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PC4-21300 DDR4 2666MHz CL19 (19-19-19)

DDR4 2666MHz

ECC UDIMM, Solo

HP 13L74AA. Komponent: Sülearvuti, Sisemälu: 16 GB, Mälu paigutus (moodulid x suurus): 1 x 16 GB, Sisemälu tüüp: DDR4, Mälu taktsagedus: 3200 MHz

Sodimm for G7, Inspiron 5406 2-in-1, Latitude 53XX 2-in-1, 5400, 5520, Opti

DIMM 1RX4 HYNIX D RAMBUS

32 GB, DDR4, 3200MHz, ECC, CL22, X8, 1.2V, Registered, DIMM, 288-pin

DDR4 2133MHz CL15

DDR4 3200MHz(PC4-25600) CAS Latency 16 TRCD: 18 TRP: 18 Memory Features: Two DDR Channels Compliant Devices 1.2 V Maksimum toitepinge: 1.35 V

Viper Elite II 32GB DDR4 3200MHz (2x16GB) CL18

DDR4 3200MHz CL16

DDR4 3200 CL22

DDR4 3200 CL22

DDR4 3200MHz CL16

DDR5 4800MHz SO-DIMM

DDR4 2400

DDR4 3200 SODIMM Micron

DDR4 3200 SODIMM Micron

DDR4 3200 ECC CL22 SODIMM 1RX8 HYNIX C

DDR5 6200MHz CL32

DDR4 3200MHz CL22 SO-DIMM

DDR5 5600MHz CL46

DDR5 7400MHz CL32

DDR4 3200MHz

DDR5 4800 MHz, 1Rx8, Single Rank x8 CAS-40-39-39 ECC Registered Smart Memory Kit

DDR4 3200MHz SO-DIMM

DDR4 3600MHz CL18

Dell Memory - 16GB - 1Rx8 DDR4 UDIMM 3200MHz ECC SNS

DDR5 6400MHz CL32

DDR5 6800MHz CL40

32GB DDR4 3200MHz, Mälu kujutegur: 260-pin SO-DIMM

Lenovo ThinkPad 8GB DDR5 5600MHz SoDIMM Memory

DDR5 6200MHz CL42

DDR5 5600MHz CL40

DDR5 6000MHz CL48

32 GB DDR5 4800 MHz

T-Force Vulcan Z's cooling module is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by punch press process, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive. Moreover, with superconductivity - thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the gaming memory can be maintained within operating temperature, and offering a smooth gaming experience and an extreme performance without any lag.