Otsing: thermal pad

Product Details: Thermal Grizzly - Pro TG Putty Pro is a non-electrically conductive alternative to traditional thermal pads. This easy-to-apply and flexible material serves as a "gap filler," effectively compensating for height differences. It is an ideal replacement for thermal pads on graphics cards, where different pad thicknesses are typically used. When replacing pads or upgrading to a GPU water block, multiple thermal pad sizes are usually required. TG Putty can be applied using the included spatulas or by hand (gloves recommended). The spatula allows for smooth, even application over larger areas, while alternatively, the putty can be shaped into small beads that precisely fit components such as VRAM or SMDs. TG Putty can compensate for height differences ranging from 0.2 mm to 3.0 mm. Available Variants:TG Putty comes in three versions, each offering different levels of thermal conductivity: TG Putty Basic – Medium thermal conductivity TG Putty Advance – Good thermal conductivity TG Putty Pro – High thermal conductivity For upgrading a smaller graphics card without an active backplate (e.g., GeForce GTX 1060), a single 30g jar of TG Putty is usually sufficient. For larger models, such as the GeForce RTX 4090, one 30g jar typically covers the memory (VRAM) and voltage regulators (VRM) on the front side. Since high-end graphics cards often have a uniform gap between the PCB and the backplate, fully filling this space may require two 30g jars. Important Notes: TG Putty is not suitable for direct application on processors (IHS or Direct Die) or GPU chips. Before applying, ensure that the target surface is thoroughly cleaned and degreased using TG Cleaning Wipes or standard isopropanol. Package Contents: 1x TG Putty Pro 3x Spatulas

Polychrome SYNC Create your own unique colorful light effects. With the integrated ARGB LEDs, you can create your own unique colorful light effects which can also be switched on and off. It can also be synchronized with your ASRock motherboards that support Polychrome SYNC. LED Switch & ARGB Header LED Switch You can quickly and easily switch on/off the ARGB LEDs that are equipped with not only your graphics card but also the connected ARGB devices. ARGB Header With the ARGB Header, it can connect extra ARGB strips/devices to make the lighting effects more rich and vivid. Triple Fan Design Triple fan design helps to optimize system cooling to reduce the operating temperature. Stylish Metal Backplate Solid, Fancy, Cool. Designed to avoid PCB bending. The fancy outlook makes the graphic card more legendary in visual. It also helps to enhance cooling with the premium thermal pads equipped backside. Reinforced Metal Frame Be solid. No sag. Enhances the structure to prevent the PCB from being bent. Striped Ring Fan Designed For Enhanced Airflow ASRock’s all new Striped Ring Fan get more lateral intake and to provide better airflow through the cooling array. 0dB Silent Cooling Spin For Cooling, Stop For Silence. The fan spins when the temperature goes high for the optimal cooling, and stops when the temperature goes low for the complete silence. Air Deflecting Fin Guide Airflow to Go Through Regularly & Quickly. Guide the airflow to go more regularly and quickly to enhance the cooling efficiency by the V-shaped cutting fins and the V-shaped air vents. Ultra-fit Heatpipe Consolidated to Maximize the Contact. The heatpipes are consolidated to maximize the contact among each others and also the GPU baseplate for the optimized heat dissipation. Nickel-plated Copper Base Maximize GPU Contact Area. With premium copper base heatsink design, the direct contact area to the GPU would be maximized to improve thermal transfer effectively. High-density Metal Welding Improve Heat Dissipation. Effectively isolate all coverage of the gap between pipe and stacked fins, hence improve heat dissipation effectively. SP-Cap With a high conductive polymer as the electrolyte, it has a lower equivalent series resistance (ESR) to provide outstanding electrical characteristics. In addition to that, it also has excellence in product operational life, reliability and heat resistance. Dr. MOS Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Intelligently delivering higher current, thus providing improved thermal result and superior performance. Premium Power Choke Compared to traditional chokes, ASRock’s premium power chokes effectively make the saturation current up to three times better, thus providing enhanced and improved Vcore voltage to the graphics card. 2oz Copper PCB Using only carefully selected copper materials for PCB layers, 2oz Copper PCB delivers lower temperature and higher energy efficiency for overclocking. Matte Black PCB A new mysterious matte black and copper color scheme to match the prestigious components on ASRock's high-end graphics card. High Density Glass Fabric PCB High Density Glass Fabric PCB design that reduces the gaps between the PCB layers to protect the graphics card against electrical shorts caused by humidity. Premium Thermal Pad Better Heat Transfer. The premium thermal pad helps to transfer the heat of the components to the heatsink, improving heat dissipation. Precise Screw Torque Optimized Mounting Pressure. ASRock adopts precise screw torque when assembling its graphics cards to optimize the cooler mounting pressure to improve thermal efficiency while avoiding damage to GPU die. SUPERPOWERED VISUALS ENHANCED WITH AI Get immersed in the action of lifelike visuals with next-gen raytracing. Play in perfect clarity with higher quality, AI-powered AMD FidelityFX™ Super Resolution 4 image upscaling with advanced frame generation in supported games. Put your skills on full display with enhanced multimedia and streaming experiences with the AMD Radiance Display™ Engine. FUTURE READY TECH WITH AI AMD Radeon™ delivers all you need to keep your system feeling fast for years to come. Pair it with AMD Ryzen™ 9000 series processors featuring PCI Express® Gen 5 support and the latest AMD Smart Access Memory™ technology to realize the full performance of your AM5 platform. Harness both Radeon and Ryzen AI-enabled technologies, and upgrade to next generation displays with DisplayPort™ 2.1 support and up to 16GB of video memory to experience AAA games in all their visual glory now and for years to come. Polychrome SYNC Triple Fan Design Stylish Metal Backplate Striped Ring Fan Reinforced Metal Frame Air Deflecting Fin Ultra-fit Heatpipe Super Alloy Graphics Card

The high performance thermal pads of the Thermal Grizzly Minus Pad series feature a highly elastic and flexible surface with very high thermal conductivity, perfectly compensating even the smallest gaps between components. They are available in various sizes and thicknesses. High thermal conductivity High compressibility Electrical insulation The easy-to-process and flexible Minus Pads are made from different compounds, based on a complex ceramic silicone formula and nano aluminum oxide. This ensures a constant, optimal heat transfer. They can be attached optimally with the lightest touch. All pads are eco-friendly and RoHS-compliant. Technical Data Dimensions: 120 x 20 x 3mm Temperature Range: -100°C / +250°C

Thermal pad with excellent thermal conductivity, suitable for high-performance hardware, does not harden, electrically non-conductiveWith the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals who demand maximum cooling performance combined with high flexibility and user-friendliness.Optimized material blend for efficient heat transferSoft consistency to perfectly conform to component surfacesThermal material does not cureSafe installation thanks to electrically insulating propertiesIdeal for high-end hardware and overclockersNew materials for improved heat dissipationThe Minus Pad Extreme 2 utilizes an innovative combination of aluminum oxide, hydroxide, and powder. Varying particle sizes reliably fill even the smallest gaps with thermal material, ensuring uniform and effective dissipation of excess heat.Softer, more flexible, and adaptableCompared to its predecessor, the new pad is softer, allowing it to adapt even better to uneven surfaces. This flexibility lowers thermal resistance and ensures more consistent heat transfer—all without curing or waiting periods.Reliable performance for demanding applicationsWhether in overclocking or compact builds with tight contact between cooler and component, the Minus Pad Extreme 2 offers a safe, durable solution that is easy to apply. Its electrical non-conductivity also enhances safety during installation.

With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is designed for enthusiasts and professionals seeking maximum cooling performance, combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing required for the thermal material Safe installation due to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for uniform and effective dissipation of excess heat. Softer, more flexible, and adaptable Compared to its predecessor, the new pad is softer and therefore adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more consistent heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and components, the Minus Pad Extreme 2 offers a safe, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.

With the Minus Pad Extreme 2, Thermal Grizzly introduces the next generation of its high-performance thermal pads. It is aimed at enthusiasts and professionals seeking maximum cooling performance combined with high flexibility and ease of use. Optimized material blend for efficient heat transfer Soft consistency for perfect adaptation to component surfaces No curing of the thermal material Secure installation thanks to electrically insulating properties Ideal for high-end hardware and overclockers New materials for improved heat conduction The Minus Pad Extreme 2 uses an innovative combination of aluminum oxide, hydroxide, and powder. Various particle sizes ensure even the smallest gaps are reliably filled with thermal material—for consistent and effective dissipation of excess heat. Softer, more flexible and adaptable Compared to its predecessor, the new pad is softer and thus adapts even better to uneven surfaces. This flexibility reduces thermal resistance and ensures more uniform heat transfer—all without curing or waiting times. Reliable performance for demanding applications Whether in overclocking or compact builds with tight contact between cooler and component—the Minus Pad Extreme 2 offers a secure, durable solution with easy application. Its electrical non-conductivity also enhances safety during installation.

Primed for Power Experience Primal performance with the Prime GeForce RTX 5080, an SFF-Ready Enthusiast GeForce Card featuring a 2.5-slot design for expansive compatibility, enhanced by a triple-fan setup for supreme airflow and vapor chamber design for supreme cooling.SFF-Ready 2.5 Slot Design: Compatible with small-form-factor buildsAxial-Tech Fans: Longer blades improve airflow and dispersionPhase-Change GPU Thermal Pad: Optimal heat dissipation for GPU longevityVapor Chamber: Efficient heat transfer for lower GPU tempsDual-Ball Fan Bearings: Up to twice the lifespan of sleeve bearingsDual BIOS: Toggle between Performance or Quiet modesGPU Tweak III: Ultimate GPU tuning utilityMuseTree: Grow your dreams with AI magicPerfect PSU Companion: ROG Strix Platinum 1000WGeForce RTX 50 Series GPUs deliver game-changing performance, power transformative AI experiences, and enable creators to complete workflows in record time. RTX IT'S' ON, DLSS 4, Ray Tracing, Reflex 2, AI PC, NVIDIA Studio

Dimensions: 100 x 100 x 1,0mm Thermal conductivity: 8.0 W/mk Temperature range: -100°C / +250°C Maximum bridgeable gap: 1,0 mm Muu info: Ei juhi elektrit.