriDef VR allows users to tweak their HMD to provide optimal user experience. It is compatible with both Oculus Rift and HTC Vive. It also offers an unique head tracked, hands-free user interface to allow users to launch games at will while wearing HMD.Most importantly, MSI offers a 3-month free license to let gamers to fully benefit from the TriDef and get more from their VR.8H Dragon ShieldDragon Spirit Designed with Corning® Gorilla® GlassPure, passionate, focused and persistent, these are characteristics of a professional gamer with iron will. In honor of these extraordinary people, the new Dragon Shield is covered with highly durable, damage resistant Vibrant Corning® Gorilla® Glass that will be inlaid on MSI gaming notebooks. Vibrant Corning Gorilla Glass offers photo-realistic quality images with resolution comparable to high quality prints on paper. It is a true tribute to the combination of MSI's powerful dragon spirit and MSI product - as beautiful and shiny as diamond.DDR4-2666 MEMORY - HIGHER BANDWIDTH FOR HIGHER WORKLOADGet the best possible performance out of your notebook with support of the advanced DDR4-2666 memory. With over 40% faster performance than previous gen DDR3, and up to 10% faster than DDR4-2400, it is the new laptop standard to take your extreme gaming experience to the next level.*OptionalCooler Boost Titan - Triple Fans with 15 Heat Pipes for Extreme SLI Graphics PlatformHeat is the most original element on earth. It’s pure physics that more energy will generate more heat. Cooling is therefore a knotty task to tackle with. Cooler Boost Titan consists of three enhanced fans. Two Whirlwind Blade with 29 blades plus one 23 blades fan for GPU and CPU increase 30% more airflow at same RPM. Independent thermal solution on both CPU and GPU with a total of 15 heat pipes make sure that the overclocked CPU keep its highest performance while maintaining the best SLI graphics output of the mobile platform.Dynamic Temperature / Performance BalancingThe exclusive MSI “SHIFT” technology pushes system to the extreme while minimizing noise and temperature. Switch between different profiles either push your system to the extreme or in the pursuit of longer battery life. Easily activate it by pressing the FN + F7 hotkey combo, or via the Dragon Center.One Port for Ultra Data Transfer, 4K Pixels and 5V/3A Device ChargingMSI is the first in the world to adopt the Thunderbolt 3 interface on its gaming notebooks. The latest and fastest interface Thunderbolt 3 supports up to 40Gbps data transfer rates and 4K displays with daisy chain capabilities. Its USB 3.1 ultra speed interface supports up to 5V and 3A current output for charging.MSI Notebooks with ESS Sabre HiFi are ready for High-Resolution AudioHigh-Resolution Audio refers to a collection of digital processes and formats that allow the encoding and playback of music using up to 6.5x higher sampling rates than the standards used in CDs. The most commonly used specifications of Hi-Res Audio are 24 bit/96 kHz (3.2x more data transmitted than CD) and 24 bit/192 kHz (6.5x more data transmitted than CD). While offering a sampling rate of 24 bit/192 kHz on GT73 and GS series models, MSI offers also the highest sampling rate standard, 32 bit/384 kHz (17.3x more data transmitted than CD), on its top level GT83 gaming notebook. MSI GT and GS series notebooks with ESS Sabre HiFi DAC are now the 1st in the world to be ready to broadcast any Hi-Res Audio with the highest quality.Sound by Dynaudio 4 + 1 Speaker System,2 Speakers for Each ChannelYears of cooperation between MSI and one of the world’s leading speaker manufacturers Dynaudio has led up to the finest sound system in series notebook. The true 4+1 speaker system, 2 speakers for each channel delivers an authentic sound experience you will not have heard previously in a notebook, you simply need to hear it to believe it. Power amplitude has gone up by 50% from previous generations, meaning a full 10dB volume increase. You will be able to enjoy your games or movies in a whole new way with the Dynaudio sound offered in serie notebook.All New Nahimic 3 - FOR NEXT LEVEL AUDIO IMMERSIONGet ready to be amazed by the all new Nahimic 3 and live the gaming immersion like never before! With simple and intuitive new UI, the Nahimic 3 not only further enhances in game 3D surround sound, but also offers even more finite control over your music, movies, and conference calls.Cherry MX Speed Silver Switches with RGB Multi-color BacklightingNot just being the first, this gaming notebook is also the only gaming notebook in the world to have a Cherry MX Speed Silver RGB Switches onboard. These Cherry’s new MX Speed switches have the best responsive and tactile feedback with a 1.2mm mechanical actuation, light operation 45g key switches and durability of Gold contact. Designed and made by MSI, this masterpiece is now capable of shining in the dark with multi-color RGB backlighting and allows you to click and clack even faster than ever before. Extreme gaming is no longer the purpose here, but the pursuit of the perfection of an art masterpiece.One Touch Switch between Touchpad & Numeric KeypadPacking the up-to-date touch pad with numeric keypad feature, the switch design is easy and simple. Just one touch, gamers can easily switch between these 2 functions.DRAGON CENTER 2.0 – FREE BUFF FOR YOUR RIGThe redesigned Dragon Center 2.0 takes optimization to a whole new level. Now it not only monitors but also optimizes system performance through various customizable profiles, and freeing up system memories to prioritize in-game performance.SteelSeries Engine 3 (SSE3) – Target, Position, Aim and FireDuring gameplay, SteelSeries Engines 3 serves as your firearm. With SSE3, you get to suit up your weapon with cool look by lightening it up with multiple backlit colors, transform your keyboard into a high technology firearm by setting up several keys into one key command and cloud syncing all SteelSeries gears together.*Keyboard backlit is red single color on GT80 and GS40 series and white single color on certain models of GE series.Killer DoubleShot Pro – Protecting Your PingStop losing games to lag with Killer DoubleShot Pro. Protect and prioritize networking traffic while preventing lag spikes so you can game without fear and play at your best. Select programs you want your network to prioritize to ensure maximum bandwidth and track your speeds with the easy-to-use Killer Networking Manager. Killer DoubleShot Pro consists of one Killer E2500 Gigabit Ethernet controller and one Killer Wireless-AC 1550 chipset and improves average latency by 3.5 times compared with those utilizing 802.11ac.Killer Shield – Smoother GameplayKiller Shield ensures smoother uploads and download processes. Lower latency and less jitter optimize gameplay experience. Less pin rate floating reassures more fluent gameplays.

Biotherm Biosource Purifying & Make-Up Removing MilkTootekirjeldus inglise keeles:This refreshing, delicately scented milk removes makeup and thoroughly cleanses the skin. It leaves skin clear and fresh.- Pure Extract of Thermal PlanktonTM- Glycerin- Seaweed extractApply with the fingertips or a cotton pad. Rinse with water or toner.

Biotherm Biosource Purifying & Make-Up Removing MilkTootekirjeldus inglise keeles:This refreshing, delicately scented milk removes makeup and thoroughly cleanses the skin. It leaves skin clear and fresh.- Pure Extract of Thermal PlanktonTM- Glycerin- Seaweed extractApply with the fingertips or a cotton pad. Rinse with water or toner.

Designed and engineered in co-operation with GIGABYTE®, this monoblock uses award winning EK-Supremacy EVO cooling engine to ensure best possible CPU cooling. This water block directly cools Intel LGA-1151 socket type CPU and power regulation (MOSFET) module as water flows directly over all critical areas. It is a very high flow water block that can be easily used with the system using weaker water pumps.Base of the monoblock is made of nickel-plated electrolytic copper while the top is made of quality POM Acetal material. The nickel plated brass screw-in standoffs are pre-installed and allow for easy installation.Unlike other solution on the market, this is a true one-piece, sturdy and reliable liquid cooling product which requires only two connector fittings for proper operation.The enclosed thermal pad is used on voltage regulator modules to improve cooling performance of the waterblock. For the CPU please use the enclosed (electrically non-conductive) thermal grease EK-TIM Ectotherm.OtstarveEmaplaatVentilaatorEiRadiaatorEiÜhilduv kiibikomplektIntel Z170Ühilduvad tootedGA-Z170X-UD5 THGA-Z170X-Gaming 7GA-Z170X-Gaming 5Lekkekaitse materjalVask

EK-FB GA Z170X Monoblock is a complete all-in-one (CPU and motherboard) liquid cooling solution for Intel LGA-1151 socket Skylake® CPU and the following GIGABYTE motherboards:-GA-Z170X-UD5 TH-GA-Z170X-Gaming 7-GA-Z170X-Gaming 5Designed and engineered in co-operation with GIGABYTE®, this monoblock uses award winning EK-Supremacy EVO cooling engine to ensure best possible CPU cooling. This water block directly cools Intel LGA-1151 socket type CPU and power regulation (MOSFET) module as water flows directly over all critical areas. It is a very high flow water block that can be easily used with the system using weaker water pumps.Base of the monoblock is made of nickel-plated electrolytic copper while the top is made of quality acrylic glass material. The nickel plated brass screw-in standoffs are pre-installed and allow for easy installation.Unlike other solution on the market, this is a true one-piece, sturdy and reliable liquid cooling product which requires only two connector fittings for proper operation.The enclosed thermal pad is used on voltage regulator modules to improve cooling performance of the waterblock. For the CPU please use the enclosed (electrically non-conductive) thermal grease EK-TIM Ectotherm.OtstarveEmaplaatVentilaatorEiRadiaatorEiÜhilduvad tootedGA-Z170X-UD5 TH, GA-Z170X-Gaming 7, GA-Z170X-Gaming 5

Designed and engineered in co-operation with ASUS®, this monoblock uses award winning EK-Supremacy EVO cooling engine to ensure best possible CPU cooling. This water block directly cools Intel LGA-2011-v3 socket type CPU and power regulation (MOSFET) module as water flows directly over all critical areas. It is a very high flow water block that can be easily used with the system using weaker water pumps.Base of the monoblock is made of nickel-plated electrolytic copper while the top is made of quality acrylic glass material. The nickel plated brass screw-in standoffs are pre-installed and allow for easy installation.Unlike other solution on the market, this is a true one-piece, sturdy and reliable liquid cooling product which requires only two connector fittings for proper operation.Enclosed thermal pad is used on voltage regulator modules to improve cooling performance of the waterblock. For the CPU please use the enclosed (electrically non-conductive) thermal grease EK-TIM Ectotherm.OtstarveEmaplaatVentilaatorEiRadiaatorEiÜhilduv kiibikomplektIntel X99Ühilduvad tootedASUS X99-A (USB3.1)ASUS X99-DELUXE (USB3.1)ASUS X99-PRO (USB3.1)ASUS X99-SLekkekaitse materjalVask

Efficient Thermal ConductivityThe Thermal Pad based on silicone and a special filler outperforms generic and performance pads by far.Filling the GapsDue to its low hardness and great compressibility, the thermal pad works as the perfect gap filler and bridges uneven surface and gaps without any problems.Easy to ApplyInstalling the ARCTIC Thermal Pad is child's play; perfect for beginners..Safe HandlingThe Pad does not contain any metallic particles, is electrically isolating and not capacitive. The handling is safe as contact with any electrical traces would not result in damage of any sort.Toote värvSinineMaterjalSilikoonLaius50 mmSügavus50 mmKõrgus0,5 mmKaal6 g

Backplate for founders edition and reference design RTX 2080 cards. Technical Details Dimensions: 263.8 x 96.4 x 4mm Material: Aluminium Polished chamfered edge Box Contents 9 x 1mm thermal pad 1 x 1.5mm thermal pad 11 x M2.5 x 10mm screw 11 x Red washer Please note: This backplate requires an XSPC Razor waterblock for installation and cannot be installed with the original heatsink.

Northwave Neoprene Long Gloves BlackTootekirjeldus inglise keeles: Thermal gloves made of windproof and strongly water-repellent NW4Pro material.+ Material: 55% Polyester, 45% Polyurethane+ Reinforced thumb+ Reflective elements+ Synthetic leather+ Shock-absorbing gel pad+ Silicone print+ Machine washable

Northwave Neoprene Long Gloves BlackTootekirjeldus inglise keeles: Thermal gloves made of windproof and strongly water-repellent NW4Pro material.+ Material: 55% Polyester, 45% Polyurethane+ Reinforced thumb+ Reflective elements+ Synthetic leather+ Shock-absorbing gel pad+ Silicone print+ Machine washable

Technical Data: Dimensions: 76 x 23,9 x 9,9 mm Material: Aluminium (Frontcover & Backplate), Stainless Steel (Mounting Clips) Color: Blue Compatibility: all single sided M.2 NVMe SSDs (22 mm wide & 80 mm long), M.2 (NGFF)/connection must have a height of 4,2 mm Scope of delivery: 1x EK-M.2 NVMe Heatsink front cover - blue, 1x EK-M.2 NVMe Heatsink backplate - black, Mounting Clips, 1x Thermal Pad 0,5mm, 1x Thermal Pad 1mm

PH-TC90LS, Phanteks’ new low profile single tower thermal radiator is designed using the latest in aerospace technology. By incorporating P.A.T.S and C.P.S.C Technology, PH-TC90LS’s cooling performance is increased and thermal conductivity is enhanced. With growing demands for cooling in constraint spaces, the PH-TC90LS has a slim profile and provides efficient cooling.Phanteks patented P.A.T.S (Physical Antioxidant Thermal Shield) technology dramatically increases the cooling performance and reliability of the PH-TC90LS by deflecting thermal radiation from other heat sources, such as GPU, South Bridge, North Bridge, and etc. In testing, P.A.T.S. display significantly good results in an enclosure and closed environment. P.A.T.S is environmentally friendly and non-toxic and is able to withstand temperatures of up to 200 degrees Celsius.Phanteks patented C.P.S.C (Cold Plasma Spraying Coating) Technology is a new innovative forming deposit that transfers heat onto corresponding metals at a more rapidly rate. With this technology, the PH-TC90LS enhances thermal conductivity on the soldered surfaces of the heat-pipes through the copper deposits.Ultra-low profile radiator, the PH-TC90LS is 43mm tall and compatible with small form factor case with a 45mm clearance. The three 6mm Heat-Pipes are aligned to ensure optimal cooling. The three copper heat-pipes are embedded for better contact and performance. The PH-TC90LS is made to ensure it has the least amount of air and thermal resistance. To prevent mechanical conflicts with other components, PH-TC90LS follow Intel’s Keep-Out-Zone (95x95mm) requirements.Phanteks PH-F90 PWM Premium fans uses UFB (Updraft Floating Balance) bearing, Nine blades and MAFO (Maelstrom Air-Fort Optimization) drive system to achieve massive airflow and perfect dynamic balance. The PH-F90 PWM fans with the support of the anti-acoustic rubber pad and rubber bar produces low level dB (A) and eliminates vibration. PH-F90 PWM fans provides a simple solution for quiet and smart fan control by adjusting fan speed according to the CPU load.PH-TC90LS only takes less than a minute to install. Thanks to the provided mounting kit, the PH-TC90LS only requires four screws and the rotational back plate for the Intel LGA 2011/1155/1156 to tightly secure it to the mainboard. By increasing the height of the rivets on the back plate, we designed the PH-TC90LS to avoid issues with other components (IC, E-SATA and etc...) that may be in the keep-out-zone and ensures the proper contact with CPU installation without bending the motherboard.Phanteks PH-NDC is made of high purity Nano diamond-like particles to improve the thermal conductance between components. The PH-NDC is a superb quality thermal compound for heat-sinks. Heat generated by CPUs will transfer to the heat-sinks without reduction in efficiency and resistance.SobilikProtsessorTüüpJahutiVentilaatori läbimõõt8 cmToetatud protsessoripesadLGA 1156 (Socket H),LGA 2011 (Socket R)Pöörlemiskiirus (min)1000 RPMPöörlemiskiirus (max)2500 RPMMüratase (aeglane kiirus)19 dBMüratase (suur kiirus)26 dBMinimaalne õhuvool11,53 cfmMaksimaalne õhuvool28,67 cfmMinimaalne õhusurve0,21 mmH2OMaksimaalne õhusurve1,34 mmH2OVentilaatorite arv1 ventilaator(id)Toote värvValgeMaterjalAlumiinium & vaskPinge12Laius95 mmSügavus95 mmKaal273 gVentilaatori mõõdud (laius x sügavus x kõrgus)92 x 92 x 15 mmVentilaatori kaal38 gJahutusradiaatori mõõtmed (laius x sügavus x kõrgus)95 x 95 x 27 mmJahutusradiaatori kaal235 gPakendi laius162 mmPakendi sügavus133 mmPakendi kõrgus106 mm

EK-DDC Heatsink Housing is an heatsink upgrade kit for any Laing DDC type water pump which replaces the original plastic housing. This add-on vastly improves the cooling performance of the motor and electronics and thus prolongs the lifespan of the water pump.Optimal heat transfer is ensured by the use of enclosed thermal pad pre-cut for your convenience. Due to it's metallic construction and finned design EK-DDC Heatsink Housing amplifies the effect of airflow therefore placing the water pump in front of any fan or radiator will dramatically improve the cooling performance.Additionally, cooling performance can further be improved by filling the cavities with lithium (electrically non-conductive) grease.This product is guaranteed to be compatible with any EK-DDC type water pump (EK-DDC X-TOP type) or water pump / reservoir combo unit with (EK-DDC X-RES type), including DDC BAY X-RES.EK-DDC Heatsink Housing is made from cast ZAMAK (zinc, aluminum, magnesium, copper) alloy and features nickel plated finish.This product also features vibration dampening rubber mounting system which effectively de-couples the water pump from the rest of the computer chassis.MaterjalPlast

Technical Data: Dimensions: 76 x 23,9 x 9,9 mm Material: Aluminium (Frontcover & Backplate), Stainless Steel (Mounting Clips) Color: Purple Compatibility: all single sided M.2 NVMe SSDs (22 mm wide & 80 mm long), M.2 (NGFF)/connection must have a height of 4,2 mm Scope of delivery: 1x EK-M.2 NVMe Heatsink front cover - purple, 1x EK-M.2 NVMe Heatsink backplate - black, Mounting Clips, 1x Thermal Pad 0,5mm, 1x Thermal Pad 1mm

This thermally conductive pad is ideally suited to be used with the kryoM.2 Adapter board (between adapter board and M.2 SSD module). It is made from soft, silicone based material. Technical Details Dimensions: ca. 70 x 20 x 1.8 mm Maximum gap to be filled: 1.8 mm Not electrically conductive Scope of delivery One thermally conductive pad

This thermally conductive pad is ideally suited to be used with the kryoM.2 Adapter board (between M.2 SSD module and passive heat sink or water block). It is made from soft, silicone based material. Technical Details Dimensions: ca. 70 x 20 x 1.0 mm Maximum gap to be filled: 1.0 mm Not electrically conductive Scope of delivery One thermally conductive pad

Thermaltake hiirematt Mousepad Gaming eSports M700 Extended 900x400x4 mm

Predator 15Don't get burned by the heat and pressure of hardcore gaming. Keep cool with advanced thermal technology.Keep CoolInject some Cooler Master cold to keep heat down and performance up. Swap in Predator FrostCore for intense gaming sessions.Kill LagWe could all use a little less lag. Take control of your internet connection with Killer DoubleShot ProTM.Killer DoubleShot ProTMWe could all use a little less lag. With Killer DoubleShotTM Pro technology, you choose which applications get to use your precious bandwidth. Even more importantly, you can split your internet requirements over wired and wireless connections simultaneously.DustDefenderKeep your rig clean and ensure crucial components run smoothly with Predator DustDefender. Alternating airflow directions and AeroBlade, an ultrathin 0.1mm all-metal fan with advanced aerodynamics, help stop dust from building up.FrontHard angles and aggressive accents were inspired by intergalactic battlecruisers.BackArchitecturally designed air exhaust vents ensure a bold look from any angle.Make It YoursPredatorSense software puts advanced gaming tweaks at your disposal for a unique gaming experience.PredatorSensePredatorSense gives you access to gaming features like keyboard macro profiles you can switch between in-game, and adjustable lighting configurations.Predator ProZonePredator ProZone Keyboard features superb accuracy, four customizable backlight zones and programmable macro profiles you can share with your team. A number pad and dedicated macro buttons give you the control you deserve.SoundPound 2.1Predator SoundPound 2.1 boasts two speakers, a powerful subwoofer and Dolby® Audio™ for deep sound immersion.Toote värvMustToote tüüpSülearvutiKujutegurKokkukäivEkraani diagonaal39,6 cm (15.6")Ekraani resolutsioon1920 x 1080 pikslitPuutetundlik ekraanEiLED-tagantvalgustusJahHD tüüpFull HD3D-ühilduvusEiKuvasuhe16:9Paneeli tüüpIPSProtsessori sagedus2,6 GHzProtsessori perekond6th gen Intel® Core™ i7Protsessori mudeli7-6700HQProtsessori võimendussagedus3,5 GHzProtsessorituumad4Protsessori harud8Süsteemi siinikiirus8 GT/sProtsessori vahemälu6 MBProtsessori pesaBGA 1440Protsessori vahemälu tüüpSmart CacheProtsessori litograafia14 nmProtsessori töörežiimid64-bitSteppingR0CardBusi tüüpDMI3Protsessori koodnimetusSkylakeJahutusvõimsus (TDP)45 WProtsessori seeriaIntel Core i7-6700 Mobile seriesFSB-paarsusEiPCI Ekspressi siinide maksimum arv16PCI Expressi pesade versioon3.0PCI Expressi konfiguratsioonid1x16,2x8,1x8+2x4Seadistatav TDP-alamväärtus35 WTjunction100 °CTõrkevaba protsessorJahProtsessori poolt toetatud ECCEiSisemälu16 GBSisemälu tüüpDDR4-SDRAMMaksimaalne sisemälu64 GBMälu (pesad x suurus)2 x 8 GBMälupesad4x SO-DIMMSalvestusmaht kokku2512 GBSalvestusseadeHDD+SSDIntegreeritud kaardilugejaJahInstallitud kõvaketaste arv1Kõvakettamaht2000 GBKõvaketta kiirus5400 RPMInstallitud SSD-de arv1Pooljuhtketta maht512 GBÜhilduvad mälukaardidSDIntegreeritud graafikaadapterJahDiskreetne graafikaadapterJahPardagraafika adapteri mudelIntel® HD Graphics 530Eraldiseisva graafika adapteri mudelNVIDIA GeForce GTX 980MSisemodemi graafikaadapteri perekondIntel® HD GraphicsIntegreeritud graafikaadapteri baassagedus350 MHzIntegreeritud graafikaadapteri dünaamiline sagedus1050 MHzIntegreeritud graafikakaardi maksimaalne mälu1,7 GBIntegreeritud graafikakaardi poolt toetatud monitoride arv3Eraldiseisva graafikakaardi mälu8 GBEraldiseisva graafika mälu tüüpGDDR5NVIDIA G-SYNCJahNVIDIA GameWorks VREiIntegreeritud graafikakaardi DirectX-i versioon12Integreeritud graafikakaardi OpenGL-i versioon4.4Integreeritud graafikakaardi ID0x191BGraafikaadapteri Open GL tugiJahSisseehitatud mikrofonJahEsikaameraJahOptilise seadme tüüpDVD Super MultiBluetoothJah3GEi4GEiWiFiJahWiFi-standardidIEEE 802.11acEthernet LANJahEthernet LAN-i andmeedastuskiirused10,100,1000 Mbit/sBluetoothi versioon4.1USB 3.0 (3.1 Gen 1) A-tüüpi portide hulk4HDMI-portide arv1DisplayPortide arv1USB 3.1 (3.1 Gen 2) C-tüüpi portide hulk1DVI-portEiEthernet LAN (RJ-45) pordid1Thunderbolt 3 portide hulk1Kombineeritud kõrvaklappide/mikrofoni pesaJahDokkimispistmikEiDC-pistikJahNumbriklaviatuurJahOsutamisseadePuuteplaatWindows-klahvJahKlaviatuuri taustavalgusJahInstallitud operatsioonisüsteemWindows 10 HomeOperatsioonisüsteemi arhitektuur64-bitIntel®i traadita ekraani (Intel® WiDi)JahIntel®i My WiFi tehnoloogia (Intel® MWT)JahIntel®i vargusvastane tehnoloogia (Intel® AT)EiIntel® Smart Response vastamissüsteemJahIntel®i identiteedi kaitse tehnoloogia (Intel® IPT)JahIntel®i vPro™ tehnoloogiaEiIntel®i hüper hargtöötlus tehnoloogia (Intel® HT Technology)JahIntel® Turbo Boost tehnoloogia2.0Intel®i Small Business Advantage (Intel® SBA)JahInteli täiustatud SpeedStep-tehnoloogiaJahIntel®i sisseehitatud Visuals-tehnoloogiaJahIntel®i HD-graafikaJahIntel®i Clear Video HD tehnoloogia (Intel® CVT HD)JahIntel®i Clear Video tehnoloogiaJahIntel® InTru™ 3D tehnoloogiaJahIntel® Insider™JahIntel® Quick Sync videotehnoloogiaJahIntel®i paindlik ligipääs mälule (Flex Memory Access)JahIntel®i tark vahemälu (Smart Cache)JahIntel®i AES uus juhend (Intel® AES-NI)JahIntel®i Trusted Execution tehnoloogiaJahIntel®i Enhanced Halt State tehnoloogiaJahIntel®i VT-x koos laiendatud lehetabelitega (EPT)JahIntel®i Demand Based Switching funktsioonEiIntel®i Secure Key tehnoloogiaJahIntel®i TSX-NI tehnoloogiaJahIntel®i Stable Image Platform Program (SIPP) funktsioonJahIntel® OS GuardJahIntel®i Software Guard Extensions (Intel® SGX) tarkvara1Intel®i Clear Video tehnoloogia mobiilsele internetiseadele (Intel® CVT for MID)JahIntel® 64JahExecute Disable BitJahOoterežiimJahTermojärelevalve tehnoloogiadJahProtsessori pakendi suurus42Toetatud instruktsioonikogumikudSSE4.1,SSE4.2,AVX 2.0Protsessori koodSR2FQCPU konfiguratsioon (maksimaalne)1LisavõimalusedEiGraafika & IMC-litograafia14 nmIntel®i Virtualization Technology Directed I/O seadmeleJahIntel®i Smart Response Technology versioon1.00Intel®i Stable Image Platform Program (SIPP) versioon0.00Intel®i Secure Key tehnoloogia versioon1.00Intel®i Small Business Advantage (SBA) versioon1.00Intel® TSX-NI versioon1.00Intel®i Virtualization-tehnoloogia (VT-X)JahIntel®i Dual Display Capable tehnoloogiaEiIntel®i painduva ekraani tehnoloogiaEiIntel®i Rapid Storage tehnoloogiaEiIntel®i kiire ligipääs mälule (Fast Memory Access)EiProtsessori ARK ID88967AkutehnoloogiaLiitiumioon (Li-Ion)Akuelementide arv8Aku mahutavus6000 mAhAC-adapteri toide180 WKaal3,6 kgLaius391 mmSügavus299,5 mmKõrgus38,5 mmKõrgus (esikülg)3,85 cmKõrgus(tagakülg)3,85 cmAC-adapter kaasa arvatudJah

Arctic Thermal Pad 120*20*1,5 pack of 2

Predator 15Don't get burned by the heat and pressure of hardcore gaming. Keep cool with advanced thermal technology.Keep CoolInject some Cooler Master cold to keep heat down and performance up. Swap in Predator FrostCore for intense gaming sessions.Killer DoubleShot ProWith Killer DoubleShot Pro technology, you choose which applications get to use your precious bandwidth. Even more importantly, you can use your wired and wireless connections simultaneously. BOOM. You just doubled your internet.Dust DefenderKeep your new rig nice and clean with Predator Dust Defender. Alternating airflow directions help stop dust from building up, which ensures crucial components will keep running smoothly.Kill LagWe could all use a little less lag. Take control of your internet connection with Killer DoubleShot Pro™.FrontHard angles and aggressive accents were inspired by intergalactic battlecruisers.BackArchitecturally designed air exhaust vents ensure a bold look from any angle.Predator ProZonePredator ProZone Keyboard features superb accuracy, four customizable backlight zones and programmable macro profiles you can share with your team. A number pad and dedicated macro buttons give you the control you deserve.PredatorSensePredatorSense gives you access to gaming features like keyboard macro profiles you can switch between in-game, and adjustable lighting configurations.SoundPound 2.1Predator SoundPound 2.1 boasts two speakers, a powerful subwoofer and Dolby® Audio™ for deep sound immersion.Toote värvMustToote tüüpSülearvutiKujutegurKokkukäivEkraani diagonaal39,6 cm (15.6")Ekraani resolutsioon1920 x 1080 pikslitPuutetundlik ekraanEiLED-tagantvalgustusJahHD tüüpFull HD3D-ühilduvusEiKuvasuhe16:9Protsessori sagedus2,8 GHzProtsessori perekond7th gen Intel® Core™ i7Protsessori mudeli7-7700HQProtsessori võimendussagedus3,8 GHzProtsessorituumad4Protsessori harud8Süsteemi siinikiirus8 GT/sProtsessori vahemälu6 MBProtsessori vahemälu tüüpSmart CacheProtsessori litograafia14 nmProtsessori töörežiimid64-bitCardBusi tüüpDMI3Protsessori koodnimetusKaby LakeJahutusvõimsus (TDP)45 WProtsessori seeriaIntel Core i7-7700 Mobile SeriesPCI Ekspressi siinide maksimum arv16PCI Expressi pesade versioon3.0PCI Expressi konfiguratsioonid1x16,1x8,2x4,2x8Tjunction100 °CTõrkevaba protsessorJahProtsessori poolt toetatud ECCEiSisemälu16 GBSisemälu tüüpDDR4-SDRAMMaksimaalne sisemälu64 GBMälupesad4x SO-DIMMSalvestusmaht kokku1512 GBSalvestusseadeHDD+SSDIntegreeritud kaardilugejaJahInstallitud kõvaketaste arv1Kõvakettamaht1000 GBInstallitud SSD-de arv1Pooljuhtketta maht512 GBÜhilduvad mälukaardidSDIntegreeritud graafikaadapterJahDiskreetne graafikaadapterJahPardagraafika adapteri mudelIntel HD Graphics 630Eraldiseisva graafika adapteri mudelNVIDIA GeForce GTX 1070Integreeritud graafikaadapteri baassagedus350 MHzIntegreeritud graafikaadapteri dünaamiline sagedus1100 MHzIntegreeritud graafikakaardi maksimaalne mälu64 GBIntegreeritud graafikakaardi poolt toetatud monitoride arv3Eraldiseisva graafikakaardi mälu8 GBInstalleeritud eraldiseisvate graafikakaartide arv1Integreeritud graafikakaardi DirectX-i versioon12.0Integreeritud graafikakaardi OpenGL-i versioon4.4Integreeritud graafikakaardi ID0x591BSisseehitatud mikrofonJahEsikaameraJahOptilise seadme tüüpDVD Super MultiBluetoothJah3GEi4GEiWiFiJahWiFi-standardidIEEE 802.11a,IEEE 802.11ac,IEEE 802.11b,IEEE 802.11g,IEEE 802.11nEthernet LANJahEthernet LAN-i andmeedastuskiirused10,100,1000 Mbit/sUSB 3.0 (3.1 Gen 1) A-tüüpi portide hulk4HDMI-portide arv1DisplayPortide arv1USB 3.1 (3.1 Gen 2) C-tüüpi portide hulk1DVI-portEiEthernet LAN (RJ-45) pordid1Kombineeritud kõrvaklappide/mikrofoni pesaJahDokkimispistmikEiDC-pistikJahNumbriklaviatuurJahOsutamisseadePuuteplaatWindows-klahvJahInstallitud operatsioonisüsteemWindows 10 HomeOperatsioonisüsteemi arhitektuur64-bitIntel®i traadita ekraani (Intel® WiDi)JahIntel®i My WiFi tehnoloogia (Intel® MWT)JahIntel® Smart Response vastamissüsteemJahIntel®i identiteedi kaitse tehnoloogia (Intel® IPT)JahIntel®i vPro™ tehnoloogiaEiIntel®i hüper hargtöötlus tehnoloogia (Intel® HT Technology)JahIntel® Turbo Boost tehnoloogia2.0Inteli täiustatud SpeedStep-tehnoloogiaJahIntel®i Clear Video HD tehnoloogia (Intel® CVT HD)JahIntel®i Clear Video tehnoloogiaJahIntel® InTru™ 3D tehnoloogiaJahIntel® Quick Sync videotehnoloogiaJahIntel®i paindlik ligipääs mälule (Flex Memory Access)JahIntel®i tark vahemälu (Smart Cache)JahIntel®i AES uus juhend (Intel® AES-NI)JahIntel®i Trusted Execution tehnoloogiaEiIntel®i Enhanced Halt State tehnoloogiaJahIntel®i VT-x koos laiendatud lehetabelitega (EPT)JahIntel®i Secure Key tehnoloogiaJahIntel®i TSX-NI tehnoloogiaEiIntel®i Stable Image Platform Program (SIPP) funktsioonEiIntel® OS GuardJahIntel®i Software Guard Extensions (Intel® SGX) tarkvaraJahIntel®i Clear Video tehnoloogia mobiilsele internetiseadele (Intel® CVT for MID)JahIntel® 64JahExecute Disable BitJahOoterežiimJahTermojärelevalve tehnoloogiadJahProtsessori pakendi suurus42 x 28Toetatud instruktsioonikogumikudAVX 2.0,SSE4.1,SSE4.2CPU konfiguratsioon (maksimaalne)1LisavõimalusedEiGraafika & IMC-litograafia14 nmIntel®i Virtualization Technology Directed I/O seadmeleJahIntel®i Virtualization-tehnoloogia (VT-X)JahProtsessori ARK ID97185AkutehnoloogiaLiitiumioon (Li-Ion)Akuelementide arv8SõrmejäljelugejaEiKaal3,7 kgLaius391 mmSügavus299,5 mmKõrgus38,5 mmKõrgus (esikülg)3,85 cmKõrgus(tagakülg)3,85 cmKaablid kaasa arvatudVahelduvvoolAC-adapter kaasa arvatudJah

Arctic Thermal Pad 120*20*1,5

EK Water Blocks Thermal Pad E 2.0mmThermal Pads are a real alternative to traditional thermal grease for many applications. The Thermal Pads offer some advantages over liquid or viscous materials. This makes it easy to cut the pads themselves to the required size, eliminating the uncertainty of applying paste or smearing during smoothing. The EK Water Blocks pad offered here is already pre-cut into eight smaller pieces, slightly self-adhesive, and usually initially holds itself in the previously assigned position.Of course, the fixation in the further course of assembly can not be completely dispensed with, since heat source, thermal pad and heatsink (or the heat delivery surface) should come into contact with as large a surface area as possible in order to ensure optimum heat transfer. Here, too, comes EKWB the user maximum by the 100 x 16 mm large, blue pad in several strengths is available, the version offered here is 2.0 mm thick. In addition, the material is pleasantly flexible and adaptable, which makes it useful in many places.To mention just a few application examples: in RAM water coolers, alternative graphics card coolers, chipset coolers and many other components, where it is important to effectively dissipate waste heat (eg on cooling fins, heatpipes, radiators, heatsinks, etc.). Since the EKWB heat-conducting pads do not conduct electricity, there are virtually no limits to the imagination of most electronic components. On the other hand, the pads with a high thermal conductivity of 3.5 W / (m · K) make some thermal grease look old. The pads here are ideally suited for the chip sets of a memory module, since the strip, which measures 100 x 16 mm in total, has already been cut into eight smaller pieces of 12.5 x 16 mm each. Note:The application is at your own risk! Caseking assumes no liability for damage caused by improper use or use in unsuitable fields of application. A sufficiently high heat transfer should be carefully checked after installation! Technical details:Dimensions (total): 100 × 16 mm (L x W)Dimensions: (single): 12.5 x 16 mm (L x W)Thickness: 2.0 mmNumber: 1 strip (pre-cut into eight smaller pieces)Thermal conductivity: 3.5 W / (m · K)Operating temperature: -55 to +200 ° C

Due to the new Alphacool D-RAM modules all memory blocks can easily and quickly be equipped with water coolers! A fight against the underrated heat source "memory" has been announced with the new system of the Alphacool D-RAM coolers . With these modules, the memory blocks are clamped in the modules (with the attached thermal pads) to achieve optimum cooling results . The seperately available D-RAM coolers are added and screwed in at the required siz after successfull assembly. We recommend a very thin layer of thermal paste applied between module and cooler for an optimal heat transfer. Note: A thicker thermal pad must be used on one side for single-sided memory blocks which is not included and has to be bought seperately. Scope of delivery: 2x modul for D-RAM 4x thermal pads fitting accessories Download 3D-file (.stp)

Alphacool’s answer to the often difficult situation of being unable to mount the heatsink conventionally. With this double-sided thermal adhesive pad from Alphacool it is possible to mount a heatsink at any desired spot without having to worry about mounts, hole spacing or other constructive details. This is especially interesting for systems such as Alphacool’s MCX system to allow mounting of heatsinks for graphics cards or Mainboards. But long-term testing shows that these pads are capable of much more than just holding small heatsinks! A holding power of at least 16N/25mm means an adhesive force greater than with some duct tapes! This allows mounting even of heavy coolers and the capability to deal with shocks from transport or twisting/ permanent pressure. But the engineers at Alphacool also paid attention to the thermal conductivity aspect. Different from the first adhesive pads on the market, which were rather insulation than thermal conductor, these pads transfer the heat with a thermal conductivity of up to 1W/mK The pads are covered with a protective foil on both sides when shipped. When this foil is pulled off, the white pad becomes visible. The pad feels very similar to rubber, and has the same advantages: It adapts to the surfaces easily, hence allowing the best possible heat transfer. Multiple pre-cut dimensions make cutting almost obsolete, but should it be needed to adjust the size of a pad, simply use scissors or a knife! Technical specifications: Material: Polymers Colour: White Dimensions (L x W x H):100x100x0,5mm Thermal conductivity: Up to 1W/mk Adhesive strength: min: 16N/25mm electrically non-conductive conforms with ROHS Extent of delivery: 1x Alphacool double-sided thermal adhesive pad 100x100x0,5mm

self-adhesive thermal pad for HDDs Dimendions ca.: 100 x 150 x 0,25mm

Mounted on an poweradjust 3 controller, this passive heat sink improves heat dissipation and thereby increases the maximum power output of the fan channel. Scope of delivery: Aluminum heat sink for poweradjust 3 Thermally conductive pad Mounting material Compatible with: poweradjust 3 (52247/52246) Please note: poweradjust 3 is not included in delivery! Not compatible with bezel sets 52179/52183!

Alphacool’s answer to the often difficult situation of being unable to mount the heatsink conventionally. With this double-sided thermal adhesive pad from Alphacool it is possible to mount a heatsink at any desired spot without having to worry about mounts, hole spacing or other constructive details. This is especially interesting for systems such as Alphacool’s MCX system to allow mounting of heatsinks for graphics cards or Mainboards. But long-term testing shows that these pads are capable of much more than just holding small heatsinks! A holding power of at least 16N/25mm means an adhesive force greater than with some duct tapes! This allows mounting even of heavy coolers and the capability to deal with shocks from transport or twisting/ permanent pressure. But the engineers at Alphacool also paid attention to the thermal conductivity aspect. Different from the first adhesive pads on the market, which were rather insulation than thermal conductor, these pads transfer the heat with a thermal conductivity of up to 1W/mK The pads are covered with a protective foil on both sides when shipped. When this foil is pulled off, the white pad becomes visible. The pad feels very similar to rubber, and has the same advantages: It adapts to the surfaces easily, hence allowing the best possible heat transfer. Multiple pre-cut dimensions make cutting almost obsolete, but should it be needed to adjust the size of a pad, simply use scissors or a knife! Technical specifications: Material: Polymers Colour: White Dimensions (L x W x H):15x15x0,5mm Thermal conductivity: Up to 1W/mk Adhesive strength: min: 16N/25mm electrically non-conductive conforms with ROHS Extent of delivery: 1x Alphacool double-sided thermal adhesive pad 15x15x0,5mm

Alphacool’s answer to the often difficult situation of being unable to mount the heatsink conventionally. With this double-sided thermal adhesive pad from Alphacool it is possible to mount a heatsink at any desired spot without having to worry about mounts, hole spacing or other constructive details. This is especially interesting for systems such as Alphacool’s MCX system to allow mounting of heatsinks for graphics cards or Mainboards. But long-term testing shows that these pads are capable of much more than just holding small heatsinks! A holding power of at least 16N/25mm means an adhesive force greater than with some duct tapes! This allows mounting even of heavy coolers and the capability to deal with shocks from transport or twisting/ permanent pressure. But the engineers at Alphacool also paid attention to the thermal conductivity aspect. Different from the first adhesive pads on the market, which were rather insulation than thermal conductor, these pads transfer the heat with a thermal conductivity of up to 1W/mK The pads are covered with a protective foil on both sides when shipped. When this foil is pulled off, the white pad becomes visible. The pad feels very similar to rubber, and has the same advantages: It adapts to the surfaces easily, hence allowing the best possible heat transfer. Multiple pre-cut dimensions make cutting almost obsolete, but should it be needed to adjust the size of a pad, simply use scissors or a knife! Technical specifications: Material: Polymers Colour: White Dimensions (L x W x H):30x30x0,5mm Thermal conductivity: Up to 1W/mk Adhesive strength: min: 16N/25mm electrically non-conductive conforms with ROHS Extent of delivery: 1x Alphacool double-sided thermal adhesive pad 30x30x0,5mm

Alphacool’s answer to the often difficult situation of being unable to mount the heatsink conventionally. With this double-sided thermal adhesive pad from Alphacool it is possible to mount a heatsink at any desired spot without having to worry about mounts, hole spacing or other constructive details. This is especially interesting for systems such as Alphacool’s MCX system to allow mounting of heatsinks for graphics cards or Mainboards. But long-term testing shows that these pads are capable of much more than just holding small heatsinks! A holding power of at least 16N/25mm means an adhesive force greater than with some duct tapes! This allows mounting even of heavy coolers and the capability to deal with shocks from transport or twisting/ permanent pressure. But the engineers at Alphacool also paid attention to the thermal conductivity aspect. Different from the first adhesive pads on the market, which were rather insulation than thermal conductor, these pads transfer the heat with a thermal conductivity of up to 1W/mK The pads are covered with a protective foil on both sides when shipped. When this foil is pulled off, the white pad becomes visible. The pad feels very similar to rubber, and has the same advantages: It adapts to the surfaces easily, hence allowing the best possible heat transfer. Multiple pre-cut dimensions make cutting almost obsolete, but should it be needed to adjust the size of a pad, simply use scissors or a knife! Technical specifications: Material: Polymers Colour: White Dimensions (L x W x H):120x20x0,5mm Thermal conductivity: Up to 1W/mk Adhesive strength: min: 16N/25mm electrically non-conductive conforms with ROHS Extent of delivery: 1x Alphacool double-sided thermal adhesive pad 120x20x0,5mm

Mounted on an poweradjust 3 controller, this passive heat sink improves heat dissipation and thereby increases the maximum power output of the fan channel. Scope of delivery: Aluminum heat sink for poweradjust 3 Thermally conductive pad Mounting material Compatible with: poweradjust 3 (52247/52246) Please note: poweradjust 3 is not included in delivery! Not compatible with bezel sets 52179/52183!